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    CXMT valuation gap highlights uncertainty over China’s DRAM push
    1h 4min ago
    Interview: Memory makers’ expansion drives up material costs and exposes FOUP shortages
    1h 4min ago
    BYD accelerates in-house chip push with 4nm Xuanji A3
    1h 4min ago
    Intel China adds day 0 support for MiniMax H3 after DeepSeek
    1h 4min ago
    L&F Plus ships first samples from South Korea’s first LFP cathode mass-production line
    1h 6min ago
    NEWS TAGGED IC MANUFACTURING
    Monday 3 August 2026
    Samsung's GaN rumored setbacks threaten foundry launch, leaving it racing to close reliability gap
    Samsung Electronics' gallium nitride (GaN) foundry effort has reportedly suffered another setback, with high-temperature reliability failures potentially pushing mass production into...
    Monday 3 August 2026
    Weekly news roundup: Intel revives DDR4, Samsung challenges TSMC at 2nm, Qualcomm raises chip prices
    AI-driven chip shortages, rising memory costs and intensifying foundry competition dominated the technology sector, with Intel reviving DDR4 platforms, Qualcomm raising prices, Samsung...
    Monday 3 August 2026
    Doosan's SK Siltron acquisition reshapes semiconductor supply chain, accelerates AI-focused portfolio shift
    Doosan Group's agreement to acquire a controlling stake in SK Siltron for KRW2.3 trillion (US$1.6 billion) will expand its semiconductor footprint from materials and testing into wafer...
    Monday 3 August 2026
    India roundup: R&D hubs, domestic tooling, OSAT investments, and AI hubs are powering India’s chip push

    India is expanding its semiconductor ambitions through new R&D centers, indigenous design...

    Monday 3 August 2026
    FICG launches Singapore-Malaysia dual-core strategy
    FICG's advanced manufacturing subsidiary PRO3C signed a memorandum of understanding (MOU) with AME Elite Consortium Berhad, a Malaysia-listed integrated industrial space solutions...
    Sunday 2 August 2026
    Memory costs overtake smartphone chip costs as SoC shipments are set to fall 14%
    Memory costs have moved ahead of smartphone system-on-chip (SoC) costs, and Counterpoint Research said the shift was already reshaping handset pricing and demand. The research firm...
    Sunday 2 August 2026
    ESMT posts record second-quarter profit on higher contract memory prices
    Elite Semiconductor Microelectronics Technology (ESMT) reported a record second-quarter 2026 profit as contract prices rose for niche memory products, lifting results sharply from...
    Saturday 1 August 2026
    AUO commits US$721M to TGV, glass core and CPO expansion
    AUO sold three factories within two days, with disposal gains expected to reach NT$17.7 billion (approx. US$548 million). Chairman Paul Peng said the proceeds would be reinvested in...
    Saturday 1 August 2026
    Obituary: Powerchip chairman Frank Huang dies after reshaping Taiwan's DRAM and foundry industry

    Powerchip Semiconductor Manufacturing Corp. (PSMC) chairman Frank Huang died on July 31, 2026, at age 76, closing a career that spanned...

    Saturday 1 August 2026
    Posiflex revenue rises 46% in the second quarter on Europe and Asia demand
    Posiflex Technology reported a sharp sequential rebound in the second quarter of 2026, with consolidated revenue climbing 46% to NT$5.183 billion (US$160.3 million). The industrial...
    Saturday 1 August 2026
    At OCP's Taiwan summit, servers take a back seat to optics and advanced packaging

    When the agenda for this year's OCP APAC Summit landed, seasoned observers noticed something unusual. TSMC, Applied Materials, Advantest,...

    Friday 31 July 2026
    Exclusive: Asian chipmakers' shift to US helium raises concentration risk
    Chipmakers in Taiwan, South Korea, and Japan have avoided broad helium-related production disruptions so far, but their rapid shift toward US supply is creating a new concentration...
    Friday 31 July 2026
    ASE lifts 2026 capex to record US$10.5 billion, expects LEAP revenue to double in 2027

    Driven by robust AI-related demand for advanced packaging and testing, ASE Technology Holding has raised its 2026 capital expenditure...

    Friday 31 July 2026
    Samsung chip engineers eye SK hynix as AI-driven bonus gap fuels talent war
    Nvidia CEO Jensen Huang recently appeared alongside SK Group Chairman Chey Tae-won and Samsung Electronics Executive Chairman Lee Jae-yong at a high-profile AI gathering in San Francisco,...
    Friday 31 July 2026
    Tokyo Electron raises outlook as AI data center spending lifts memory demand
    Tokyo Electron lifted its operating profit outlook for April-September 2026 on July 30, citing continued investment in AI data centers and stronger semiconductor capital spending....
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    Jul 30, 08:00
    EDOM Accelerates Edge AI Deployment with NVIDIA Technologies
    Monday 1 June 2026
    LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
    Thursday 30 July 2026
    ACCM Introduces Celeritas SMC: A Production-Ready, Silicon-Matched Core for Advanced Packaging
    Wednesday 29 July 2026
    Arrow Drives System-Level Design, Turning Complexity into Competitive Advantage
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