Innolux, a major display panel maker, is intensifying its push into Fan-Out Panel Level Packaging (FOPLP), a next-gen semiconductor packaging technology. While the company is positioning...
Amid US-China trade tensions and the potential for new US semiconductor tariffs under President Donald Trump, Taiwan's IC packaging and testing industry is showing strong first-quarter...
Silicon photonics (SiPh), hailed as a transformative technology for AI development, data centers, and 5G networks, is rapidly converging toward standardized parameters and specific...
At its GTC event in March, Nvidia unveiled the B300 and GB300 AI accelerators, both scheduled for a mid-2025 release. The GB300, featuring significantly higher performance and power...
In response to the announcement by the US government on April 2, 2025, regarding reciprocal tariffs, Hye Technology stated that it does not directly sell automation and semiconductor...
CDIL Semiconductors, one of India's oldest semiconductor firms, is teaming up with Infineon Technologies to bring localized power discrete solutions to the Indian market.
Despite rumors of reduced orders for advanced packaging capacities, Taiwan Semiconductor Manufacturing Company (TSMC) is ramping up its advanced packaging capacity to meet the growing...
