News tagged IC manufacturing at DIGITIMES

NEWS TAGGED IC MANUFACTURING

Friday 17 July 2026

South Korean suppliers ramp up hybrid bonding R&D beyond HBM5

As high-bandwidth memory (HBM) stacks add more layers, requirements for chip-to-chip bonding accuracy and signal transmission efficiency are becoming more demanding.

Friday 17 July 2026

Taiwan backs TSMC's US expansion while reaffirming advanced chip leadership at home

TSMC said on July 16 that it will add US$100 billion to its US investment, bringing the total to US$265 billion. Taiwan's Executive Yuan said it respects companies expanding in the...

Friday 17 July 2026

AI-driven chip price increases put automakers on alert as shortages stay limited

Semiconductor suppliers have begun rolling out one to two rounds of price increases and tighter allocations in the first half of 2026 as demand from GenAI, geopolitical tensions and...

Friday 17 July 2026

South Korean bill could let SK Hynix bring in outside investors for new fabs

A South Korean lawmaker has introduced a bill that would allow a second-tier subsidiary of a general holding company to retain a stake...

Friday 17 July 2026

CPU demand rebounds in AI data centers as TSMC stands to benefit across architectures

Taiwan Semiconductor Manufacturing Company (TSMC) held its second-quarter 2026 earnings conference on July 16, where chairman and CEO...

Friday 17 July 2026

Cica-Huntek opens Arizona plant to support advanced chip manufacturing in the US

Cica-Huntek Chemical Technology said on July 16 that its subsidiary facility in Phoenix, Arizona, had been completed and officially opened after about US$8 million in investment. The...

Friday 17 July 2026

China's AI chips hit three walls — and bet on 3D memory to break through

China's AI chip industry is moving beyond a contest over process nodes and into a broader race involving memory, advanced packaging, chip interconnects and system architecture.

Thursday 16 July 2026

C.C. Wei on EMIB, memory envy, and why TSMC won't squeeze its customers

TSMC Chairman and CEO C.C. Wei used the company's second-quarter 2026 earnings call to push back on two narratives gaining traction among analysts: that rival packaging technologies...

Thursday 16 July 2026

TSMC says 2nm has four times as many tape-outs as 3nm at the same stage

Customer tape-outs for TSMC's N2 process have reached four times the number recorded by its 3nm technology at the same stage, showing faster design activity as the foundry ramps production...

Thursday 16 July 2026

AI chips are running hotter — and Niching is betting its future on keeping them cool

As AI chips and HPC chips continue to draw more power, major advanced packaging orders at ASE, Powertech Technology, and Amkor remain strong, lifting demand for heat spreaders. Semi-conductor...

Thursday 16 July 2026

Taiwan OSATs expand non-China capacity with US and SEA push

As the global AI boom drives up demand for semiconductor packaging and testing, Taiwan's OSAT players are accelerating overseas capacity expansion beyond their home market and China...

Thursday 16 July 2026

TSMC boosts US investment by US$100B as C.C. Wei outlines long-term capacity planning with customers

To address structural long-term growth in semiconductor demand, TSMC chairman C.C. Wei said the company works closely with customers...

Thursday 16 July 2026

TSMC eyes record quarter: 2nm ramp drives 3Q26 guidance above US$44B

TSMC is projecting its strongest quarter ever, guiding third-quarter 2026 revenue to between US$44.6 billion and US$45.8 billion on...

Thursday 16 July 2026

TSMC lifts 2026 revenue growth above 40% on strong AI demand from cloud giants

TSMC expressed strong confidence during its July 16 earnings conference that demand for its advanced process technologies remains robust,...

Thursday 16 July 2026

TSMC 2Q26 profit surges 77% to a record on AI demand, first 2nm revenue

TSMC reported record second-quarter 2026 results on July 16, with revenue, profit, and earnings per share all surpassing market expectations,...

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