Intel has announced delivery of the first multi-chip package (MCP) prototypes created under the state-of-the-art heterogeneous integrated packaging (SHIP) program.
Nvidia is expected to use TSMC's 3D SoIC (system on integrated chips) stacking and chiplet packaging technology in its high-end processors set to debut between 2024 and 2025, according...
Jiangsu Changjiang Electronics Technology (JCET), the largest China-based OSAT company, has reported revenue and net profits for 2022 both hit record highs of CNY33.76 billion (US$4.91...
As China is getting isolated as a result of the US technological containment, China has come up with an indigenous interconnected interface for chiplet as Moore's law seems to approach...
Winbond has joined the UCIe (Universal Chiplet Interconnect Express) Consortium. The open industry standard defines interconnect between chiplets within a package, enabling an open...
Foxconn Technology's (Hon Hai Precision Industry) latest announcement to invite Shang-Yi Chiang, TSMC veteran and former SMIC executive, as the chief strategy officer of its semiconductor...
Founded in 2018, California-based company Ventana Micro Systems has taken steps to bring the open-source instruction set architecture RISC-V into the data center market. The effort...
Though TSMC is building advanced wafer fabs in the US, Taiwanese OSAT companies still have concerns about constructing facilities there to provide cutting-edge packaging services...
Chiplet interconnect startup Eliyan Corporation, based in Califronia, has raised US$40 million Series A funding, backed by four investors including Intel Capital and Micron Ventures...
As the semiconductor industry once again frets over the future of Moore's Law, the notion of chiplets has gained traction, especially as the technology has come to be prominently...
According to Intel, the company has joined the US Defense Advanced Research Projects Agency (DARPA) for the Phase 1 of its Spaced-Based Adaptive Communications Node (Space-BACN) program,...
Taiwan IC test interface solutions providers continue to embrace robust demand from major US HPC processor vendors Intel, Nvidia and AMD, which will effectively offset reductions...
Despite recent setbacks, Intel's IDM 2.0 strategy has taken a clearer contour as CEO Pat Gelsinger describes the company's latest progress and vision at Hot Chips 2022.
China's largest OSAT Jiangsu Changjiang Electronics Technology (JCET) has scored impressive revenue and profit gains for the first half of 2022, but is not optimistic about business...
Intel has disclosed plans to hike its CPU prices by 10-20% starting October, but AMD is not expected to follow suit amid the waning terminal market demand, according to industry so...
