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    Xiaomi-backed RISC-V chip designer Nuclei starts IPO process
    7h 59min ago
    Xpeng expands Turing chip from EVs into humanoid robots
    7h 59min ago
    Corning sees CPO and glass core as new semiconductor battlegrounds
    7h 59min ago
    China optical transceivers avoid US FCC curbs as NPO and CPO compete in high-speed links
    7h 59min ago
    China's AIDC token costs hinge on access to advanced GPUs
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    NEWS TAGGED IC MANUFACTURING
    Monday 14 September 2026
    CPO nears mass production — next battle about interfaces, yield and maintenance
    As AI computing bandwidth keeps rising, optical interconnect architectures are moving beyond pluggable optical modules toward near-packaged optics (NPO) and co-packaged optics (CPO)...
    Monday 14 September 2026
    AI server tracker: Taiwan ASIC design houses diverge as AI projects enter different revenue cycles
    Taiwan's ASIC design-service suppliers all posted year-over-year revenue growth in August 2026, but the underlying figures point to sharply different stages of the custom-silicon c...
    Monday 14 September 2026
    AI server tracker: Taiwan testing suppliers accelerate as AI chip complexity raises interface demand
    Taiwan's semiconductor testing supply chain continued to ride strong AI and high-performance computing (HPC) demand in August 2026, with all four major suppliers posting year-over-year...
    Monday 14 September 2026
    India's chip show nearly doubles in two years, with suppliers leading the build-out
    The exhibitor list for Semicon India 2026 suggests the country's semiconductor push has moved past announcements and into procurement. The show has drawn 535 exhibiting companies,...
    Monday 14 September 2026
    Weekly news roundup: HBM4 strain, Intel price hikes and the next AI infrastructure buildout
    AI demand remained the dominant force across semiconductors, memory, foundry and data-center infrastructure this week. Intel raised CPU prices while Qualcomm and MediaTek targeted...
    Monday 14 September 2026
    India roundup: India says it cannot build electronics without China
    India is accelerating its semiconductor and electronics ambitions, courting Taiwan, easing China restrictions, expanding local manufacturing and chip infrastructure, while global technology...
    Saturday 12 September 2026
    ViTrox sees chip inspection moving upstream as advanced packaging raises defect costs
    Advanced packaging is stretching semiconductor inspection in two directions at once: packages are getting larger while the features inside them are getting smaller.
    Saturday 12 September 2026
    Interview: Resonac maps five PLP hurdles, eyes 510x515mm pilot line
    Advanced packaging is reshaping the semiconductor value chain, making materials innovation a key source of technical breakthroughs. As large-format panel-level packaging (PLP) gains...
    Friday 11 September 2026
    ASE to buy AOI, AVI equipment from Machvision for NT$334M
    ASE announced at a news briefing on September 11, 2026, that ASE's board had approved the purchase of equipment, including automated optical inspection (AOI) and automated visual inspection...
    Friday 11 September 2026
    Taiwan unfazed by Trump's renewed chip tariff threat as MOU already locks in preferential US treatment
    Ahead of Chinese President Xi Jinping's expected visit to the US on September 24, US President Donald Trump has again discussed the issue of bringing chip manufacturing back to the...
    Friday 11 September 2026
    ficonTEC breaks CPO test bottleneck, teams with Hermes Testing
    German silicon photonics (SiPh) test equipment maker ficonTEC has broken through a major bottleneck in co-packaged optics (CPO) "electrical-in, optical-out" testing and launched what...
    Friday 11 September 2026
    Chipmaking equipment spending could hit US$270 billion by 2030, Futurum says
    Global wafer fab equipment (WFE) spending could reach about US$270 billion in 2030 as data center expansion drives demand for advanced logic, high-bandwidth memory (HBM), DRAM and...
    Friday 11 September 2026
    AUO, Innolux accelerate shift from displays to AI, CPO, advanced packaging
    Taiwan's panel makers posted mixed August results as the industry's strategic focus shifts beyond monthly revenue toward AI, advanced packaging and co-packaged optics (CPO). AUO and...
    Friday 11 September 2026
    CIOE 2026: Hitachi relies on partnerships, not proprietary tech, to ride China's optical boom

    At an optoelectronics trade expo in China, Hitachi High-Tech used its booth not to unveil a flagship product of its own, but to showcase...

    Friday 11 September 2026
    Taiwan tech minister in Europe to advance semiconductor cooperation

    National Science and Technology Council (NSTC) Minister Cheng-Wen Wu visited the UK and Belgium in early September to advance Taiwan-Europe...

    2/245 pages
    BIZ FOCUS
    Sep 14, 08:00
    Hauman Unveils Micro LED Testing Breakthrough for AI Optical Interconnects
    Monday 14 September 2026
    Scaling Photonics: Assembly, Test and Fiber Automation at SEMICON Taiwan
    Friday 11 September 2026
    DAS Expands in Taiwan and Unveils World First at SEMICON
    Friday 11 September 2026
    Toward Technologies Redefines Relay Solutions at SEMICON Taiwan 2026
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