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    Memory price hikes squeeze Samsung smartphone HDI supply
    3h 8min ago
    Samsung foundry S5 shift to DRAM faces major hurdles
    3h 8min ago
    Chinese smartphone price hikes hit Southeast Asia shipments
    3h 8min ago
    China semiconductor equipment makers expand localization into advanced packaging
    3h 8min ago
    Analysis: can Taiwan’s research institutes follow imec’s EUV model?
    3h 8min ago
    South Korea confirms US request for expanded semiconductor investment
    3h 8min ago
    NEWS TAGGED IC MANUFACTURING
    Monday 7 September 2026
    China's JCET seeks US$968M for AI-driven packaging expansion

    JCET Group is preparing a CNY6.5 billion (approx. US$968 million) private share placement to expand advanced packaging and testing capacity...

    Monday 7 September 2026
    No foundry price relief before 2027 as utilization nears 90%

    AI demand is driving a broader repricing cycle across the foundry industry in 2026. Tightness that began at leading-edge nodes is spreading...

    Monday 7 September 2026
    Experts say subsidies can't buy semiconductor competitiveness
    At a forum jointly hosted by DSET and SEMI during SEMICON Taiwan this year, Glenn D. Tiffert of the Hoover Institution, Kioxia Holdings board member Emiko Higashi, and NRC...
    Monday 7 September 2026
    AI is driving force behind 'Moore's Law on steroids,' says Merck's Benjamin Hein
    AI is driving a new wave of technological demand and changing how the semiconductor industry innovates, according to Benjamin Hein, member of the executive board and CEO of the Electronics...
    Monday 7 September 2026
    India roundup: India expands chip ambitions with full Semicon 2.0 notification

    India's technology sector is gaining momentum across semiconductors, connectivity, AI payments,...

    Sunday 6 September 2026
    BenQ Materials targets CPO in semiconductor push
    BenQ Materials Group has formally positioned semiconductor materials as a key future growth driver, using its existing coating, membrane, foaming, and adhesive technologies to move...
    Sunday 6 September 2026
    TEL sees AI-driven packaging, memory demand reshaping Taiwan strategy
    Tokyo Electron's Taiwan president said AI is pushing semiconductor demand into new areas, with advanced packaging, DRAM, high-bandwidth memory, and NAND flash all gaining momentum...
    Sunday 6 September 2026
    Hanmi's 2.5D bonders pass Taiwan foundry qualification as packaging outsourcing expands
    South Korea's Hanmi Semiconductor has reportedly begun supplying 2.5D packaging bonders to an unnamed Taiwanese foundry after the equipment passed mass-production qualification, giving...
    Sunday 6 September 2026
    Tongtai doubles semiconductor orders on AI data-center demand
    Facing rapid demand expansion across the semiconductor and AI industries, Tongtai Group (TT Group) has aggressively promoted an import-substitution and localization strategy in recent...
    Sunday 6 September 2026
    Podcast highlights: SoIC vs CoWoS, HBM5 hybrid bonding, and EMIB-T's yield problem
    In a podcast, DIGITIMES analyst Luke Lin said hybrid bonding is drawing fresh attention at SEMICON Taiwan 2026 and could become a key driver of advanced packaging capacity expansion...
    Sunday 6 September 2026
    Taiwan chip equipment maker Scientech sees orders into 2028, may turn away customers in 2027
    AI and high-performance computing (HPC) demand is extending order visibility for Taiwanese semiconductor equipment supplier Scientech into 2028, while capacity constraints may force...
    Sunday 6 September 2026
    Trumpf CTO says advanced packaging reshapes semiconductor equipment race
    AI and high-performance computing (HPC) demand is changing the semiconductor industry's technology and investment priorities. As chip power consumption, computing density, and data...
    Saturday 5 September 2026
    NYCU wins Nobel laureate for Taiwan job card
    National Yang Ming Chiao Tung University (NYCU) has recruited 2013 Nobel Prize in Chemistry laureate Arieh Warshel to work in Taiwan, and the National Development Council (NDC) has...
    Saturday 5 September 2026
    Semicon Taiwan 2026: A windmill in the die bonder, and a Dutch bet on photonics
    Dutch equipment maker ITEC used Semicon Taiwan to promote a die-bonding architecture that it says triples throughput over earlier versions of the design by removing the largest source...
    Saturday 5 September 2026
    Taiwan semiconductor output targets NT$8 trillion
    As Semicon Taiwan kicked off at the Taipei Nangang Exhibition Center, the Ministry of Economic Affairs (MOEA) announced that, based on forecasts compiled from multiple research institutions,...
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    BIZ FOCUS
    Sep 2, 08:22
    World Diamond Technology accelerates mass production of 300 mm diamond wafers
    Wednesday 2 September 2026
    Beyond Language: Indonesian Engineers Bridging Cultures in Taiwan's Semiconductor Industry
    Wednesday 2 September 2026
    8 September Hsinchu seminar: Silicon photonics driving AI chains
    Wednesday 2 September 2026
    DAS Introduces ALCEA for Integrated NOx Treatment in Semiconductor Fabs
    Semicon_TW