The AI accelerator market is set to reach US$1.4 trillion by 2030, up 150% from Bloomberg Intelligence's January 2026 estimate of US$560 billion, as higher prices—not just shipment...
Hua Hong Group signed strategic agreements with four Chinese semiconductor equipment suppliers at the inaugural 2026 China Integrated Circuit Exhibition (China Chip Exhibition) in...
Japanese semiconductor materials giant TOK is expanding its production footprint in Koriyama, Fukushima Prefecture, to strengthen its position in the global semiconductor materials...
The contest for leadership in AI computing is being fought on two fronts—technology and manufacturing capacity—and chipmakers must advance chips, memory, advanced packaging...
King Yuan Electronics (KYEC) has signed a prepayment agreement with Nvidia to support its wholly owned US subsidiary, AeternZ, in building local testing capacity, giving Nvidia early...
Qualcomm is pushing to cut edge AI's energy cost as phones, cars, and other devices face tighter power and cooling limits than data centers. At the opening of Applied Materials' EPIC...
Taiwanese semiconductor testing services provider King Yuan Electronics (KYEC) is expanding its US footprint, with its board approving an advance payment agreement with Nvidia. Under...
Senior executives from TSMC, Intel, and Samsung Electronics outlined the growing challenges of AI chip development, spanning advanced semiconductor processes, 3D integration, and research...
SEMI announced at a media event during SEMICON West 2026 that the exhibition will move to Phoenix, Arizona, in 2027 and shift to a spring schedule. SEMI Americas President Joe Stockunas...
GlobalFoundries' plan to build a 7nm-class chip process in Dresden without extreme ultraviolet (EUV) lithography tests how a second-tier foundry can stay relevant while TSMC holds...
Applied Materials used its investor day to argue that AI will let it outgrow the chip equipment market through 2030. Investors, however, focused on what the company left out: a forecast...
GlobalFoundries (GF) and TSMC have reached a manufacturing agreement to establish a US-based supply source for silicon interposers supporting TSMC's CoWoS advanced packaging ecosystem...
As AI reshapes the global computing landscape, former Intel CEO Pat Gelsinger said AI is making chip design easier, while physical bottlenecks in manufacturing, memory, and energy...
Industrial gas supplier Linde LienHwa is expanding its industrial decarbonization applications, with oxygen-enriched combustion technology adopted by Taiwan Cement, Walsin Lihwa, Jin...
Chinese researchers have demonstrated wafer-scale graphene quantum rectifiers that convert weak radio-frequency signals into DC electricity at room temperature without an external...
