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    NEWS TAGGED IC MANUFACTURING
    Wednesday 30 September 2026
    TSMC reportedly evaluates Texas fabs as US regional competition intensifies
    TSMC is reportedly evaluating whether to build a second US manufacturing hub in Texas, potentially housing up to 6 advanced wafer fabs, as its US footprint continues to expand. The...
    Wednesday 30 September 2026
    Grand Pacific Petrochemical, Air Water join forces to expand Taiwan semiconductor materials business
    Taiwan-based chemical manufacturer Grand Pacific Petrochemical (GPPC) is optimizing its core business while actively expanding into high-tech and semiconductor materials-related industries,...
    Wednesday 30 September 2026
    Memory shortage pushes TV semiconductors above panel costs

    A global memory shortage linked to rising AI infrastructure spending has upended TV manufacturing economics, with semiconductor costs...

    Wednesday 30 September 2026
    Commentary: Garmin returns to OLED, putting Micro LED on notice
    Garmin's decision to offer OLED options but no Micro LED version in its new flagship smartwatches, the fenix 9 and fenix 9 Pro, has revived debate over whether the emerging display...
    Wednesday 30 September 2026
    GlobalFoundries Singapore capacity utilization tops 90% as silicon photonics expansion hits equipment lead-time bottleneck
    GlobalFoundries (GF) is expanding its Singapore footprint following its acquisition of local silicon photonics foundry Advanced Micro Foundry (AMF), integrating 200mm and 300mm silicon...
    Wednesday 30 September 2026
    Rare earths loom over US-China trade truce
    The US-China trade truce was extended after last week's Trump-Xi summit, but China's dominance of rare-earth supply chains remains a key pressure point as Washington tries to stabilize...
    Tuesday 29 September 2026
    SoftBank subsidiary Saimemory taps Shinko to bring ZAM closer to commercialization
    Saimemory, a SoftBank subsidiary, has brought Shinko Electric Industries into its effort to commercialize Z-Angle Memory (ZAM), adding packaging-substrate, high-density integration...
    Tuesday 29 September 2026
    In global semiconductor race, Singapore bets on critical, mature technologies
    Amid the ongoing restructuring of the global semiconductor supply chain, Singapore is focusing on advanced packaging, heterogeneous integration, silicon photonics, and optical interconnects,...
    Tuesday 29 September 2026
    Column: Why Micron's US$250M venture fund is about more than HBM margins—Taiwan has a stake in it
    Micron unveiled the Micron Ventures Paradigm Fund, a US$250 million venture vehicle, in mid-August 2026, as the memory maker pairs more than US$25 billion in fiscal 2026 capex with...
    Tuesday 29 September 2026
    South Korea AI compute squeeze hits researchers and startups
    South Korea's AI sector is facing a growing GPU shortage as research institutes and small companies struggle to secure enough compute for model training and deployment. As government...
    Tuesday 29 September 2026
    Samsung Foundry nears 60% 2nm yield, shifts focus to power efficiency to win customers
    Samsung Electronics' foundry business has reportedly raised yield on its 2-nanometer (2nm) SF2 process to nearly 60% and is now shifting engineering work toward power efficiency and...
    Tuesday 29 September 2026
    US, China eye US$60 billion in tariff relief, but chips stay off the table
    The US and China are moving toward tariff reductions on about US$60 billion of bilateral trade following last week's Trump-Xi summit, but semiconductors and other strategically sensitive...
    Tuesday 29 September 2026
    Advanced packaging shifts toward system integration as AI renews semiconductor talent appeal

    At Singapore's Innovate Together 2026 conference on September 25, executives and researchers from A*STAR's Institute of Microelectronics...

    Tuesday 29 September 2026
    Beyond 16 layers: HBM stacks test advanced packaging equipment makers
    At Singapore's Innovate Together 2026 conference on September 25, equipment makers including ASM, ASMPT, and KLA said the challenges facing next-generation advanced packaging are expanding...
    Tuesday 29 September 2026
    Samsung bonus plan to lift South Korea talent race

    Samsung Electronics' Device Solutions division is set to announce the calculation and payout rules for its special management performance...

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    Hackathon Team Optimizes Urban Evacuation Decision-Making
    Wednesday 30 September 2026
    AI Memory & Storage: The 5th GMIF2026 Innovation Summit Concludes
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