AblePrint Technology (APT), which has long focused on semiconductor packaging and offers pneumatic and thermal process solutions, has opened a new plant in Hsinchu, northern Taiwan,...
Long-term prospects are bright for advanced packaging technology, thanks to robust demand for AI and HPC chips, according to sources at backend houses.
According to sources at IC packaging material distributors, advanced packaging and heterogeneous integration are driving demand for high-end materials.
TSMC continues to expand its CoWoS packaging capacity despite recent market rumors suggesting Nvidia has scaled back its orders with the foundry for 2024, according to industry sou...
China's semiconductor firms in the IC packaging & testing, equipment, foundry, and IC design industries performed much better than their IDM, materials, optoelectronics, and memory...
Marking the beginning of 2024, DIGITIMES Asia compiled the list of the top 100 semiconductor companies based on their market values in dollar terms at the end of 2023. The median...
Everlight Electronics expects its compound semiconductor packaging and testing business to enjoy robust growth in 2024, according to the LED packaging house. It expects related orders...
OSAT Advanced Semiconductor Engineering (ASE) will acquire facilities from its fully-owned subsidiary ASE Test to boost packaging capacity, according to the former's parent company,...
Industry sources indicate that Taiwan-based panel maker Innolux has received orders occupying the entire capacity of its first-phase chip-first advanced fan-out panel level packaging...
Taiwan's flexible copper clad laminate (FCCL) supplier Taiflex Scientific, and microwave RF communication substrate and PCB maker New Era Electronics, are both optimistic about the...
Over the past two years, due to the pandemic's impact on supply chains and instability factors like the Russia-Ukraine war and US-China tensions, chipmakers have taken actions to...
Winbond Electronics, a Taiwan-based memory chipmaker, has signed a letter of intent to collaborate with OSAT Powertech Technology (PTI) to jointly develop 2.5D and 3D advanced packaging,...
