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NEWS TAGGED CHIPLET
Monday 29 January 2024
AI chip advancements fuel surge in Japanese semiconductor backend process materials
Amidst the rapid advancement in AI chip development, emerging technologies like chiplets are making semiconductor backend processes more intricate. As a result, the prices and profit...
Friday 26 January 2024
Intel reportedly to integrate Samsung's LPDDR5X in Lunar Lake CPU by 3D packaging
Samsung Electronics and Intel have long competed with each other for first place in the fierce global semiconductor IDM market, and a fierce battle for orders and rankings has begun...
Thursday 25 January 2024
Chinese government support produces 100 domestic EDA vendors, but few will survive
China's multitude of government-supported (electronic design automation) EDA vendors are facing the prospect of elimination.
Thursday 25 January 2024
Chiplets market to ride on a strong 42.5% CAGR
The global chiplets market is forecast to be worth around US$107 billion by 2033, up from US$3.1 billion in 2023, with a CAGR of 42.5% between 2024 and 2033. It is projected to be...
Monday 22 January 2024
TSMC and Samsung accelerate UCIe commercialization, entering chiplet mass production race in 1H24
TSMC and Samsung Electronics are gearing up for a chiplet mass production race. Both industry giants are set to materialize the commercialization of UCIe (Universal Chiplet Interconnect...
Wednesday 10 January 2024
Chinese Academy of Sciences presents 'Big Chip', leveraging RISC-V Chiplets
The Institute of Computing Technology of the Chinese Academy of Sciences recently published a paper in the journal Fundamental Research introducing their "Big Chip" archit...
Friday 29 December 2023
Japanese car and semiconductor companies form an alliance for automotive chiplet research
Twelve Japanese automakers, component manufacturers, and semiconductor companies have formed an alliance for the research and development of advanced automotive chips, aiming to produce...
Thursday 7 December 2023
Pentagon-funded silicon interposer project closer to reshore US advanced packaging capability
The Industrial Base Analysis and Sustainment (IBAS) office, funded by the US Department of Defense to establish high-priority domestic capabilities to safeguard the US defense industrial...
Friday 1 December 2023
Suppliers optimistic about ABF substrate market in 2024, 2025
Industry suppliers are generally optimistic about Ajinomoto Build-up Film (ABF) substrate market prospects for 2024 and 2025, citing the recovery of the PC market, a growing demand...
Thursday 30 November 2023
IC backend houses see promising chiplet demand
Despite short-term headwinds, IC backend companies are generally positive about long-term demand for chiplet devices.
Friday 24 November 2023
TSMC and JCET expressed contrasting views on chiplet development
At the recently concluded 2023 China International Semiconductor Summit held in Shanghai, senior executives from JCET and TSMC both emphasized the role of advanced packaging, yet...
Friday 24 November 2023
WinWay says outlook for 2H24 is very optimistic
IC testing interface specialist WinWay Technology is full steam ahead with new products, holding a "very optimistic" outlook for the second half of 2024, according to the Taiwan-based...
Tuesday 14 November 2023
Chinese CPU developer planning shift to 7nm process manufacturing
China government-supported chipmaker Loongson has begun research on its CPU product line entering the next-generation 7nm technology, with development beginning in 2024, according...
Thursday 2 November 2023
Heterogeneous integration and system-level integration seen as 'next step' in advanced packaging era
With TSMC's CoWoS and the 2.5D advanced packaging from OSAT companies becoming a hot topic due to capacity shortages, advanced packaging solutions are seen as the next big thing.
Wednesday 1 November 2023
UMC launches 3D IC project in collaboration with partners
United Microelectronics (UMC) has launched a wafer-to-wafer (W2W) 3D IC project with partners including Advanced Semiconductor Engineering, Cadence, Faraday Technology, and Winbond...
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