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Wednesday 10 September 2025
TSMC's Cliff Hou and Jim Keller rally behind 'Moore's law 2.0' at SEMICON Taiwan

At SEMICON Taiwan's fireside chat, two of the industry's most influential voices pushed back against the idea that Moore's law has run...

Wednesday 10 September 2025
Broadcom offers US$600M incentive to CEO for AI business growth
Broadcom CEO Hock Tan stands to receive up to US$600 million in stock rewards if he can drive artificial intelligence (AI) product revenue to US$120 billion by fiscal year 2030.
Wednesday 10 September 2025
Synopsys' IP business underperforms in 3QFY25, announces 10% workforce reduction
US electronic design automation (EDA) giant Synopsys faced ongoing challenges from US export restrictions to China and difficulties with key foundry customers. As of July 31, 2025,...
Wednesday 10 September 2025
TSMC reports 33.8% revenue increase in August, outlook shaped by AI demand and margin pressures
TSMC posted strong revenue growth in August 2025, recording approximately NT$335.77 billion (approx. US$11.03 billion). The result marks a 3.9% increase from July and a 33.8% rise...
Wednesday 10 September 2025
Commentary: Decoding the new semiconductor world order
The semiconductor landscape has fundamentally shifted. As we move from 2025 to 2026, three forces dominate global technology discourse: semiconductors, artificial intelligence, and...
Wednesday 10 September 2025
SEMICON Taiwan 2025: Alliance Material showcases breakthrough double-sided RDL glass substrate process
Alliance Material, a semiconductor materials company, reported a surge in revenue in August 2025, reaching NT$67.93 million (US$2.23 million), a 15.84% increase from July and nearly...
Wednesday 10 September 2025
Exclusive: TSMC turns legacy fabs into EUV pellicle powerhouse, signals new front in chipmaking
TSMC has confirmed it will exit gallium nitride (GaN) foundry operations within two years, shutting down production at its 6-inch Fab 2 in Hsinchu Science Park. The company is also...
Wednesday 10 September 2025
Highlights from China International Optoelectronic Expo and SEMI-e: sovereign AI, drones, AR/VR/MR in focus
The 26th China International Optoelectronic Expo (CIOE) and the Shenzhen International Semiconductor & IC Exhibition (SEMI-e 2025) are being held at the Shenzhen International...
Wednesday 10 September 2025
SEMICON Taiwan 2025: Zeiss hits milestone of 10 High NA optic systems shipped as TSMC probes future of Hyper NA EUV
At SEMICON Taiwan 2025, Zeiss Semiconductor Manufacturing Technology offered a rare glimpse into the future of extreme ultraviolet (EUV) lithography, outlining its optics roadmap...
Wednesday 10 September 2025
China's NSIG to absorb loss-making wafer subsidiaries in US$967M restructuring
China's top silicon wafer maker, National Silicon Industry Group (NSIG), has unveiled a major restructuring, taking full control of three loss-making 12-inch wafer subsidiaries. The...
Wednesday 10 September 2025
AI chip demand drives future semiconductor growth trends
SEMICON Taiwan 2025 opened on September 10, with numerous forums already underway ahead of the event. Various research institutions have expressed cautiously optimistic views on the...
Wednesday 10 September 2025
FOPLP progress is fastest in foundries, slower in testing and panel fabs
Foundries lead in FOPLP advanced packaging development due to their integrated processes, followed by testing firms that leverage existing wafer architectures. Panel fabs face precision...
Wednesday 10 September 2025
AI infrastructure investment may enter adjustment phase in 2026, with small-and medium-sized business demand driving new momentum
At the SEMICON Taiwan event held in September, key international figures from the semiconductor, robotics, and future vehicle sectors convened, highlighting Taiwan's rising importance...
Wednesday 10 September 2025
Taiwan pushes immersion cooling, CoWoS tech into US AI server supply chain
Taiwan's Ministry of Economic Affairs has approved a NT$250 million (US$8.2 million) project spearheaded by Aewin Technologies, Kenmec Mechanical Engineering, and I-Chiun Precision...
Tuesday 9 September 2025
TSMC and ASE form 3D IC alliance with 34 members to overcome advanced packaging bottlenecks
To break through the technical, mass production, and yield challenges in advanced packaging processes such as 3D IC and CoWoS, SEMI, together with TSMC and ASE Holdings, has established...