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Monday 6 July 2026
China advanced packaging maker SJ Semiconductor starts US$1.5bn 3DIC project for AI chips

SJ Semiconductor has started construction of a CNY10 billion (approx. US$1.47 billion) 3DIC manufacturing project in Shanghai's Lingang...

Monday 6 July 2026
Greatek Electronics advances Taiwan+1 plan with acquisition of Onsemi Philippines packaging plant
Greatek Electronics, a subsidiary of memory packaging and testing provider Powertech Technology (PTI), has approved the acquisition of On Semiconductor SSMP Philippines, a packaging...
Monday 6 July 2026
China's chip equipment makers ramp up expansion as AI and memory boom fuel domestic demand

China's leading semiconductor equipment manufacturers are accelerating expansion through acquisitions and fundraising, as surging AI...

Monday 6 July 2026
Exclusive Interview: Dutch startup Nearfield bets on process control to rival EUV in AI chip manufacturing

As Moore's Law approaches its physical limits, simply shrinking semiconductor process nodes is no longer the sole path to improving...

Monday 6 July 2026
India's chip mission enters harder phase: deciding where to compete
India's plan to sharply expand public funding for semiconductors marks a new phase in its chip ambitions. The harder question is whether New Delhi can now decide where it wants to...
Monday 6 July 2026
Europe's defense boom has a semiconductor problem
Europe's defense industry is running into a structural bottleneck: the semiconductors needed for modern missiles, drones, radar, communications, and electronic warfare cannot be produced...
Monday 6 July 2026
NXP chief says robots need autonomous computing to move beyond remote control

As physical AI and robotics spread globally, NXP CEO Rafael Sotomayor said robots will only reach commercial scale if they can think...

Monday 6 July 2026
Exclusive Interview: Dutch startup Nearfield targets AI chip process control expansion after US$380 million funding round
Dutch semiconductor equipment startup Nearfield Instruments has completed a US$380 million Series D funding round, the largest-ever fundraising for a Dutch deep-tech company. The company...
Monday 6 July 2026
Huawei chip chief proposes Tau Law V2 centered on time-based scaling
Huawei's semiconductor chief is promoting a post-Moore roadmap that shifts industry focus from shrinking transistors to reducing time across the computing stack, a framework backed...
Monday 6 July 2026
Meta's AI cloud idea underscores a search for returns, not an AI retreat
Meta is reportedly exploring a new AI cloud infrastructure business that would let enterprises use its AI models and some unused GPU capacity, a move that could lift hardware utilization...
Monday 6 July 2026
India launches third semiconductor plant as CG Semi begins commercial production in Gujarat
India Prime Minister Narendra Modi inaugurated CG Semi's Outsourced Semiconductor Assembly and Test (OSAT) facility in Sanand, Gujarat, marking the start of commercial production at...
Monday 6 July 2026
Asahi Kasei to expand Taiwan photoresist film capacity for AI chip packaging
Asahi Kasei, one of the notable suppliers of Sunfort dry film photoresist in Japan, has initiated a fab expansion project in Taiwan. The newly established plant is expected to further...
Monday 6 July 2026
India roundup: India accelerates semiconductor ambitions through policy and global partnerships
India accelerated its semiconductor ambitions through deeper Japan cooperation, policy advances, new manufacturing partnerships, and local technology investments, reinforcing efforts...
Monday 6 July 2026
Analysis: Taiwan's semiconductor sector enters 2026 helium crunch, with nearly 90% dependent on Qatar
Taiwan's chipmakers walked into the 2026 helium supply shock more exposed to Qatar than any other major buyer, sourcing nearly 88% of their rare-gas imports from the Gulf state in...
Sunday 5 July 2026
Applied Materials unveils integrated tools for HBM, chiplet, and 3D packaging scale-up
Applied Materials announced a new equipment platform aimed at addressing the memory bandwidth and energy-efficiency bottleneck confronting AI computing, unveiling tools across DRAM,...