Thursday 30 November 2023
IC backend houses see promising chiplet demand
Despite short-term headwinds, IC backend companies are generally positive about long-term demand for chiplet devices.
Friday 24 November 2023
TSMC and JCET expressed contrasting views on chiplet development
At the recently concluded 2023 China International Semiconductor Summit held in Shanghai, senior executives from JCET and TSMC both emphasized the role of advanced packaging, yet...
Friday 24 November 2023
WinWay says outlook for 2H24 is very optimistic
IC testing interface specialist WinWay Technology is full steam ahead with new products, holding a "very optimistic" outlook for the second half of 2024, according to the Taiwan-based...
Tuesday 14 November 2023
Chinese CPU developer planning shift to 7nm process manufacturing
China government-supported chipmaker Loongson has begun research on its CPU product line entering the next-generation 7nm technology, with development beginning in 2024, according...
Thursday 2 November 2023
Heterogeneous integration and system-level integration seen as 'next step' in advanced packaging era
With TSMC's CoWoS and the 2.5D advanced packaging from OSAT companies becoming a hot topic due to capacity shortages, advanced packaging solutions are seen as the next big thing.
Wednesday 1 November 2023
UMC launches 3D IC project in collaboration with partners
United Microelectronics (UMC) has launched a wafer-to-wafer (W2W) 3D IC project with partners including Advanced Semiconductor Engineering, Cadence, Faraday Technology, and Winbond...
Friday 27 October 2023
Latest US sanctions drive China to review chiplet capabilities as the way forward
Following the US sanction updates against Chinese semiconductor development on October 17, which established Total Processing Performance and Performance Density as the new parameters...
Thursday 26 October 2023
Substrate-based packaging for chiplet designs gaining popularity
Substrate-based packaging for chiplet designs is gaining favor among AI HPC customers, according to sources at OSATs.
Wednesday 25 October 2023
Faraday expects 4-6% revenue drop in 4Q23
Faraday Technology, a Taiwan-based provider of fabless ASIC services and silicon IP, expects to post a revenue decrease of 4-6% sequentially in the fourth quarter of 2023.
Thursday 19 October 2023
Socionext collaborates with Arm and TSMC to develop 2nm multi-core CPU chiplet
Socionext has announced a partnership with Arm and TSMC to develop an innovative, power-optimized 32-core CPU chiplet in TSMC's 2nm silicon technology, enabling scalable performance...
Wednesday 18 October 2023
US expands curbs to stop China's chiplet advancement and some DUV acquisition
The US Department of Commerce outlined new rules regarding expanded export restrictions to prevent China from acquiring advanced chips, closed loopholes, and added a new parameter...
Wednesday 4 October 2023
ASE intros integrated design ecosystem for advanced packaging
Advanced Semiconductor Engineering (ASE), a member of ASE Technology Holding, has announced the launch of its integrated design ecosystem (IDE), a collaborative design toolset optimized...
Thursday 28 September 2023
TSMC talks about new 3Dblox 2.0, 3DFabric achievements
At the TSMC 2023 OIP Ecosystem Forum, TSMC announced the new 3Dblox 2.0 open standard and major achievements of its Open Innovation Platform (OIP) 3DFabric Alliance. The 3Dblox 2.0...
Tuesday 19 September 2023
AI boom sparks silicon photonics applications
Silicon photonics technology was hotly discussed during the SEMICON Taiwan 2023. At the Silicon Photonics Global Summit held September 5 alongside the exhibition, I was invited to...
Monday 18 September 2023
Can generative AI shorten China's IC design learning curve? Q&A with UC Berkeley Prof. Alberto Sangiovanni-Vincentelli (Part 1)
Alberto Sangiovanni-Vincentelli, professor and Edgar L. and Harold H. Buttner Chair of Electrical Engineering and Computer Science Department at the University of California, Berkeley,...
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