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Tuesday 9 December 2025
Baidu evaluates Kunlun chip spin-off for Hong Kong IPO, but offers no guarantee
Baidu has responded to reports that its in-house chip business, Kunlunxin, is planning a separate listing on the Hong Kong Stock Exchange by stating it is currently evaluating the...
Tuesday 9 December 2025
Moore Threads CEO leverages Nvidia legacy to challenge GPU giant
In a global GPU market dominated by US-based Nvidia, Chinese startup Moore Threads is rapidly emerging as a formidable local challenger. The driving force behind this bold counterattack...
Tuesday 9 December 2025
Samsung moves to narrow gap with TSMC as silicon photonics race heats up
Samsung Electronics is accelerating development of silicon photonics (SiPh) technology in an effort to solve bottlenecks in advanced AI processors and narrow the competitive gap with...
Tuesday 9 December 2025
Analysis: Why isn't Huawei trying to win the tech war?
Huawei founder Ren Zhengfei recently gave a public talk at the Huawei Lianqiuhu R&D Center in Shanghai. He shared insights on AI, quantum computing, computing power, and chips...
Monday 8 December 2025
Exclusive: Ex-TSMC R&D VP talks advanced packaging and CoWoS
Former TSMC R&D vice president Douglas Yu shared insights on the evolution of advanced packaging technologies like CoWoS, InFO, and SoIC, highlighting their critical role in extending...
Monday 8 December 2025
Samsung reportedly gains momentum in foundry and memory with improved 4nm yields
Samsung Electronics is reportedly gaining momentum across its foundry and memory operations as higher yields on its 4nm process and a broad recovery in DRAM demand position the company...
Monday 8 December 2025
Geopolitics push AI chip packaging into Taiwan-US duopoly
Geopolitical realignments are accelerating a reshaping of the global outsourced assembly and test (OSAT) landscape. Industry analysts say that over the next five years, advanced AI-chip...
Monday 8 December 2025
TSMC expansion to drive record earnings for Taiwan engineering contractors through 2026

Taiwan's leading construction engineering contractors are on track to post record results in 2026 as TSMC accelerates advanced fab expansion...

Monday 8 December 2025
Weekly news roundup: TSMC veteran's Intel move sparks debate, Samsung reportedly secures TPU HBM4 nod, Korean memory firms tighten supply as DRAM prices surge
These are the most-read DIGITIMES Asia stories in the week of December 1 to December 7, 2025.
Monday 8 December 2025
Ritek revives growth by becoming an AI infrastructure dark horse

Ritek Group CEO Wang Ting-chang said the group has long invested in AI-linked fields such as power, semiconductor materials, and packaging...

Sunday 7 December 2025
South Korea bets on airport GSE to break 90% power chip import lock
South Korea is racing to slash its more than 90% dependence on imported power semiconductors. Industry leaders warn that this reliance threatens the country's competitiveness in electric...
Saturday 6 December 2025
Huawei patent reveals DUV method to replicate 2nm-class chipmaking without EUV
A newly released filing from China's National Intellectual Property Administration (CNIPA) shows Huawei submitted a patent in June 2022 outlining a method to achieve 2nm-class metal...
Saturday 6 December 2025
Fabship takes chip manufacturing into orbit as industry eyes Space-based fabs

As artificial intelligence (AI) accelerates the global semiconductor race—and as commercial space activity heats up—the idea...

Saturday 6 December 2025
Taiwan taps tech strengths to accelerate smart healthcare push

Taiwan's smart-healthcare sector is gaining momentum, powered by decades of accumulated expertise in electronics and information and...

Friday 5 December 2025
UMC expands US supply chain with 8-inch wafer MOU with Polar Semiconductor
UMC has finalized plans to invest in the US semiconductor manufacturing sector by signing a memorandum of understanding (MOU) with American foundry Polar Semiconductor on December...