Global gold prices have surged to an all-time high of US$3,500 per ounce, putting significant cost pressure on the semiconductor packaging industry. The gold bumping process—essential...

TSMC is struggling with workforce constraints as it builds 24 new fabrication plants globally, potentially threatening its ambitious expansion timeline, Chairman C.C. Wei revealed...

At its 2025 North America Technology Symposium, attended by over 2,500 industry leaders, TSMC unveiled a suite of technologies that complements its 1.8nm (18A) process. From advanced...