Rumors have been circulated in the IC industry claiming that Globalfoundries and Samsung Electronics will team up to vie for A9-series chip orders from Apple. Under the reported tie-up,...

Taiwan-based Richtek Technology has signed a cooperation agreement with Dialog Semiconductor for the development of power management ICs targeting the tablet and smartphone chipset...

Advanced Semiconductor Engineering (ASE) has announced a joint development and product agreement for assembly services of automotive products with Infineon Technologies. The collaboration...

KnCMiner, a provider of Bitcoin mining devices, and fabless ASIC company Alchip Technologies, have announced the availability of what the companies claim is the world's first 28nm...

Imagination Technologies has recognized MediaTek for its deployment of heterogeneous processing. The new MediaTek MT8135 chip is a mobile SoC enabling heterogeneous multi-processing...

Huawei Technologies plans to team up with Taiwan-based Compal Electronics to produce smartphones and tablets in Jundiai, Brazil, according to a Chinese-language Economic Daily...

IC foundry United Microelectronics (UMC) has announced that its partnership with Synopsys, a provider of electronic design automation (EDA) software and services, resulted in the...

InnoDisk, which specializes in flash storage devices for industrial applications and embedded systems, has teamed up with backend service provider Aptos Technology to develop a new...

Xilinx and TSMC have jointly announced that they are teaming up to create FPGAs built using 16nm FinFET process technology.

Globalfoundries has joined Imec's industrial research collaboration to develop spin-transfer torque magnetoresistive random access memory (STT-MRAM), according to the IC foundry.

Infineon Technologies and Globalfoundries have announced a joint technology development and production agreement for 40nm embedded flash (eFlash) process technology.

Programmable logic supplier Altera is working with foundry partner Taiwan Semiconductor Manufacturing Company (TSMC) on a 55nm embedded flash (EmbFlash) process technology tailored...

Sequans Communications has successfully completed interoperability testing of Alcatel-Lucent's LTE infrastructure equipment with Sequan's eBMS-capable LTE chipsets, according to the...

An Austrian research team has developed a new way of capturing images based on a flat, flexible, transparent, and potentially disposable polymer sheet. The team describesd their new...

Korea-based Samsung Electronics has reportedly replaced its management team in Brazil despite the team's efforts helping Samsung to become the largest vendor in the country, defeating...