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Tuesday 3 June 2025
SoftBank and Intel forge AI memory venture to challenge HBM dominance
Japan's SoftBank has partnered with Intel to co-develop cutting-edge DRAM tailored for AI applications, aiming to challenge the incumbent High Bandwidth Memory (HBM) technology. The...
Tuesday 3 June 2025
Samsung upgrades capacity layout, reportedly transforming old memory lines into packaging mainstay
Samsung Electronics is reportedly repurposing its existing facilities to bolster its advanced semiconductor packaging capabilities, aiming to enhance competitiveness in the rapidly...
Tuesday 3 June 2025
TSMC denies Middle East fab rumors, stays mum on potential price hikes
Taiwan Semiconductor Manufacturing Company (TSMC) chairman C.C. Wei firmly denied speculation that the company is considering setting up a fab in the Middle East.
Tuesday 3 June 2025
TSMC eyes record-high 2025 revenue despite currency hit and tariff pressures, says chair
Taiwan Semiconductor Manufacturing Company (TSMC) chairman C.C. Wei addressed key concerns on June 3, 2025, during a shareholder meeting, touching on currency volatility, global trade...
Tuesday 3 June 2025
TSMC and UMC struggle with strong NT$; Largan faces record foreign exchange losses
The tariff war has temporarily paused, but the biggest challenge currently facing the semiconductor and technology industries is the sharp appreciation of the New Taiwan dollar (NT$)...
Tuesday 3 June 2025
Taiwan AI export surge faces 2H25 reality check after tariff-driven rush
As much of the world's manufacturing sector stalls under macroeconomic strain and geopolitical uncertainty, Taiwan is experiencing an extraordinary export boom—driven not by...
Tuesday 3 June 2025
Nittobo announces 20% price increase on fiberglass products
Leading Japanese glass cloth manufacturer Nittobo Boseki announced on June 2, 2025, that it will increase the price of certain fiberglass products in its composite materials business...
Tuesday 3 June 2025
Chip packaging material shortage deepens as top supplier raises prices 20%
Rising artificial intelligence chip demand has strained supplies of critical materials used in advanced semiconductor packaging, with Japan's Nittobo announcing price increases of...
Tuesday 3 June 2025
Samsung recruits former TSMC, NXP exec to lead US foundry push
Samsung Electronics' Device Solutions (DS) division has appointed former TSMC and NXP Semiconductors executive Margaret Han as vice president of its North American wafer foundry business,...
Tuesday 3 June 2025
Tata Electronics reportedly eyes Malaysia for semiconductor acquisition to bolster ATMP capabilities

Tata Electronics is reportedly in advanced talks to acquire a semiconductor facility in Malaysia,...

Tuesday 3 June 2025
South Korean exports to the US and China fall sharply, but semiconductor sales hit record high

South Korea's exports to the US and China tumbled by more than 8% in May, reflecting growing pressures from global trade tensions and...

Monday 2 June 2025
Xiaomi's XRing O1 stirs 'self-developed' chip debate with Arm DNA and custom AI engines
Xiaomi Chairman Lei Jun unveiled the company's debut in-house mobile SoC, the XRing O1, on May 22, calling it Xiaomi's "first answer sheet" in semiconductor design. Built on TSMC's...
Monday 2 June 2025
Trump holds reins on Wolfspeed's future as foreign buyers balk at 'Made in USA' cost burden
Wolfspeed, the US leader in silicon carbide (SiC) materials and a key player in the power semiconductor supply chain, has denied recent bankruptcy rumors. However, delays in receiving...
Monday 2 June 2025
Nvidia sees US$8B revenue shortfall as China sales crater, turns to Shanghai R&D for strategic hold
Nvidia revealed on May 29 its fiscal 2026 second-quarter revenue forecast of US$45 billion, with a margin of error of plus or minus 2%.
Monday 2 June 2025
Samsung squeezed: TSMC scales 3nm heights, SMIC cracks 5nm
Samsung Foundry has boosted utilization with fresh 7nm and 8nm chip orders from Nintendo and multiple AI chipmakers. Yet its persistent setbacks at the 3nm node continue to spotlight...