As AI continues to attract widespread attention, the race to build large-scale data centers is ongoing. Regarding energy consumption, the power demand of hyperscale data centers has...
In November 2024, Airoha Technology (Airoha) secured a NT$1.4 billion (approx. US$ 42.59 million) grant from Taiwan's Ministry of Economic Affairs (MOEA), drawing industry-wide attention...
Innolux Corporation is pushing forward with fan-out panel-level packaging (FOPLP) technology, aiming for mass production in first-half 2025 despite previous delays. As the first quarter...
"Saving Intel" has been a subject of negotiation between TSMC and the Trump administration over the past two months, according to semiconductor industry sources. The project's scale...
High bandwidth memory (HBM) major client Nvidia is said to have visited Samsung Electronics' advanced packaging plant again, just over a month after their last visit. Industry sources...
ASE Technology Holding, a global leader in semiconductor packaging and testing, is partnering with Ainos to integrate AI-powered scent digitization into semiconductor manufacturing...
TSMC plans to pour an additional US$100 billion into its US operations, lifting its total investment to US$165 billion. The move underscores the chip giant's deepening ties with Washington...
