CONNECT WITH US
NEWS TAGGED TEAM
Monday 22 June 2015
InnoDisk, Supermicro and Toshiba team up for SSD cloud storage
Taiwan-based InnoDisk, which develops and manufactures industrial-class storage products, has disclosed the company is partnering with NAND flash chip vendor Toshiba and Super Micro...
Wednesday 3 June 2015
China market: Qualcomm, Allwinner team up for 4G LTE tablets
Qualcomm has followed in the footsteps of Intel, teaming up with China-based IC design houses to promote its entry-level and cost-effective platforms in the China market.
Monday 1 June 2015
High-quality, long-lasting: Q&A with Gigabyte motherboard team
As one of the top vendors in the desktop motherboard industry, Gigabyte Technology has grown its business to reach shipments of around 20 million motherboards per year, most of which...
Friday 15 May 2015
ASE and TDK team up for IC embedded substrates
Advanced Semiconductor Engineering (ASE) and TDK have announced that the companies will enter into an agreement to establish a joint venture company to manufacture IC embedded substrates...
Tuesday 7 April 2015
Altera, TSMC develop UBM-free WLCSP packaging
Altera and TSMC have produced an UBM-free (under-bump metallization-free) WLCSP (wafer-level chip scale package) technology for Altera's MAX 10 FPGA products, according to the comp...
Tuesday 24 February 2015
Globalfoundries, IMEC to jointly develop RF solutions for IoT applications
Globalfoundries has announced a partnership with IMEC for joint research on future radio architectures and designs for highly-integrated mobile devices and IoT applications.
Thursday 5 February 2015
SK Hynix, Toshiba team up for nanoimprint lithography
SK Hynix and Toshiba have announced they have struck a deal to jointly develop nanoimprint lithography (NIL), a candidate for the next-generation lithography technology.
Wednesday 28 January 2015
HTC sponsors eSports teams Cloud 9, Team Liquid, Team SoloMid
HTC has made an entrance into the eSports arena sponsoring three teams: Cloud 9, Team Liquid and Team SoloMid (TSM).
Wednesday 24 December 2014
Taiwan team announces SEMI PV57-1214 standards
A Taiwan team has announced SEMI-recognized international standards of performance measurement for dye-sensitized solar cells and organic solar cells, coded SEMI PV57-1214.
Tuesday 16 December 2014
Business software vendor SAP looks to team up with Taiwan cloud data centers
Enterprise software and service provider SAP is looking to sign a number of strategic alliance agreements with Taiwan-based cloud data centers in 2005, driven by growing demand for...
Thursday 27 November 2014
Micron, Winbond team up for serial NOR flash
Micron Technology has partnered with Winbond Electronics to jointly develop serial NOR flash memory for automotive and Internet of Things (IoT) applications, according to the US memory...
Tuesday 25 November 2014
Soitec, SK Innovation team up for semiconductor materials
France-based Soitec and SK Innovation of Korea have signed an agreement to establish an alliance focused on accelerating innovation in the area of semiconductor materials for information...
Tuesday 11 November 2014
Indium Corporation expands Malaysia technical support, adds team members
Indium Corporation celebrated the grand opening of its newest tech hub and the expansion of its technical support team in Penang, Malaysia, with customers and officials on Monday,...
Monday 1 September 2014
Eon reportedly to team up with China Sigma to develop NAND flash chips
Taiwan-based flash chip supplier Eon Silicon Solution reportedly will team up with China Sigma to form a NAND flash joint venture in China, according to industry sources.
Tuesday 1 July 2014
Samsung/Globalfoundries team reportedly lands 14nm orders from Qualcomm, Apple
The Samsung Electronics and Globalfoundries team reportedly has landed orders for its 14nm FinFET process from Qualcomm and Apple, with related foundry services to begin in early...