Logic IC manufacturing process technologies have been making rapid advances with lithography technologies and machines, transistor architecture and power delivery network (PDN) design all playing vital roles in driving the advance.
US government's Export Administration Regulations (EAR) are expected to set back China's progress in AI and supercomputer research and weaken its technological and military strength which otherwise could be empowered by its semiconductor advances.
Shipments of application processors (APs) used in smartphones released by China-based brands went up 10.2% sequentially, but down 19.4% on year to reach 199.5 million units in the third quarter of 2022.
According to Digitimes Research's surveys and analyses, second-quarter 2022 smartphone application processor (AP) shipments to China-based vendors amounted to 181 million units, increasing 1.7% from the prior quarter but decreasing 17.1% from the prior year mainly due to China's weakening economy as well as the ongoing Russia-Ukraine war and rising inflation continuingly taking a toll on consumer spending.
According to Digitimes Research's surveys and analyses, first-quarter 2022 smartphone application processor (AP) shipments to China-based vendors amounted to 178 million units, increasing 4% from the prior quarter but decreasing 16% from the prior year as Xiaomi, Oppo and Transsion ramped up inventory with their efforts to expand into Eastern Europe, Southeast Asia and Latin America generating results.
The top-4 Taiwan-based foundries - TSMC, UMC, PSMC and VIS - together generated an aggregated total revenue of US$19 billion in fourth-quarter 2021, up 6% from a quarter ago, taking their combined whole-year 2021 revenue to top US$68 billion, up 26% from a year ago.
Hybrid bonding and other new advanced assembly techniques widely used for smartphone application processors (AP) and high-performance computing (HPC) chips will continue to expand advanced packaging technologies.