Taiwanese semiconductor wafer probe card maker WinWay Technology has entered a long-term supply agreement with Italy's Technoprobe, a leading probe card manufacturer, and Greater...
Taiwan-based printed circuit board (PCB) manufacturer WUS Printed Circuit announced an ambitious plan on December 11 to drive its high-performance computing (HPC) segment to account...
The US Department of Commerce (DOC) launched a Section 232 national security investigation on April 1, 2025, targeting semiconductors, manufacturing equipment, and related products...
AI data centers are seeing rapidly increasing demand for HPC and big data processing. The shift from traditional copper wiring to fiber optics boosts data transfer rates while lowering...
TSMC, through its Japanese subsidiary Japan Advanced Semiconductor Manufacturing (JASM), has halted construction on its second wafer fabrication facility in Kikuyo Town, Kumamoto...
Japanese semiconductor test equipment manufacturer Advantest has announced the launch of a next-generation memory handler, designed specifically for high-performance memory components...
The global power equipment supply chain is facing a transformer shortage due to the unrelenting AI data center construction and demand for renewable energy. Delivery times for key...
Chinese telecom equipment maker ZTE Corp. is again under regulatory scrutiny, as the US Department of Justice (DOJ) investigates alleged foreign bribery that could lead to more than...
PCB and semiconductor equipment manufacturer Ta Liang Technology reported a surge in orders as AI chip and AI server demand solidifies. Customers have been investing to expand capacity,...
Advanced packaging equipment and wafer reclaim solutions provider Scientech reported consolidated revenue of NT$958 million (US$30.77 million) in November 2025, up 9% sequentially...
Planet Technology reported solid profitability through the first three quarters of 2025, maintaining a gross margin above 46% despite currency pressure. Chairman Jack Chen said recent...
Semiconductor equipment suppliers reveal that TSMC and non-TSMC players, including ASE, Amkor, and UMC, are accelerating the expansion of advanced packaging Chip on Wafer on Substrate...
The SEMICON Japan 2025 exhibition is set to take place in Tokyo from December 17 to 19, 2025, with Topco Scientific (TSC) and its Japanese subsidiary Shunkawa participating alongside...
Cica-Huntek Chemical Technology, a joint venture between Japan's Kanto Chemical and Huntek Systems, has entered the TSMC supply chain. The company has benefited from Kanto Chemical's...
