At the recently concluded 2023 China International Semiconductor Summit held in Shanghai, senior executives from JCET and TSMC both emphasized the role of advanced packaging, yet...
IC testing interface specialist WinWay Technology is full steam ahead with new products, holding a "very optimistic" outlook for the second half of 2024, according to the Taiwan-based...
China government-supported chipmaker Loongson has begun research on its CPU product line entering the next-generation 7nm technology, with development beginning in 2024, according...
With TSMC's CoWoS and the 2.5D advanced packaging from OSAT companies becoming a hot topic due to capacity shortages, advanced packaging solutions are seen as the next big thing.
United Microelectronics (UMC) has launched a wafer-to-wafer (W2W) 3D IC project with partners including Advanced Semiconductor Engineering, Cadence, Faraday Technology, and Winbond...
Following the US sanction updates against Chinese semiconductor development on October 17, which established Total Processing Performance and Performance Density as the new parameters...
Faraday Technology, a Taiwan-based provider of fabless ASIC services and silicon IP, expects to post a revenue decrease of 4-6% sequentially in the fourth quarter of 2023.
Socionext has announced a partnership with Arm and TSMC to develop an innovative, power-optimized 32-core CPU chiplet in TSMC's 2nm silicon technology, enabling scalable performance...
The US Department of Commerce outlined new rules regarding expanded export restrictions to prevent China from acquiring advanced chips, closed loopholes, and added a new parameter...
Advanced Semiconductor Engineering (ASE), a member of ASE Technology Holding, has announced the launch of its integrated design ecosystem (IDE), a collaborative design toolset optimized...
At the TSMC 2023 OIP Ecosystem Forum, TSMC announced the new 3Dblox 2.0 open standard and major achievements of its Open Innovation Platform (OIP) 3DFabric Alliance. The 3Dblox 2.0...
Silicon photonics technology was hotly discussed during the SEMICON Taiwan 2023. At the Silicon Photonics Global Summit held September 5 alongside the exhibition, I was invited to...
Alberto Sangiovanni-Vincentelli, professor and Edgar L. and Harold H. Buttner Chair of Electrical Engineering and Computer Science Department at the University of California, Berkeley,...
In light of the fact that Chinese foundries can still obtain used equipment and consumables for process technology upgrades despite the US ban, the US could target advanced packaging...
