Micron Technology has announced its automotive-grade LPDDR4X memory devices are being adopted for Qualcomm's third-generation Snapdragon automotive cockpit compute systems. The companies...

Dai Nippon Printing (DNP) has announced it is teaming up with Winbond Electronics to develop eSIM and other secure elements for IoT devices.

Qualcomm has been expanding its local R&D team in Taiwan to bring the company closer to its Taiwan-based partners such as TSMC for the development of 5G mobile chips, according...

Tsinghua Unigroup has signed a strategic alliance with memory module firm Shenzhen Longsys Electronics in a move to accelerate its ambition in the NAND flash sector.

Jorjin Technologies, as a member of the TW 5G Alliance - CHT pilot team, will participate in NGMN IC&E 2018 Vancouver this year, to share our results and advances in smart glass...

Himax Technologies and Kneron, an artificial intelligence (AI) startup company, have jointly announced a collaboration to accelerate the development and commercialization of a high...

Memory module maker Team Group expects to start trading its shares on the main board of the Taiwan Stock Exchange (TWSE) as early as the end of 2018.

Taiwan-based memory module maker Team Group has applied to be listed on the Taiwan Stock Exchange (TWSE).

A team of Taiwan researchers and an IC design house have jointly unveiled a deep-learning image-recognition AI chip whose production cost could be as low as only US$1.

The rampant development of the global gaming industry has significantly driven the shipment growth and spec upgrades of gaming devices, but it is brand value that will determine who...

HTC has signed a MoU agreement with China Mobile to join forces on a 5G program in China, according to a company announcement.

Memory module maker Team Group expects to list on the mainboard of the Taiwan Stock Exchange (TWSE) as early as the end of 2018.

Terminal connector makers Chialin Precision Industrial and CY Precision have signed a pact to co-develop automotive components and devices for the China market.

Texas Instruments (TI) and member firms of a new generation driver platform R&D alliance set up in Taiwan three years ago have jointly developed a spate of automotive electronics...

MediaTek has announced it is teaming up with Microsoft to deliver the first ever Azure Sphere chip, the MT3620, which will drive IoT innovation with built-in security and connectiv...