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Tuesday 24 June 2025
Samsung to expand 1c DRAM production in 2H25 after significant yield improvements
Samsung Electronics will begin expanding investment in sixth-generation 10nm-class DRAM (1c DRAM) production starting in the second half of 2025. Industry observers interpret this...
Tuesday 24 June 2025
Huahong zeros in on metrology gear to shore up chip supply chain
Amid the global restructuring of semiconductor supply chains, Chinese investors are intensifying bets on critical upstream technologies. China-based Shanghai Huahong's industrial...
Monday 23 June 2025
US semiconductor tariffs could backfire on American tech giants, claims senior Taiwan official
Taiwan saw an impressive surge in exports during the first months of 2025, driven by increased capital expenditures from US cloud service providers and clients advancing order pull-ins...
Monday 23 June 2025
Panel firms up AMOLED investment as Apple eyes MacBook integration
Adoption of AMOLED panels is expanding beyond smartphones into tablets, notebooks and automotive displays, spurring Chinese and South Korean manufacturers to fast-track investments...
Monday 23 June 2025
Chinese graduates seeking semiconductor jobs targeted by scams
Fresh college graduates in China looking to enter the employment force have their hearts set on major players in the semiconductor industry. However, as they rush to submit resumes,...
Friday 20 June 2025
AI boom pushes Wistron to rapidly scale up server production
The demand for AI remains robust, and visibility is high. Wistron President and CEO Jeff Lin noted that most customers are placing rolling 12-month orders, and current demand is expected...
Friday 20 June 2025
Intel-backed SATAS begins pilot line construction at Sharp's factory in Japan
The Semiconductor Assembly Test Automation and Standardization Research Association (SATAS), spearheaded by Intel Corporation in Japan, announced on June 19, 2025, that it has begun...
Friday 20 June 2025
Auto market headwinds offset by AI servers; FHt expands production to capitalize on ASIC growth
Niche PCB manufacturer FHt held its annual shareholders meeting, where general manager Taylor Lee highlighted the strong demand for AI server orders from the ASIC sector in 2025....
Friday 20 June 2025
HBM divide deepens: SK Hynix diversifies, Samsung pulls in-house
SK Hynix is doubling down on diversifying its supply chain for thermal compression bonding (TCB) equipment, crucial for producing high-bandwidth memory (HBM), while Samsung Electronics...
Friday 20 June 2025
China's 15th Five-Year Plan (4): Chip tool upgrade and 're-globalization' at the heart of supply chain reset
Amid ongoing volatility in the global semiconductor landscape, China's chipmaking equipment sector is undergoing a dual transformation centered on intelligent manufacturing and "re-globalization."...
Thursday 19 June 2025
BOE ventures into advanced packaging with glass substrate pilot production line
BOE is advancing its semiconductor glass core substrate (GCS) business. According to South Korean media reports, BOE recently procured equipment for a GCS packaging R&D pilot...
Thursday 19 June 2025
LG Display plans huge investment to boost OLED technology through 2027
LG Display announced a planned investment of approximately KRW1.26 trillion (around US$920 million) to boost its OLED technology capabilities and support its ongoing shift from LCD...
Wednesday 18 June 2025
Fortune Electric secures key Stargate order
Fortune Electric, a leading Taiwanese heavy electrical equipment manufacturer, has become the first from Taiwan to join the US Stargate supplier list amid growing global demand for...
Wednesday 18 June 2025
Fortune Electric optimistic about 2025 prospects; impact from tariffs, exchange rates limited
Heavy electrical equipment maker Fortune Electric has been negotiating with its clients amid the uncertainties in US tariff policies and exchange rate fluctuations, with company president...
Wednesday 18 June 2025
Canon Machinery targets 2026 launch for hybrid bonding tools amid surge in advanced packaging demand
Canon Machinery, a subsidiary of Japan's Canon Inc., is intensifying its development of hybrid bonding technology as it seeks to expand beyond its conventional die-bonding equipment...