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    NEWS TAGGED IC MANUFACTURING
    Friday 5 June 2026
    TSMC says AI demand is straining entire supply chain, not just chipmakers
    TSMC chairman C.C. Wei said on Wednesday that AI demand is rising so quickly that the whole supply chain is struggling to keep up, with bottlenecks spanning power, chip capacity, equipment,...
    Friday 5 June 2026
    South Korea's only SRAM-CIM IP firm Articron targets edge AI
    South Korean semiconductor IP startup Articron is challenging the traditional AI chip design bottleneck by using a memory-centric architecture, with its self-developed SRAM-CIM compute...
    Thursday 4 June 2026
    Samsung's rumored CIS production shift highlights industry debate over fab ownership
    Samsung Electronics' decision to place a key image sensor production line under its System LSI division highlights a broader question facing the CMOS image sensor (CIS) industry: whether...
    Thursday 4 June 2026
    TSMC chairman dismisses rival cluster pushes, says Taiwan's supply chain remains unmatched
    TSMC chairman C.C. Wei spoke at a media briefing on June 4, 2026, after the company's shareholders' meeting. South Korea's push to build a semiconductor cluster, Arizona's efforts...
    Thursday 4 June 2026
    TSMC shareholders clear record 2025 results, putting AI capacity roadmap in focus
    TSMC shareholders approved the company's 2025 business report and financial statements at its 2026 annual shareholders' meeting on June 4, giving investors a formal look at a year...
    Thursday 4 June 2026
    LG Innotek targets Intel EMIB substrate chain with SK Hynix samples

    LG Innotek is seeking to enter the supply chain for substrates used in Intel's EMIB advanced-packaging technology, supplying early samples...

    Thursday 4 June 2026
    TSMC chair says CoPoS could scale within years while downplaying risk from Terafab
    Taiwan Semiconductor Manufacturing Co. (TSMC) told shareholders on June 4 that the AI surge is creating major opportunities, but also leaving TSMC with the bulk of the investment and...
    Thursday 4 June 2026
    Southern Taiwan Science Park January-April 2026 revenue tops NT$1 trillion on AI boom
    Driven by the booming semiconductor industry, the Southern Taiwan Science Park (STSP) posted revenue of nearly NT$1.1 trillion (approx. US$35.04 billion) for January to April 2026,...
    Thursday 4 June 2026
    TSMC sees no sign of capex slowdown as demand stays strong
    TSMC chairman C.C. Wei told shareholders on June 4 that the company sees no reason to cut capital spending, citing strong demand for advanced chips, continuing expansion in the US,...
    Thursday 4 June 2026
    Applied Materials to add 1,000 Southeast Asia jobs as Singapore role grows

    Applied Materials plans to expand its Southeast Asia workforce by about 25% this year, adding at least 1,000 workers mainly in Singapore...

    Thursday 4 June 2026
    EU launches Technology Sovereignty Package to strengthen chips, AI, and cloud infrastructure
    The European Commission has unveiled a comprehensive Technology Sovereignty Package aimed at strengthening Europe's capabilities in semiconductors, AI, cloud infrastructure, open-source...
    Thursday 4 June 2026
    Huawei's Tau Law shifts AI chip race to glass substrates, advanced packaging
    Huawei's recently proposed "Tau Law" suggests that reducing signal transmission distance, combined with heterogeneous integration and system-level optimisation, can enhance computing...
    Thursday 4 June 2026
    Exclusive: How China's subsidized SiC boom is driving global prices to the floor
    China's silicon carbide (SiC) substrate manufacturers continue to slash prices despite already operating on razor-thin margins, underscoring the intensity of a price war reshaping...
    Thursday 4 June 2026
    Exclusive: China tightens its grip on Silicon Carbide as the industry shifts to 8-inch wafers
    At Computex 2026, much of the spotlight fell on the rapid evolution of AI data center infrastructure. Among the technologies drawing renewed attention was silicon carbide (SiC), a...
    Thursday 4 June 2026
    SK and TSMC deepen HBM, advanced packaging tie-up
    SK Group Chairman Chey Tae-won met TSMC Chairman C.C. Wei in Taiwan on June 3, as the two sides exchanged views on the latest trends in next-generation AI technologies and discussed...
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    Research Report Database
    BIZ FOCUS
    Jun 1, 08:00
    LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
    Friday 29 May 2026
    Datotek Introduces AI PSSD Sustainable Storage Solutions at COMPUTEX 2026
    Thursday 28 May 2026
    VIA Labs Announces Hub Controllers for Multi-Display USB-C Docking
    Thursday 28 May 2026
    AGI Debuts DDR5 R-DIMM and Smart Industrial Solutions at COMPUTEX 2026
    CPC
    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook