Recent market reports indicate that CoWoP has shown preliminary test results exceeding expectations. Nvidia, which leads its development, is expected to accelerate mass production...
Since its IPO application was accepted by Shanghai's STAR Market in September 2024, Wuhan Xinxin Semiconductor Manufacturing Co. (XMC) has updated its prospectus to highlight its...
Marc Hijink, technology reporter for Dutch newspaper NRC and author of Focus: The ASML Way, introduced his new book at SEMICON Taiwan 2025 on September 12. Speaking...
Former TSMC R&D vice president Jack Sun, who currently serves as senior vice president at National Yang Ming Chiao Tung University (NYCU), emphasized that semiconductors can no...
Facing immense geopolitical risks and skepticism, TSMC has announced a costly long-term plan for expanding production facilities abroad. Among these efforts, the establishment of...
In a significant strategic pivot, Google is preparing to move its custom-built Tensor Processing Units (TPUs) beyond its own cloud infrastructure—marking...
The technological rivalry between China and the US escalated further on September 12, when the US Department of Commerce's Bureau of Industry and Security (BIS) added 23 Chinese companies,...
Foxconn chairman Young Liu reportedly has recently visited the US and met with executives including Alphabet and Google CEO Sundar Pichai, according to industry sources. Meanwhile,...
Hermes-Epitek's semiconductor wafer testing solutions subsidiary, HTSI, will be listed on the over-the-counter (OTC) market on September 17, 2025. President Steven Wang stated that...
Since taking over as CEO in March 2025, Lip-Bu Tan has rolled out sweeping organizational reforms at Intel, from business restructuring to large-scale layoffs. The overhaul has fueled...
Navitas Semiconductor is expanding its portfolio beyond consumer chargers to include advanced power solutions for solar inverters, motor drives, and AI data centers, Senior Field...
India's push to establish itself as a semiconductor hub is beginning to yield results in the back-end packaging segment, with Suchi Semicon moving from presentation slides to actual...
Talent has long been the defining currency in the global semiconductor race. For decades, Chinese-born engineers with deep overseas experience drove China's rapid catch-up, fueling...
To accelerate the development of heterogeneous integration and advanced packaging technologies, the "3DIC Advanced Manufacturing Alliance" was officially established on September...
