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    NEWS TAGGED IC MANUFACTURING
    Monday 5 January 2026
    Japan's Rapidus to launch advanced packaging pilot line in Hokkaido by spring 2026
    Japanese chipmaker Rapidus is advancing its 2nm process technology while developing advanced packaging solutions tailored for AI chips. The company aims to officially start trial...
    Monday 5 January 2026
    Nexchip Semiconductor launches US$5.1bn Hefei fab to scale 28nm mature-node capacity

    China's domestic foundry expansion gained momentum this week as Nexchip Semiconductor broke ground on its Phase IV project in Hefei, committing...

    Monday 5 January 2026
    Weekly news roundup: TSMC widens 2 nm edge as South Korea boosts chip spending; Huawei eyes memory bottlenecks
    These are the most-read DIGITIMES Asia stories in the week of Dec 29 - Jan 4.
    Monday 5 January 2026
    ITC launches formal investigation into Samsung and Google over Netlist patent dispute
    The US International Trade Commission (ITC) announced it has launched an investigation into alleged semiconductor patent infringement involving Samsung Electronics, Google, and Supermicro,...
    Monday 5 January 2026
    Taiwan fortifies silicon shield with 2026 push to set global chip agenda
    As AI server and semiconductor companies look set to close out a profitable 2025, recent Chinese military encirclement exercises and live-fire drills around Taiwan have once again...
    Monday 5 January 2026
    DIGITIMES chair warns against head-on competition with China's strength
    As global tech companies navigate increasingly complex geopolitical tensions and shifting supply chains, strategic positioning against Chinese competitors has become a critical question...
    Monday 5 January 2026
    TSMC's CoWoS outsourcing to ASE and Amkor challenges Samsung
    As its most advanced packaging lines are operating at full capacity, TSMC has transferred part of its advanced packaging orders to outsourced semiconductor assembly and test (OSAT)...
    Monday 5 January 2026
    Trump orders divestment of EMCORE chip assets, tightening US scrutiny of foreign semiconductor deals
    US President Donald Trump has ordered the divestment of certain semiconductor assets of EMCORE Corporation following a national security review that identified risks linked to foreign...
    Monday 5 January 2026
    India roundup: OSAT players claim legacy packaging price parity

    Indian OSAT players aim for price competitiveness on par with Malaysian rivals, as L&T Semiconductor...

    Monday 5 January 2026
    Taiwan power chipmakers bank on AI data centers and auto orders for 2026 growth
    Taiwan's power semiconductor suppliers are positioning for steady growth through 2026. The momentum comes from two fronts: artificial intelligence data centers adopting new power...
    Saturday 3 January 2026
    Micron and GlobalFoundries strengthen Singapore's position in advanced AI chip manufacturing
    Singapore is drawing a new wave of semiconductor investment as global chipmakers expand advanced manufacturing tied to artificial intelligence infrastructure, reinforcing the city-state's...
    Saturday 3 January 2026
    Analysis: Japan targets advanced packaging to crack TSMC's manufacturing edge
    Japanese semiconductor firms are pivoting toward advanced packaging and alternative lithography as TSMC extends its scale advantage in artificial intelligence chips. TSMC's 3nm and...
    Saturday 3 January 2026
    Chang Wah accelerates Asia expansion as chip packaging booms
    Chang Wah Electromaterials and its affiliate Chang Wah Technology are expanding operations across Taiwan, China, and Malaysia as global chipmakers and packaging houses ramp up capacity...
    Saturday 3 January 2026
    Analysis: Chip boom squeezes device makers as surging component costs threaten margins
    The global semiconductor market is projected to reach US$1 trillion as early as 2026, significantly ahead of previous industry forecasts targeting 2030. The World Semiconductor Trade...
    Friday 2 January 2026
    Asus to pause new smartphone launches in 2026, maintain mobile operations
    Smartphone distributors in Taiwan have recently said they are no longer able to obtain Asus handsets through local agents and claimed they had received information indicating that...
    4/208 pages
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    BIZ FOCUS
    Jan 6, 16:39
    MSI Unveils Full Lineup of AI Products at CES 2026
    Tuesday 6 January 2026
    SK hynix Showcases Next Generation AI Memory Innovation at CES 2026
    Tuesday 6 January 2026
    Mobilint Brings Award-Winning Edge AI Hardware to the Global Stage at CES 2026
    Tuesday 6 January 2026
    Skyted's Sound Bubble at CES 2026
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