Packaging, substrate, printed circuit board (PCB), and assembly makers need closer coordination to meet the demands of AI and high-performance computing (HPC), as package-to-board...

India's first commercial chip fab is opening a long-awaited new market for the country's chemical makers, but the companies best placed to profit in the near term are Japanese, South...

Japan plans to provide an additional JPY400 billion (US$2.5 billion) to support Rapidus' advanced semiconductor production between fiscal 2027 and fiscal 2029, as the government seeks...

TPCA Show 2026 officially opened, with Unimicron Chairman Shan-Chieh Chien saying in his opening address that solving the three major challenges facing AI accelerators in high-performance...

Intel has asked the Federal Communications Commission (FCC) for a waiver to the US ban on advanced foreign robots, citing worries that its machines will not receive equipment updates,...

More than a dozen US companies are exploring opportunities to develop Malaysia's rare earth industry, seeking alternatives to China-dominated supply chains as Washington pushes to...

SEMICON West 2026 wrapped up in San Francisco last week, with US officials, industry executives, equipment and materials suppliers, and workforce-development partners repeatedly highlighting...

AI servers are driving demand for power components, transient voltage suppressors (TVS), and electrostatic discharge (ESD) protection devices. Yea Shin Technology, a subsidiary of...

South Korean substrate maker Daeduck Electronics is accelerating development of ceramic core substrates (CCS) to address warpage and thermal-management challenges as AI semiconductor...

DeepSeek is reportedly working closely with Huawei to influence the design of its future AI chips, a link reportedly closer than typical supplier-customer relationships. The collaboration...

Intel is pitching its foundry as the industry's supplier of light sources for AI data center optics, claiming at the 2026 Open Compute Project (OCP) Global Summit that it is the only...

Amkor Technology is tripling its planned investment in Gwangju to expand advanced packaging capacity for artificial intelligence and high-performance computing, bringing a semiconductor...

TPK Holding has completed a pilot production line for glass-substrate through-glass via (TGV) technology at its Zhongli plant and started joint development and validation of early-stage...

Samsung Electronics' 2nm mass-production capability at its Taylor, Texas fab has become critical to its efforts to close the gap with TSMC, as Tesla's AI5 chip delivery schedule and...