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Tuesday 23 June 2026
SK Hynix Cheongju plant accidents raise HBM expansion safety concerns

SK Hynix's semiconductor production base in Cheongju, South Korea, has seen a string of accidents since 2026, prompting questions over...

Tuesday 23 June 2026
Corsair's reported CXMT DDR5 move puts China DRAM on the global supply-chain map
China's DRAM supply chain is becoming a new variable in the global memory market. CXMT, China's largest DRAM manufacturer, is accelerating its DDR5 expansion. Recent reports stated...
Tuesday 23 June 2026
Japan puts robotics at heart of US$2.3 trillion chip revival

Japan is preparing a sweeping public-private investment strategy totaling more than JPY370 trillion (US$2.3 trillion) by fiscal 2040,...

Tuesday 23 June 2026
High-end fiberglass cloth supply tightens; shortages to persist through 2027

Demand for high-end fiberglass cloth is surging on the AI boom, and orders from copper-clad laminate (CCL) customers are leaving the...

Tuesday 23 June 2026
Wafer Works unveils golden triangle expansion to boost AI, optical, and SiC wafer capacity
Wafer Works announced after its June 18, 2026, shareholders meeting that it launched a "golden triangle" expansion plan to deepen silicon wafer product lines and support fast-growing...
Monday 22 June 2026
AI demolishes traditional tech: how NPUs and AI RAN are rewriting European infrastructure

AI is no longer a localized software novelty. It is now aggressively wiping out traditional hardware infrastructure across Europe....

Monday 22 June 2026
Intel CEO doubles down on advanced packaging with former SK Hynix chief's return
Former SK Hynix CEO Lee Seok-Hee is set to return to Intel as executive vice president (EVP) of Intel's foundry business, strengthening Intel's push into advanced packaging technologies...
Monday 22 June 2026
TSMC glass substrate rollout unlikely before 2030

The race to commercialize glass core substrates in advanced semiconductor packaging is heating up — but the technology is moving...

Monday 22 June 2026
Panjit upgrades hot swap tech to drive 2H26 growth
AI data centers are driving growth in demand for power management and power semiconductor components. Hot swap products, in particular, require a wide safe operating area (SOA) to...
Monday 22 June 2026
Global suppliers race accelerates: TSMC's first CoPoS demo tools enter validation
TSMC is accelerating its CoPoS rollout, replacing traditional round wafers with larger rectangular glass panels to support packaging demand for AI GPUs and HPC chips over the next...
Monday 22 June 2026
Toto reportedly bets bigger on semiconductor materials as AI pushes industry toward 1nm era

Japanese bathroom fixture maker Toto is deepening its commitment to the semiconductor industry, unveiling plans to invest JPY80 billion...

Monday 22 June 2026
Samsung sees ongoing SoC losses drag down System LSI's 2026 performance
In a rare public admission during an internal briefing, Park Yong-In, president of the System LSI Business of the Device Solutions (DS) Division at Samsung Electronics, expressed concern...
Monday 22 June 2026
Weekly news roundup: Micron CEO turns visa rejection into US$1 trillion milestone; Taiwan LED makers look beyond lighting
Below are the most-read DIGITIMES Asia stories from the week of June 15-21, 2026:
Monday 22 June 2026
MSScorps expands Taiwan investment again for silicon photonics

Taiwan's investment office, InvesTaiwan, under the Ministry of Economic Affairs, has approved expanded Taiwan investment plans from...

Monday 22 June 2026
Ma-tek ramps silicon photonics testing investment with first system due in August

Semiconductor testing and analysis service provider Ma-tek held its annual shareholders' meeting on June 18. Chairperson Yong-Fen Hsieh...