On 30 October 2025, Donald Trump and Xi Jinping met in Busan, South Korea, in a summit that could redefine the global trade and technology...
Benefiting from increased wafer shipments and higher capacity utilization, United Microelectronics Corporation (UMC) reported its most...
Dr. Nokibul Islam, Senior Director at STATS ChipPAC, presented the company's advanced packaging technology roadmap at the 2025 Advanced...
Ang Wee Seng, Executive Director of the Singapore Semiconductor Industry Association (SSIA), told attendees at the 2025 Advanced Packaging...