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Thursday 11 September 2025
CXMT said to target 2026 HBM3E mass production, narrowing gap with Samsung and SK Hynix to 2 years
China's state-backed DRAM maker CXMT is rapidly advancing in high-bandwidth memory (HBM), a market long controlled by Samsung Electronics and SK Hynix. Citing SemiAnalysis, South...
Thursday 11 September 2025
Taiwan showcases breakthroughs in CoWoS and SiC equipment to boost semiconductor self-reliance
The Industrial Development Administration (IDA) of Taiwan's Ministry of Economic Affairs (MOEA) is partnering with 16 local companies to present heterogeneous integration packaging...
Thursday 11 September 2025
TSMC's presence in Kumamoto exceeds expectations as Kyushu sees over 200 new investment projects
TSMC's Japanese subsidiary JASM has completed and started operations at its first wafer fab in Kumamoto. According to Japanese sources, a second wafer fab is already under construction...
Wednesday 10 September 2025
Taiwan expands tax credits to boost investment in advanced smart applications
Taiwan's traditional industries are facing operational pressures from US reciprocal tariffs. However, to encourage companies to invest in the next phase of growth, the Legislative...
Wednesday 10 September 2025
Exclusive: TSMC turns legacy fabs into EUV pellicle powerhouse, signals new front in chipmaking
TSMC has confirmed it will exit gallium nitride (GaN) foundry operations within two years, shutting down production at its 6-inch Fab 2 in Hsinchu Science Park. The company is also...
Wednesday 10 September 2025
C SUN taps into AI packaging boom, diversifies applications to fuel next decade of growth
Taiwan-based advanced packaging equipment provider C SUN Manufacturing, Ltd. (TWSE: 2467), now in its 60th year, is undergoing a critical transformation as it expands from its roots...
Wednesday 10 September 2025
3S will unveil AI empowered formic acid reflow oven for high reliability power module assembly, redefining green, flux-free, low void rate soldering
In the wake of the AI and Electric Vehicle (EV) era, efficient power supply and conversion have become a critical battleground. For over a decade, 3S Silicon Tech has been deeply...
Wednesday 10 September 2025
FOPLP progress is fastest in foundries, slower in testing and panel fabs
Foundries lead in FOPLP advanced packaging development due to their integrated processes, followed by testing firms that leverage existing wafer architectures. Panel fabs face precision...
Tuesday 9 September 2025
TSMC and ASE form 3D IC alliance with 34 members to overcome advanced packaging bottlenecks
To break through the technical, mass production, and yield challenges in advanced packaging processes such as 3D IC and CoWoS, SEMI, together with TSMC and ASE Holdings, has established...
Tuesday 9 September 2025
Five years on, Taiwan's G2C positions local equipment makers at center of AI packaging shift
Soaring demand for AI computing is ushering the semiconductor sector into a fresh cycle of high-speed growth, pushing advanced packaging requirements to new heights. From infrastructure...
Tuesday 9 September 2025
UMT to double capacity by 4Q25 amid surging LEO satellite orders
Universal Microwave Technology (UMT), a Taiwan-based low Earth orbit (LEO) satellite and high-frequency communications provider, announced that its consolidated revenue for August...
Tuesday 9 September 2025
Aplex partners with Adirtek to enter CoWoS supply chain
Industrial PC (IPC) manufacturers have been actively expanding into new application markets in recent years, optimistic about the semiconductor industry's growing demand for full-process...
Tuesday 9 September 2025
China's ACM ships first KrF coater-developer to logic fab as local supply chain advances
As the global semiconductor industry undergoes rapid restructuring, Chinese equipment makers are racing to achieve breakthroughs and scale. ACM Research (Shanghai), Inc. has introduced...
Tuesday 9 September 2025
Taiwan's industrial PC firms expand role in semiconductor supply chain amid rising demand
Taiwan's semiconductor sector continues to assert its significance globally, with surging demand for advanced processing and packaging technologies driving industrial PC (IPC) manufacturers...
Tuesday 9 September 2025
TSMC and OSATs ramp up advanced semiconductor packaging amid AI-driven demand surge
TSMC and major OSAT firms are aggressively expanding their advanced packaging capacity in response to rising demand driven by AI applications. Once considered peripheral, advanced...