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Wednesday 8 October 2025
LG accelerates hybrid bonding development to challenge Hanmi and Hanwha
LG Electronics is accelerating its deployment in the HBM equipment business after reportedly investing in hybrid bonding development. With Hanmi Semiconductor dominating the market...
Wednesday 8 October 2025
Taiwan bets on XR wearables and AI twins to revive struggling panel industry
Taiwan's semiconductor and panel industries were once two of the government-favored sectors with technological advantages. However, China's rapid rise in the panel industry, driven...
Tuesday 7 October 2025
NTT to launch next-gen IOWN optical network infrastructure in 2026
The launch for the next-generation optical communication infrastructure, IOWN (Innovative Optical and Wireless Network), led by Japanese telecom group NTT, is scheduled for 2026....
Tuesday 7 October 2025
Japan to expand export controls on dual-use technologies from October 9
Japan will expand export controls to cover general-purpose machine tools, integrated circuits, drones, radar, navigation, and testing equipment, requiring companies to verify potential...
Tuesday 7 October 2025
China's SiC industry finds high-value exit in Meta's AR supply chain

As the global semiconductor industry eyes the rise of 12-inch silicon carbide (SiC) wafers as potential game-changers in advanced packaging,...

Sunday 5 October 2025
PlayNitride bets on microLED tools to drive its next growth phase
PlayNitride is positioning its mass transfer process equipment as a key "microLED 3D printer" to accelerate mass production and expand applications beyond current panel customers...
Friday 3 October 2025
ASE Technology launches new factory in Kaohsiung to expand advanced semiconductor packaging
ASE Technology Holding has initiated construction of a new K18B factory at the Nanzi Science Park in Kaohsiung to address growing demand in artificial intelligence (AI), automotive...
Friday 3 October 2025
OpenAI and Hitachi sign MOU to develop power and cooling solutions for AI data centers
OpenAI has entered into a strategic cooperation agreement with Hitachi, focusing on power distribution and cooling technologies for artificial intelligence (AI) data centers. The...
Thursday 2 October 2025
South Korea-US visa talks advance, LGES US plant may resume earlier
With progress in visa negotiations between the South Korean and the US governments, LG Energy Solution (LGES) is poised to accelerate construction and operations at its US factory.
Thursday 2 October 2025
China's CNY3.69B compute contract canceled amid delivery doubts
Huatie announced the termination of a CNY3.69 billion(US$518.3 million) five-year GPU cloud computing service contract with an undisclosed Hangzhou company after zero deliveries in...
Wednesday 1 October 2025
US sanctions push YMTC's NAND share below 5% in 2Q25
US sanctions are taking a toll on one of China's top chipmakers, Yangtze Memory Technologies (YMTC), as its share of the global NAND flash memory market has slipped below 5%.
Wednesday 1 October 2025
China's 12-inch SiC leap: SICC, Jingsheng in spotlight
The global race in third-generation semiconductors is intensifying, with larger silicon carbide (SiC) wafers seen as critical to cutting costs and enhancing power device performance...
Tuesday 30 September 2025
TSMC magnetic pull accelerates US expansion among Taiwanese suppliers
The semiconductor supply chain notes that previously, establishing and operating sites in the US was considered costly, and without long-term support from large orders, it was difficult...
Sunday 28 September 2025
SEA emerges as key hub amid shifting PCB supply chains
Taiwan-based Ampoc, a distributor and manufacturer of PCB wet process equipment and semiconductor materials, anticipates increasing overlap between PCB and semiconductor industries...
Sunday 28 September 2025
Hanmi Semiconductor expands into advanced chip packaging for AI era

Hanmi Semiconductor, a rising force in semiconductor equipment manufacturing, is rapidly expanding its influence in the AI hardware ecosystem...