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Sunday 8 June 2025
Taiwan researchers develop eco-friendly laser tech to cut semiconductor manufacturing costs
A team of researchers in Taiwan has developed an eco-friendly laser-based deposition and patterning technology that can reduce processing time and material costs for manufacturing...
Sunday 8 June 2025
HannStar Board sees tariff-driven boost in early 2025, but cautious outlook for 2H25
HannStar Board, the PCB business unit of Walsin Technology, reported a surge in urgent, tariff-driven pull-ins during the first half of 2025, helping to cushion seasonal revenue declines...
Saturday 7 June 2025
GBM's acquisition of Lincstech: GM says benefits will be gradual
Walsin's PCB business unit, PSA, together with its subsidiary GBM, recently held an investor conference. When the operational benefits from GBM's acquisition of Japan's major PCB...
Saturday 7 June 2025
Taiwanese firms face tariff risks as US business inquiries surge 15%
Dun & Bradstreet identified steel, electrical machinery, mechanical equipment, vehicles, and rubber products as Taiwan's most tariff-vulnerable sectors in a new report on export...
Friday 6 June 2025
LG Display repays loan early, announces KRW700 billion OLED investment push
LG Display (LGD) has announced the early repayment of a KRW1 trillion (approximately US$736 million) loan from parent company LG Electronics, alongside plans to invest KRW700 billion...
Thursday 5 June 2025
South Korea's Lee proposes 10% tax credit for domestic chip production
South Korea's newly elected President Lee Jae-myung has unveiled a flagship policy offering up to 10% production tax credits for semiconductors manufactured and sold domestically,...
Thursday 5 June 2025
Hanmi Taiwan posts record growth as demand for maintenance services and component sales surge
Hanmi Taiwan, the local subsidiary of South Korea's Hanmi Semiconductor, reported explosive growth in the first quarter of 2025, generating 76% of its entire 2024 revenue in just...
Thursday 5 June 2025
TSMC cautious on High NA as ASML unveils its US$400M chipmaking machine
Kevin Zhang, Deputy Co-Chief Operating Officer at TSMC, recently reiterated the company's cautious approach toward adopting High NA EUV lithography tools, emphasizing that TSMC is...
Thursday 5 June 2025
LPKF reportedly enforces glass substrate patents amid intensifying industry competition
German laser technology provider LPKF has begun actively asserting its patents related to semiconductor glass substrate technology, signaling a potentially more aggressive posture...
Thursday 5 June 2025
Taiwan taps Japan’s machinery elite to ride supply chain shift
The Taiwan Association of Machinery Industry (TAMI) recently traveled to Tokyo and Nagoya to discuss machinery cooperation between Taiwan and Japan, which is expected to result in...
Wednesday 4 June 2025
AI server boom drives Japan's Nittobo to hike fiberglass prices by 20%
Japan's Nittobo raised prices for fiberglass cloth by as much as 20% starting in August, marking the first major increase in materials used for AI servers and 5G equipment as supply...
Wednesday 4 June 2025
Coretronic intelligent robotics launches Jupiter AI+ to transform sensors into smart nodes
MEMS Coretronic, a subsidiary of Coretronic Corporation, has unveiled its latest innovation—the "Jupiter AI+ solution"—which integrates artificial intelligence directly...
Tuesday 3 June 2025
Huawei's Hubble shifts gears: from chips to AI, robotics
Huawei launched Hubble Technology Investment Co. in response to US sanctions in 2019, a wholly owned subsidiary aimed at accelerating China's push for semiconductor independence....
Tuesday 3 June 2025
BOE's OLED surge stirs déjà vu for South Korea's display sector
BOE Technology Group is fast-tracking its 8.6-generation (8.6G) OLED production line in Chengdu, raising red flags for South Korean display makers. Having already ceded LCD leadership...
Tuesday 3 June 2025
Samsung upgrades capacity layout, reportedly transforming old memory lines into packaging mainstay
Samsung Electronics is reportedly repurposing its existing facilities to bolster its advanced semiconductor packaging capabilities, aiming to enhance competitiveness in the rapidly...