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Tuesday 14 July 2026
Gudeng Precision Industrial posts record second quarter revenue on advanced semiconductor carrier demand
Gudeng Precision Industrial Electronics reported record June revenue and its highest quarterly sales in the second quarter of 2026, driven by stronger demand for EUV mask carriers...
Tuesday 14 July 2026
iST June revenue rose as AI chip validation demand strengthened
Integrated Service Technology Inc. (iST) reported June 2026 consolidated revenue of about NT$426 million (US$13.24 million), up 10.47% from May and down 1.56% year on year. The Taiwan-based...
Tuesday 14 July 2026
Ion Electronic Materials posts 30% June revenue growth on advanced gas demand
Ion Electronic Materials reported June 2026 consolidated revenue of NT$51.852 million (US$1.61 million), up 30% from a year earlier, as demand for advanced gases continued to expand...
Tuesday 14 July 2026
Trusval sets record first-half revenue as AI factory demand pushes orders to 2027
Trusval Technology posted record revenue in the second quarter and first half of 2026, supported by demand tied to global AI infrastructure buildouts and continued expansion of advanced...
Tuesday 14 July 2026
Quartz component makers raise prices as material costs bite

Quartz component suppliers are raising prices as higher raw material costs from gold wire and ceramic bases squeeze margins. Industry...

Tuesday 14 July 2026
TASC reshuffles management as PASC targets 2027 Taiwan Innovation Board listing
Taiwan-Asia Semiconductor (TASC) has announced senior management changes at its group companies as ProAsia Semiconductor (PASC) prepares for a Taiwan Innovation Board listing, now...
Tuesday 14 July 2026
China launches first 8-inch 2D chip line to bypass EUV limits

Shanghai AtomIC Technology has launched what it describes as the world's first 8-inch pilot line for two-dimensional semiconductors, marking...

Tuesday 14 July 2026
Samsung brings HBM, logic, and optics together in packaging push
Samsung Electronics is developing advanced packaging technology that combines high-bandwidth memory (HBM), logic chips and silicon photonics (SiPh) as it seeks to address the rising...
Tuesday 14 July 2026
Commentary: Forget AI chips — China's top science awards reveal what Beijing is actually building
China has nine years left to meet its goal of becoming a global science and technology powerhouse by 2035.
Tuesday 14 July 2026
Interview: UK's AI sovereignty pitch — research at home, scale with Taiwan

As the world enters an AI-centric era, the global race for technological leadership is no longer defined only by who can build the...

Monday 13 July 2026
Samsung develops glass interposer as TSMC expands packaging capacity

Samsung Electronics and Samsung Display are jointly developing a next-generation glass interposer that could lower the cost of packaging...

Monday 13 July 2026
Taiwan's auto parts makers pivot to high-tech as AI cooling, chip equipment demand surges

Taiwan's automotive parts makers are accelerating their transformation into high-tech suppliers as the global expansion of advanced...

Monday 13 July 2026
Trump admin reportedly urged Apple to procure chips from Intel in exchange for dropping tariffs

Reports have emerged that Apple may have managed to avoid 100% tariffs imposed by US President Donald Trump, partly by agreeing to...

Monday 13 July 2026
Tesla AI5 chip reportedly completes tape-out for Samsung's Texas fab

Samsung Electronics has reportedly completed the tape-out of its version of Tesla's AI5 chip for self-driving systems, with the chip...

Monday 13 July 2026
Intel eyes dual-side power in 1.4nm push against TSMC

Intel is reportedly preparing a new technology roadmap for its next-generation 1.4nm process, 14A2, as it evaluates a hybrid architecture...