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    Qualcomm unveiled Dragonfly data center push, with Microsoft and Meta orders in hand
    Jun 25, 17:52
    BOE added to US military-linked list as South Korean panel makers see an opening
    Jun 25, 17:52
    Taiwan revives NT$210 billion drone procurement plan amid industry hopes and concerns
    Jun 25, 17:51
    SK Hynix pushes 2027 launch for Yongin triple-deck fab
    Jun 25, 17:51
    Gwangju eyes a Taiwan-style semiconductor cluster
    Jun 25, 17:51
    Google lost two AI stars as talent concerns deepened
    Jun 25, 17:51
    NEWS TAGGED IC MANUFACTURING
    Thursday 25 June 2026
    TSMC 3nm lead times surpass one year as Samsung faces Intel in foundry push
    As demand for AI chips surges, the battle for foundry orders is heating up. South Korean industry sources say the next 2-3 years will be a critical period for Samsung Electronics'...
    Thursday 25 June 2026
    ByteDance's reported AI chip orders mark breakthrough for Chinese GPU maker Iluvatar CoreX
    ByteDance's reported plan to purchase at least 50,000 AI inference chips from Shanghai-based GPU developer Iluvatar CoreX could become one of the most significant commercial wins yet...
    Thursday 25 June 2026
    IC design firms race to secure packaging capacity
    IC design firms are scrambling to expand their partner networks as tight packaging and testing capacity remain the most pressing bottleneck in the supply chain. Companies in Taiwan,...
    Thursday 25 June 2026
    Techzone builds circular economy to tap rising semiconductor expansion demand
    Techzone Technology Materials, a provider of one of Taiwan's few integrated waste treatment, renewable energy, and recycling solutions, is actively addressing the waste treatment demand...
    Wednesday 24 June 2026
    Global market for advanced chip packaging set for rapid expansion
    The market for fan-out panel-level packaging(FOPLP) and glass substrate packaging is set to grow sharply as chipmakers race to support AI and high-performance computing. For global...
    Wednesday 24 June 2026
    Qualcomm, ByteDance talks signal new phase in China AI chip diversification
    Qualcomm's reported talks to provide custom chip-design services to TikTok owner ByteDance show how China's AI chip supply chain is moving beyond a simple Nvidia replacement story.
    Wednesday 24 June 2026
    IBM targets Anderon venture to anchor quantum wafer supply
    IBM is building a foundry to produce silicon wafers used in quantum-computing processors, seeking to become an indispensable part of the quantum economy under development. Called Anderon,...
    Wednesday 24 June 2026
    Samsung, SK Hynix weigh new Korean chip belt as concerns mount for Yongin cluster

    South Korea's government is in talks with Samsung Electronics and SK Hynix over a potential new phase of large-scale semiconductor investments,...

    Wednesday 24 June 2026
    Samsung eyes Galaxy Ultra for 2nm Exynos 2700

    Samsung Electronics' System LSI division is pressing its mobile business to expand adoption of the in-house Exynos 2700 processor beyond...

    Wednesday 24 June 2026
    Former SMIC CEO targets China photomask IPO after 12-inch wafer bet
    Former SMIC CEO Tzu-yin Chiu is extending his semiconductor materials strategy into photomasks, one of the most critical upstream links in chip manufacturing. Guangzhou Xinrui Photomask...
    Wednesday 24 June 2026
    China's chip-equipment push starts to weigh on Japanese suppliers

    China's push to build a domestic semiconductor equipment industry is beginning to cut into revenue at major Japanese toolmakers, with...

    Wednesday 24 June 2026
    AI server VRM shifts drive power shortages and stretch lead times past 6 months
    The AI boom is accelerating upgrades in thermal management and power management, and it is also triggering a revolution in voltage regulator module (VRM) architecture, with workloads...
    Wednesday 24 June 2026
    China CMP tool leader Hwatsing seeks US$550M to close chip equipment gap
    Hwatsing Technology, China's leading domestic supplier of chemical mechanical planarization (CMP) equipment, is seeking up to CNY4 billion (approx. US$552 million) through a private...
    Wednesday 24 June 2026
    Samsung's Texas fab gains momentum with the arrival of ASML engineers

    Samsung Electronics' foundry plant in Taylor, Texas, is showing signs of moving into equipment-level execution. Key engineers from ASML...

    Wednesday 24 June 2026
    JEDEC reportedly approves SPHBM4 standard to broaden HBM4 packaging and boost glass substrate prospects
    JEDEC finalized a new HBM4 packaging specification called SPHBM4 that aims to broaden high bandwidth memory (HBM) use cases by reducing packaging complexity and cost, industry sources...
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    BIZ FOCUS
    Jun 1, 08:00
    LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
    Friday 29 May 2026
    Datotek Introduces AI PSSD Sustainable Storage Solutions at COMPUTEX 2026
    Thursday 28 May 2026
    VIA Labs Announces MST Hub Controllers for Multi-Display USB-C Docking
    Thursday 28 May 2026
    Retronix Launches Sparrow Hawk Edge AI Computing Platform Worldwide
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    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook