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NEWS TAGGED CHIPLET
Thursday 24 August 2023
China bets on chiplet technology to match 14/7nm performance
In the three major segments of the semiconductor value chain: design, manufacturing, and packaging/testing, China's weakest link is manufacturing. In the packaging and testing field,...
Wednesday 23 August 2023
VeriSilicon, China's largest chip IP vendor, opens new R&D center focusing on chiplet
VeriSilicon, a major player in China's RISC-V ecosystem and also the country's largest chip design IP vendor, has on August 18 inaugerated its new R&D center in Shanghai. focusing...
Tuesday 15 August 2023
JCET, Tongfu and Huawei partaking Chinese effort to strengthen chiplet technology
Former TSMC COO, Chiang Shang-yi, currently the chief strategy officer at Foxconn semiconductors, faced challenges when he returned to China's SMIC in December 2020. He encountered...
Thursday 3 August 2023
AMD to adopt TSMC 3D SoIC tech in gaming notebook processors, say sources
AMD plans to incorporate TSMC's 3D SoIC (system on integrated circuits) stacking and chiplet packaging technology into its gaming notebook processors, following the company's implementation...
Friday 21 July 2023
Tongfu Microelectronics, AMD's main OSAT partner, released performance forecast for 1H23
China-based IC assembly and testing company Tongfu Microelectronics has recently released its performance forecast for the first half of 2023. The net profit attributable to shareholders...
Tuesday 11 July 2023
Chip suppliers eyeing chiplet to meet growing demand for HPC
As it is becoming much more difficult and expensive to pack more transistors into a single chip, the chip industry pins its hope on chiplet technology when the global demand for HPC...
Wednesday 28 June 2023
Chinese AI chiplet startup sees LLM moving to the edge
China-based startup Yuanli Semiconductor (temporary translation) has introduced the concept of AI Chiplets, aiming to reconstruct AI chips and target the edge inference market.
Wednesday 21 June 2023
JCET starts shipping 4nm chips with Chiplet technology
China's front-end process foundries are now limited to 14nm process, and at most, they can only develop 7nm chips with non-commercial mass production yields. However, China's three...
Tuesday 13 June 2023
Lockheed Martin, GF team up for secure supply chain
Lockheed Martin and GlobalFoundries (GF) have announced a strategic collaboration to advance semiconductor manufacturing and innovation in the United States and to enhance the security,...
Friday 9 June 2023
OSATs eyeing chiplet opportunities
ASE Technology and other OSATs capable of providing advanced packaging technology are all gearing up for a boom in demand for chiplets.
Thursday 8 June 2023
Rising Demand, chiplet and 3DIC trends offer bright outlook for CHPT
In a media debrief following the shareholder meeting, Huang Shui-Ke, president of Chunghwa Precision Test (CHPT), outlined the company's struggle in the previous year. The first quarter...
Friday 2 June 2023
ASE intros FOCoS-Bridge for AI and HPC chips
Advanced Semiconductor Engineering (ASE) has announced its latest fan-out-chip-on-substrate-bridge (FOCoS-Bridge) technology innovation, which involved qualifying a large 70x78mm...
Wednesday 24 May 2023
Chiplet getting trendy but SMIC misses out on opportunities
Semiconductor Manufacturing International Corp. (SMIC), the leading chip foundry company in China, is missing out on the opportunity brought by chiplet technologies, as Beijing Municipal...
Friday 28 April 2023
JCET gearing up for automotive, chiplet demand boom
Jiangsu Changjiang Electronics Technology (JCET), the largest China-based OSAT company, is gearing up for a surge in demand for automotive and chiplet solutions with its expanding...
Monday 17 April 2023
Japan keen on building chiplet technology and ecosystem
While the Intel-initiated Universal Chiplet Interconnect Express (UCIe) consortium has attracted many participants, Japan's academic and industry players are also stepping up efforts...