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Friday 14 August 2026
Musk hints at FEL light source for Terafab; ASML eyes FEL-EUV push
After EVs, rockets, and humanoid robots, Elon Musk appears to be turning his attention to optimizing the chip manufacturing process. When he unveiled a US$16.8 billion initial investment...
Friday 14 August 2026
Samsung chip design embraces AI, but loss of control and hallucinations remain a problem
The AI wave is sweeping through the chip industry, but hallucinations, loss of control, and cybersecurity risks remain unresolved even as efficiency leaps. Youngsik Kim, head of the...
Friday 14 August 2026
Cerebras raises 2026 outlook as hardware sales weaken
AI chip startup Cerebras Systems raised its full-year 2026 core revenue and gross margin outlook after reporting second-quarter results, but the company also disclosed declining hardware...
Friday 14 August 2026
SK Hynix advances Yongin fab construction for 2027 cleanroom launch
SK hynix has pushed construction of its semiconductor campus in Yongin, Gyeonggi Province, South Korea, to 87% completion as it targets February 2027 for the start of operations at...
Friday 14 August 2026
Rapidus targets 8-reticle interposers by 2030
Rapidus expects interposers for high-performance chips to reach eight-reticle scale by around 2030, as larger chiplets and high-bandwidth memory (HBM) push advanced packages toward...
Friday 14 August 2026
Samsung and SK hynix push AI deeper into fabs as semiconductor manufacturing enters autonomous era
As the world enters an AI-powered era where the persistent need for more complex architectures is driven by rising demands for higher computing performance, one bottleneck confronting...
Friday 14 August 2026
ABF substrate boom lifts Eternal Precision prices 20%

Strong Ajinomoto Build-Up Film (ABF) substrate demand has driven a surge in orders for vacuum laminating equipment, with Eternal Precision...

Friday 14 August 2026
Beyond silicon and copper: OCP APAC looks under the hood of future AI infrastructure
AI's appetite for compute is growing at such speeds that simply building bigger versions of today's data centers may no longer cut it.
Friday 14 August 2026
Korea's CNT pellicle race heats up as aweXome Ray pushes toward EUV commercialization
As South Korea's major memory manufacturers race to secure next-generation lithography technologies for increasingly advanced process nodes, the approaching High-NA EUV era is adding...
Friday 14 August 2026
Grand Process's Challentech partners with Japan's Seiki for bonding tech

Artificial intelligence (AI) and high-performance computing (HPC) continue to drive demand for advanced packaging, where bonding technology...

Thursday 13 August 2026
Taiwan's packaging and integration ecosystem positions it as the backbone of CPO scaling, Ayar Labs says

The technical feasibility of co-packaged optics (CPO) has been demonstrated repeatedly at major industry conferences in recent years...

Thursday 13 August 2026
Samsung delays High-NA EUV adoption until 1nm production in 2030
Samsung Electronics plans to introduce high-numerical-aperture extreme ultraviolet (High-NA EUV) lithography into mass production at its 1nm node around 2030, according to South Korean...
Thursday 13 August 2026
LandMark Optoelectronics posts surge in profit on silicon photonics demand
LandMark Optoelectronics Corp. reported a sharp jump in revenue, margins, and profit in the second quarter of 2026, driven by strong demand for silicon photonics products and higher...
Thursday 13 August 2026
SK Hynix expands EUV roadmap with High-NA tools and PSM adoption
SK hynix said it is advancing its use of extreme ultraviolet (EUV) lithography for the mass production of next-generation DRAM, with high-numerical-aperture (High-NA) EUV equipment...
Thursday 13 August 2026
LX Semicon starts mass producing automotive MCU for Hyundai Motor, Kia
LX Semicon has begun mass production of an automotive microcontroller unit (MCU) and started supplying the chip to Hyundai Motor and Kia, marking the first time the two automakers...