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Thursday 1 September 2016
Renesas, TSMC team up for 28nm MCUs
Renesas Electronics and TSMC have announced that they are collaborating on 28nm embedded flash (eFlash) process technology for manufacturing microcontrollers (MCUs) targeted at next-generation...
Wednesday 17 August 2016
ARM, Intel team up for 10nm
At the Intel Developer Forum on August 16, Intel announced its 10nm design platform for foundry customers will now offer access to ARM Artisan physical IP, including POP IP, based...
Wednesday 17 August 2016
Micron, Silicon Motion team up for UFS solutions
Micron Technology is working with its controller partner Silicon Motion Technology to develop controller solutions for Universal Flash Storage (UFS) chips, according to industry sources...
Wednesday 8 June 2016
ASRock expects growing performance in 2016
ASRock had an unsatisfactory performance in 2015 due to decreased motherboard shipments in China and increased expenses on server and industrial PC (IPC) investments; however, the...
Wednesday 1 June 2016
Brazil market: Xiaomi recalls handset team, to not introduce new models temporarily
Xiaomi Technology reportedly has recalled its handset team stationed in Brazil back to China due to difficulty promoting smartphones in the country and will not introduce new models...
Monday 18 April 2016
University team develops cloud-based symbiotic system for fish farms and hydroponics
A team consisting of several professors from the Department of Electronic Engineering at the National Taipei University of Technology has developed a symbiotic ecosystem between fish...
Friday 4 March 2016
President-elect vows to safeguard Taiwan semiconductor industry
The Taiwan government must form a "national team" in cooperation with local enterprises to meet increasing challenges amid the rising supply chain from China, president-elect...
Friday 4 March 2016
Smartphone AP suppliers to team up with TSMC to compete with Qualcomm-Samsung in 10nm chip market
Smartphone-use application processor (AP) makers in Taiwan and China are teaming up closely with Taiwan Semiconductor Manufacturing Company (TSMC) to compete with Qualcomm-Samsung...
Monday 4 January 2016
MediaTek expands R&D team within IoT BU
MediaTek has expanded the R&D team within its IoT (Internet of Things) business unit to more than 200 engineers, and the number of its IoT R&D staff will continue to grow...
Wednesday 25 November 2015
PEZY and Imagination team up to develop next-generation HPC systems
Imagination Technologies (IMG.L) and PEZY Computing K.K. announce a strategic partnership focused on development of next-generation efficient high performance computing (HPC) systems...
Thursday 19 November 2015
Asustek assigns new head of R&D team
Asustek Computer has appointed its vice president Joe Hsieh to lead its R&D unit, the Da Vinci Laboratory, to focus on developing technology for Internet of Things (IoT) and Industry...
Friday 11 September 2015
EC anti-circumvention probe team to visit Taiwan in October
The European Commission, which in late May 2015 decided to launch an anti-circumvention investigation of Taiwan- and Malaysia-based solar cell and PV module makers as well as China-based...
Monday 10 August 2015
TPK reportedly recruits LCM team from Wintek
Touch panel maker TPK Holding has reportedly recruited an LCM (LCD module) team from fellow maker Wintek in an attempt to extend product development and production to LCM assembly,...
Monday 27 July 2015
Toshiba develops 2 new process technologies for MCUs, wireless ICs
Toshiba has announced the development of a flash memory embedded process based on 65nm logic process and a single-poly non-volatile memory (NVM) process based on 130nm logic and analog...
Monday 22 June 2015
ARM, UMC team to tape out Cortex-A based 14nm FinFET chip
United Microelectronics (UMC) has announced that it is collaborating with ARM to tape out a process qualification vehicle (PQV) test chip on the foundry's 14nm FinFET technology to...