Applied Materials tracked more than 100 wafer fabrication projects worldwide over the past two quarters as strong artificial intelligence demand continued to meet constraints in cleanroom...
Applied Materials is increasing investments in research and development, manufacturing and its global supply chain as it targets greater market share and profitability through 2030...
Fujifilm is expanding semiconductor materials production in Arizona as global chip demand rises, especially for artificial intelligence, advanced logic, and memory. The move aims to...
Following stronger-than-expected demand for its Galaxy Z Fold8, Samsung Electronics submitted an expedited wafer production request to United Microelectronics Corporation (UMC) that...
The rapid expansion of AI and data center chip package sizes is accelerating the adoption of glass substrates, with SEMI's Beth Keser now forecasting market entry around 2028, two...
Topco Scientific (TSC) is evaluating a new base in Boise, Idaho, as the US enters a fresh wave of chip manufacturing expansion and Micron ramps up advanced memory investment. The company...
Global spending on 300mm front-end fab equipment is projected to reach US$149 billion in 2026, up 31% from a year earlier. Spending is expected to keep growing at double-digit rates...
Tata Group's semiconductor fab in Gujarat, held up as the foundation of India's chipmaking ambitions, now faces scrutiny from within, as the group's controlling shareholder presses...
ASE has expanded its PowerSiP platform with a 3D system-in-package solution aimed at vertical voltage regulator modules (VRMs) for AI data centers and high-performance computing systems...
Automotive drivetrain manufacturer Tsang Yow reported consolidated revenue of NT$86.36 million (US$2.69 million) in September 2026, down 2.3% month-over-month and 1.24% year-over-year...
ASML reported record third-quarter 2026 net sales of EUR11.7 billion (approx. US$13.1 billion) and net income of EUR5 billion, while warning that its planned supply for 2027 and 2028...
JCET is directing most of its increased capital spending towards advanced packaging, modules and testing while reorganising its two South Korean factories to meet AI infrastructure...
As demand for artificial intelligence computing accelerates, the competitive focus in semiconductors is shifting beyond single-chip speed to the efficiency of entire data centers....
Broadcom's Frank Ostojic said semiconductor firms need joint innovation across equipment, materials, and design to overcome bottlenecks that affect AI chips worldwide. He warned that...
At Plug and Play Taiwan's Batch 4 Selection Day, 21 startups made the case that Taiwan's next wave of innovation is being built by chip-industry veterans who are tackling problems...
