Advanced Semiconductor Engineering (ASE) has announced its latest fan-out-chip-on-substrate-bridge (FOCoS-Bridge) technology innovation, which involved qualifying a large 70x78mm...
Semiconductor Manufacturing International Corp. (SMIC), the leading chip foundry company in China, is missing out on the opportunity brought by chiplet technologies, as Beijing Municipal...
Jiangsu Changjiang Electronics Technology (JCET), the largest China-based OSAT company, is gearing up for a surge in demand for automotive and chiplet solutions with its expanding...
While the Intel-initiated Universal Chiplet Interconnect Express (UCIe) consortium has attracted many participants, Japan's academic and industry players are also stepping up efforts...
Intel has announced delivery of the first multi-chip package (MCP) prototypes created under the state-of-the-art heterogeneous integrated packaging (SHIP) program.
Nvidia is expected to use TSMC's 3D SoIC (system on integrated chips) stacking and chiplet packaging technology in its high-end processors set to debut between 2024 and 2025, according...
Jiangsu Changjiang Electronics Technology (JCET), the largest China-based OSAT company, has reported revenue and net profits for 2022 both hit record highs of CNY33.76 billion (US$4.91...
As China is getting isolated as a result of the US technological containment, China has come up with an indigenous interconnected interface for chiplet as Moore's law seems to approach...
Winbond has joined the UCIe (Universal Chiplet Interconnect Express) Consortium. The open industry standard defines interconnect between chiplets within a package, enabling an open...
Foxconn Technology's (Hon Hai Precision Industry) latest announcement to invite Shang-Yi Chiang, TSMC veteran and former SMIC executive, as the chief strategy officer of its semiconductor...
Founded in 2018, California-based company Ventana Micro Systems has taken steps to bring the open-source instruction set architecture RISC-V into the data center market. The effort...
Though TSMC is building advanced wafer fabs in the US, Taiwanese OSAT companies still have concerns about constructing facilities there to provide cutting-edge packaging services...
Chiplet interconnect startup Eliyan Corporation, based in Califronia, has raised US$40 million Series A funding, backed by four investors including Intel Capital and Micron Ventures...
As the semiconductor industry once again frets over the future of Moore's Law, the notion of chiplets has gained traction, especially as the technology has come to be prominently...
According to Intel, the company has joined the US Defense Advanced Research Projects Agency (DARPA) for the Phase 1 of its Spaced-Based Adaptive Communications Node (Space-BACN) program,...
