Chiplet technology is being embraced as a major semiconductor trend as Moore's Law slows down, but there are still many challenges during the design process.
Advanced Semiconductor Engineering (ASE), a member of ASE Technology Holding, has announced the expansion of its advanced interconnect technology on the VIPack platform. This development...
Amidst the rapid advancement in AI chip development, emerging technologies like chiplets are making semiconductor backend processes more intricate. As a result, the prices and profit...
Samsung Electronics and Intel have long competed with each other for first place in the fierce global semiconductor IDM market, and a fierce battle for orders and rankings has begun...
The global chiplets market is forecast to be worth around US$107 billion by 2033, up from US$3.1 billion in 2023, with a CAGR of 42.5% between 2024 and 2033. It is projected to be...
TSMC and Samsung Electronics are gearing up for a chiplet mass production race. Both industry giants are set to materialize the commercialization of UCIe (Universal Chiplet Interconnect...
The Institute of Computing Technology of the Chinese Academy of Sciences recently published a paper in the journal Fundamental Research introducing their "Big Chip" archit...
Twelve Japanese automakers, component manufacturers, and semiconductor companies have formed an alliance for the research and development of advanced automotive chips, aiming to produce...
The Industrial Base Analysis and Sustainment (IBAS) office, funded by the US Department of Defense to establish high-priority domestic capabilities to safeguard the US defense industrial...
Industry suppliers are generally optimistic about Ajinomoto Build-up Film (ABF) substrate market prospects for 2024 and 2025, citing the recovery of the PC market, a growing demand...
At the recently concluded 2023 China International Semiconductor Summit held in Shanghai, senior executives from JCET and TSMC both emphasized the role of advanced packaging, yet...
