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Friday 26 December 2025
AMD wins major Alibaba MI308 chip order to challenge Nvidia H200
Nvidia CEO Jensen Huang recently received US President Donald Trump's approval for the H200 to return to the China market. Shipments to Chinese customers were reportedly fast-tracked...
Friday 26 December 2025
SMEE wins China lithography order, yet ASML still controls advanced-node tools
A disclosure on China's government procurement platform shows that Shanghai Micro Electronics Equipment (SMEE) has won a contract to supply a step-and-scan lithography system valued...
Friday 26 December 2025
Winbond prepares 16nm 8Gb DDR4 mass production for 2026 shipment upgrade
Memory maker Winbond Electronics has recently continued to expand capital expenditures by increasing capacity for 16nm and DDR4 DRAM. As inventories of legacy DDR3 products decrease,...
Friday 26 December 2025
Tariff restraint masks continued hard line as US weighs broader controls on Chinese chip capabilities
The US government has decided not to impose additional semiconductor tariffs on China for the next 18 months, despite concluding that Beijing's state-led chip industry policies involve...
Friday 26 December 2025
South Korean giants race to mass-produce semiconductor glass substrates in 2026
As demand for artificial intelligence (AI) semiconductors continues to surge, the market for glass substrates, which are widely regarded as a critical material for next-generation...
Friday 26 December 2025
ENE Technology eyes custom ICs amid US drone import ban
Microcontroller (MCU) maker ENE Technology has officially entered the drone industry, partnering with Taiwan's HY Tech, Aeroprobing, and Egis to integrate communications, vision modules,...
Friday 26 December 2025
Nvidia reportedly tests Intel 18A process but does not move forward
Intel's 18A process node has reportedly drawn interest from Nvidia, though the chipmaker has yet to commit to using the technology, according to Reuters, citing sources familiar...
Friday 26 December 2025
Exclusive: Ex-TSMC COO discusses how mass production sparked full-scale advancement
J.K. Wang, a veteran leader in the semiconductor industry and former COO of TSMC, shared insights on TSMC's large-scale wafer fab mass production during his first media interview...
Friday 26 December 2025
US and China escalate semiconductor state capitalism amid global supply chain shifts
The semiconductor industry is increasingly central to national strategies as the US and China intensify state-led investments amid growing tech geopolitical tensions. The US CHIPS...
Friday 26 December 2025
FineMat pivots to drones, chip packaging amid China's display supply chain localization
FineMat Applied Materials is retooling its business as China's push to localize its display supply chain cuts into demand for the Taiwanese company's core products, prompting new...
Thursday 25 December 2025
US and European chipmakers lead GaN push for data centers
Gallium nitride power devices are rapidly penetrating AI data centers as soaring electricity demand forces operators to rethink power efficiency and density. The shift is pushing...
Thursday 25 December 2025
TEL Taiwan shake-up: Chairman and president replaced following legal scrutiny
Japanese semiconductor equipment giant Tokyo Electron Limited (TEL) announced on December 24, that it will launch a major organizational restructuring and executive management reshuffle...
Wednesday 24 December 2025
Japanese startup pushes diamond semiconductors toward commercialization in EVs and satellites

A Japanese startup originating from Waseda University, Power Diamond Systems (PDS), showcased its diamond-based semiconductors at SEMICON...

Wednesday 24 December 2025
Unimicron leases Dajia plant to Uniflex, spins off flexible PCB business
Taiwan-based IC substrate maker Unimicron recently announced that it will sublease part of its Taichung Dajia land and factory to its flexible PCB (FPCB) subsidiary Uniflex Technology...
Wednesday 24 December 2025
Innolux shifts FOPLP from volume to validation as US client drives orders, plant closures loom
Chairman Jim Hung said Innolux will deprioritize shipment volume for its fan-out panel-level packaging (FOPLP) business in 2026, shifting its focus to redistribution layer (RDL) and...