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    NEWS TAGGED IC MANUFACTURING
    Monday 24 August 2026
    Taiwan's 'invisible champions' in chip materials are about to become visible, says GlobalWafers' Doris Hsu

    Advanced process technology and new device architectures are reshaping the semiconductor supply chain — and the pressure is shifting...

    Monday 24 August 2026
    India roundup: India's chip push moves beyond fabs as yield, supply chains and new technology become the next test
    India's semiconductor strategy is entering a more demanding phase, shifting from attracting fabs and assembly plants toward building the capabilities needed to sustain them. From wafer...
    Monday 24 August 2026
    Samsung DX hits first quarterly loss on chip inflation

    Samsung Electronics' Device eXperience (DX) division posted its first-ever quarterly operating loss in the second quarter of 2026, hit...

    Monday 24 August 2026
    Research Insight: ASIC shipments projected to overtake GPU by 2027 as AI reshapes memory
    ASIC and GPU shipments will reach a "golden cross" in 2027, with ASIC shipments expected to surpass GPU shipments for the first time at 15.3 million units, DIGITIMES Intelligence analyst...
    Monday 24 August 2026
    CPO hurdles linger as 800G and 1.6T SiPh surge, says analyst
    Challenges around co-packaged optics (CPO) remain unresolved, but they have not slowed the rapid rise of 800G and 1.6T silicon photonics, DIGITIMES analyst Kiwi Hsu said on August...
    Saturday 22 August 2026
    Manz Asia says yield is key to glass core mass production
    As AI chips continue to grow in size, the shift in advanced packaging from 300 mm wafers to square panels is becoming clearer, driving parallel development of new packaging technologies...
    Friday 21 August 2026
    China chip equipment maker Piotech posts 1,324% profit surge, advanced deposition scales up
    Piotech Inc. reported a sharp rise in first-half 2026 earnings, helped by stronger demand for semiconductor deposition equipment, wider adoption of new process tools and improving...
    Friday 21 August 2026
    SK Chairman warns of 2027 memory shortage, ties expansion to long-term orders
    SK Group Chairman Tae-Won Chey said in a recent interview with CNBC that memory demand is surging explosively and that the most severe "memory shortage" will hit in 2027. He also apologized...
    Friday 21 August 2026
    CoWoS boom lifts Taiwan semiconductor equipment makers, Bosch Rexroth targets 2027 volume growth
    Bosch Rexroth, the industrial technology subsidiary of Bosch, showcased advanced semiconductor and smart manufacturing solutions at the 2026 Taipei International Industrial Automation...
    Friday 21 August 2026
    JCET profit surges 79% on AI demand, with advanced packaging and CPO gaining scale

    JCET Group reported record first-half revenue for 2026, with demand from artificial intelligence infrastructure and high-performance...

    Friday 21 August 2026
    Explainer: Why South Korea's semiconductor concentration may fare better than Taiwan's
    As South Korea's semiconductor exports continue to power its economic expansion, market concerns are growing regarding the risks of excessive concentration in the tech sector. Recent...
    Friday 21 August 2026
    FOPLP's race to scale: Taiwan leads while three technical hurdles test mass production

    Rising demand for AI computing power is increasing chip package sizes, bringing fan-out panel-level packaging (FOPLP) into sharper focus...

    Friday 21 August 2026
    Research Insight: CPO gains momentum as AI interconnect demands outpace chip gains
    The AI industry is watching the rise of co-packaged optics (CPO) as faster AI systems now depend on more efficient links between chips and data centers. At DIGITIMES Tech Forum 2026...
    Friday 21 August 2026
    Taiwan export orders near US$98 billion in July, with US as top buyer
    Taiwan's export orders climbed by US$207.3 billion, or 52.5%, in the first seven months of 2026 compared with the same period in 2025, according to data released on August 20 by the...
    Friday 21 August 2026
    JCET hits 1.5μm TSV milestone for denser HBM and 2.5D/3D packaging
    JCET Group has completed trial production of a 1.5μm-diameter, 17μm-deep through-silicon via (TSV) with an aspect ratio of 11.3:1, extending its advanced packaging capabilities...
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    BIZ FOCUS
    Aug 24, 08:00
    STMicroelectronics Unveils ISO 21780-Compliant 48V Pre-Driver with 8-Channel Flexibility
    Monday 24 August 2026
    iCometrue to Showcase Glass-Based AI Multichip Packaging Solutions at SEMICON Taiwan 2026
    Thursday 20 August 2026
    Corning-IRICO Trade Secret Case Enters New Phase
    Thursday 20 August 2026
    PGC Helps Startups Accelerate ASIC Development with Turnkey Services
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