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Tuesday 29 September 2026
GlobalFoundries eyes GaN expansion to challenge TSMC in AI

GlobalFoundries (GF) is preparing a major global capacity expansion as TSMC is set to gradually exit gallium nitride (GaN) foundry services...

Tuesday 29 September 2026
GF's MIPS bets on RISC-V physical AI, expands into autos and data centers
MIPS, a GlobalFoundries (GF) unit, said it has completed its integration with the ARC unit acquired from Synopsys earlier this year and is using the move to position RISC-V for physical...
Tuesday 29 September 2026
Chips make up nearly half of South Korea's September exports; China, Hong Kong account for 52% of them
Semiconductors made up nearly half of South Korea's exports in the first 20 days of September, while China and Hong Kong combined accounted for more than half of the country's chip...
Tuesday 29 September 2026
VSMC Singapore fab fully booked as VIS weighs Fab 2
Capacity at VisionPower Semiconductor Manufacturing Company's (VSMC) first 12-inch wafer fab in Singapore is fully booked as the joint venture between Vanguard International Semiconductor...
Tuesday 29 September 2026
TSMC helps VSMC build first Singapore fab in 22 months at lower cost than US
VSMC, the joint venture between Vanguard International Semiconductor (VIS) and NXP Semiconductors, officially opened its first 12-inch wafer fab in Singapore on September 28, completing...
Tuesday 29 September 2026
Vanguard chairman says AI slowdown won't free up chip capacity

Vanguard International Semiconductor (VIS) and NXP Semiconductors' joint venture, VisionPower Semiconductor Manufacturing Company (VSMC),...

Tuesday 29 September 2026
Trump-Xi state dinner puts tech titans at the head table, spotlighting Taiwan's quiet supply chain clout

Chinese President Xi Jinping and his wife, Peng Liyuan, arrived at the White House on the evening of September 24 US time to attend...

Tuesday 29 September 2026
AI server MLCC prices rise as Chinese suppliers gain ground in generic parts

Multilayer ceramic capacitor (MLCC) prices for AI servers have continued to climb, while prices for general-purpose components used...

Tuesday 29 September 2026
AMD pays US$8.2 billion for Fei-Fei Li's 3D world-modeling startup to shape future AI chips
AMD has agreed to acquire World Labs, the San Francisco AI research startup led by Fei-Fei Li, in an all-stock deal valued at about US$8.2 billion. The chipmaker says it wants the...
Tuesday 29 September 2026
Behind CoWoS (part 2): How TSMC turned a niche packaging experiment into an industry standard
As chip design enters the AI era, heterogeneous integration is driving foundry giants like TSMC, Samsung, and Intel to bring advanced front-end fab capabilities into back-end packaging...
Tuesday 29 September 2026
Behind CoWoS (part 1)—How a 0% yield crisis led to TSMC's first advanced packaging win
In a recent interview on the DIGITIMES podcast, Dr. Shin-Puu Jeng, chairman of the International Microelectronics and Packaging Society (IMAPS) and a former longtime TSMC...
Monday 28 September 2026
NXP says Singapore fab with Vanguard is its biggest investment since Freescale
NXP Semiconductors CEO Rafael Sotomayor said the Singapore fab NXP built with Vanguard International Semiconductor (VIS) is NXP's largest investment since it acquired Freescale in...
Monday 28 September 2026
Beyond ASML: China rethinks EUV race with light-source strategy
China is trying to broaden the definition of the extreme ultraviolet (EUV) race. Rather than focusing only on building a domestic equivalent to ASML's lithography platform, Chinese...
Monday 28 September 2026
India roundup: India's tech ambitions widen from electronics manufacturing to chips, cloud and talent
India's technology push is widening across electronics manufacturing, semiconductors, cloud infrastructure and talent, as domestic expansion draws deeper investment, tighter scrutiny...
Sunday 27 September 2026
Beijing escalates domestic chip drive with Broadcom audits

China is intensifying its push to replace foreign technology across critical computing infrastructure, targeting high-speed networking...