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Aptos invests in ACE to enhance wafer-level package offering

Ingrid Lee, Taipei; Jessie Shen, DIGITIMES Asia Monday 30 November 2009 0

Aptos Technology, a 20%-held packaging and testing affiliate of Phison Electronics, has announced it recently acquired an 87% stake in wafer-level packaging (WLP) house Advanced Chip Engineering (ACE), whose major shareholders include Silicon Storage...

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