中文網
  • 繁體
  • 简体
    •
    Trending
    CONNECT WITH US
    Memory price hikes squeeze Samsung smartphone HDI supply
    2h 29min ago
    Samsung foundry S5 shift to DRAM faces major hurdles
    2h 29min ago
    Chinese smartphone price hikes hit Southeast Asia shipments
    2h 29min ago
    China semiconductor equipment makers expand localization into advanced packaging
    2h 29min ago
    Analysis: can Taiwan’s research institutes follow imec’s EUV model?
    2h 29min ago
    South Korea confirms US request for expanded semiconductor investment
    2h 30min ago
    NEWS TAGGED EQUIPMENT
    Saturday 5 September 2026
    Taiwan satellite ground equipment output grows 13%, nears NT$300B

    Taiwan's satellite ground equipment industry posted 13% year-over-year growth in 2025 as local firms push deeper into the low-Earth...

    Saturday 5 September 2026
    Marketech profits hit record in 1H26 on overseas orders
    Marketech International Corp. (MIC) posted record results in the second quarter of 2026, with consolidated revenue of NT$21.2 billion (approx. US$668.6 million), up 48.2% quarter-over-quarter...
    Friday 4 September 2026
    CPO testing shifts to mid-stage to avoid costly failures, Chroma says

    Co-packaged optics (CPO) is forcing chipmakers and equipment suppliers to rethink where testing should take place, as long optical test...

    Friday 4 September 2026
    TSMC urges HBM makers to design for X-ray inspection as packaging grows more complex
    TSMC is calling for future HBM and DRAM designs to become more compatible with X-ray inspection, as increasingly complex advanced packaging makes buried defects harder to detect while...
    Friday 4 September 2026
    MSScorps August revenue hits new high on silicon photonics gains
    MSScorps saw August 2026 revenue post a new single-month high, as global artificial intelligence (AI) computing power continues to expand, driving demand for advanced process technologies,...
    Friday 4 September 2026
    K&S targets CPO, CoPoS growth with expanded TCB advanced packaging roadmap
    Singapore-based semiconductor packaging equipment maker Kulicke and Soffa (K&S) said AI demand is spreading into adjacent applications, lifting 2026 orders for wire bonding equipment...
    Friday 4 September 2026
    Ennostar accelerates AI optical communications with micro LED
    Ennostar is pushing into AI high-speed optical communications and says Taiwan's full supply-chain ecosystem could bring micro LED into commercial use sooner than expected. Andrew Tsai,...
    Friday 4 September 2026
    Kyocera completes Nagasaki plant for semiconductor ceramics and packages
    Kyocera held a ceremony on September 1 to mark the completion of its Nagasaki Isahaya Plant in Kuremo-machi, Isahaya, Nagasaki. The company says the new manufacturing site will anchor...
    Friday 4 September 2026
    China's EUV gap may stretch 10–15 years, but DUV gains test Western export controls
    China may remain 10–15 years away from developing domestic extreme ultraviolet (EUV) lithography, according to assessments from UBS and Zeiss, highlighting the technological...
    Friday 4 September 2026
    Taisic unveils p-type SiC substrate for ultra-high-voltage grid, rail applications
    Taisic Materials, a compound semiconductor company under the Kenmec Group, unveiled a p-type silicon carbide (SiC) substrate on September 2, targeting ultra-high-voltage power applications,...
    Friday 4 September 2026
    Taiwan automation specialist Kenmec targets semiconductor packaging plants with low-clearance OHT, AI digital twins
    Rising semiconductor packaging and testing demand is exposing space and logistics constraints at existing plants. Kenmec Mechanical Engineering is targeting the upgrade market with...
    Friday 4 September 2026
    Processor, memory boom could push chip supply chain out of sync, says Yole
    Gary Huang, vice president and head of Asia-Pacific research and business development at Yole Group, said the imbalance is already showing signs of what he described as supply-chain...
    Friday 4 September 2026
    Silicon photonics testing shift could reshape how CPO suppliers win business
    As silicon photonics (SiPh) and co-packaged optics (CPO) move toward mass production, suppliers say testing is shifting earlier in the process to catch defects at the wafer stage,...
    Thursday 3 September 2026
    Mitsubishi Heavy Industries and NEC form alliance to advance defense tech, AI sovereignty
    Japanese industrial giants Mitsubishi Heavy Industries (MHI) and NEC Corporation have signed a memorandum of understanding (MOU) to establish a strategic partnership in the defense...
    Thursday 3 September 2026
    China chip tool makers expand beyond import substitution at CSEAC 2026

    China's semiconductor equipment industry is moving beyond replacing imported tools at mature nodes, with CSEAC 2026 highlighting deeper...

    2/77 pages
    BIZ FOCUS
    Sep 2, 08:22
    World Diamond Technology accelerates mass production of 300 mm diamond wafers
    Wednesday 2 September 2026
    Beyond Language: Indonesian Engineers Bridging Cultures in Taiwan's Semiconductor Industry
    Wednesday 2 September 2026
    8 September Hsinchu seminar: Silicon photonics driving AI chains
    Wednesday 2 September 2026
    DAS Introduces ALCEA for Integrated NOx Treatment in Semiconductor Fabs
    reportAIglasses