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    China’s IC designers expand AI interconnect efforts as Montage grows in DDR5 and TWSC targets CXL
    8h 17min ago
    Nvidia emerges as AI industry’s central bank amid cloud startup risks
    8h 17min ago
    Apple reportedly plans high-end HomeView with robotic arm
    8h 17min ago
    Rising memory costs push smartphone makers from LTPO to LTPS panels
    8h 18min ago
    Qiyi Technology’s Arizona fab projects drive order backlog to NT$4.476 billion
    8h 18min ago
    NEWS TAGGED EQUIPMENT
    Tuesday 20 October 2026
    Cincoze's EMC Solution Boosts Equipment Stability and Production Efficiency

    Rugged edge computing brand – Cincoze has launched its new external EMC solution, the Power Protection Module (PPM), to further strengthen protection against the...

    Monday 19 October 2026
    ACM Research bets on panel-level packaging and overseas growth as adoption risks persist
    ACM Research is expanding beyond China as its panel-level packaging equipment advances through customer evaluations in Taiwan, while the US semiconductor equipment maker invests in...
    Monday 19 October 2026
    Foxconn, Mitsubishi Electric form alliance in automotive equipment business
    Foxconn announced on October 16 that it has formed a strategic alliance with Mitsubishi Electric through its investment management subsidiary Lin Yin International Investment. The...
    Monday 19 October 2026
    Von Ardenne's flexible equipment targets unsettled panel-level packaging market
    German equipment maker Von Ardenne is entering the semiconductor industry with coating technology aimed at panel-level packaging, a segment where the choice among competing panel dimensions...
    Monday 19 October 2026
    Exclusive: Wooptix targets leading chipmakers with wafer metrology technology, eyes production adoption within 3-5 years
    Spanish semiconductor metrology startup Wooptix, whose technology originated in astronomical observation, is accelerating efforts to enter the supply chains of leading semiconductor...
    Monday 19 October 2026
    Toyota to deploy gigacasting in China as Shanghai Lexus plant targets 2027
    Toyota Motor will introduce its proprietary gigacasting technology in China to produce premium vehicles, while it has not disclosed whether it will use equipment from local Chinese...
    Monday 19 October 2026
    SK Hynix advances chip inspection technology as 3D memory pushes conventional metrology to its limits
    SK Hynix is strengthening its metrology and inspection (MI) capabilities as the transition toward 3D DRAM architectures and increasingly complex NAND stacking creates new challenges...
    Monday 19 October 2026
    Hanmi targets 2027 Wide TC Bonder launch, expands 2.5D AI chip packaging lineup
    South Korean semiconductor equipment maker Hanmi Semiconductor showcased its high-bandwidth memory (HBM) and AI chip packaging equipment at SEDEX 2026, including the TC Bonder 4 for...
    Monday 19 October 2026
    AI data-center expansion shifts focus to time-to-power
    Artificial intelligence data-center expansion is intensifying a global race for electricity, as cloud providers increasingly prioritize how quickly power can be secured over cost and...
    Monday 19 October 2026
    Semiconductor equipment demand rises as risks curb AI bubble
    SEMI's latest 12-inch fab outlook projects double-digit annual growth in equipment spending from 2026 through 2029, with forecasts revised upward from its previous edition. However,...
    Monday 19 October 2026
    MKS' Atotech and ESI to Showcase Advanced PCB Solutions at TPCA 2026

    MKS Inc. (NASDAQ: MKS), a global provider of enabling technologies that transform our world, today announced that its strategic brands Atotech, offering process chemicals,...

    Sunday 18 October 2026
    Exclusive: EnterpriseSG positions Singapore's semiconductor SMEs for bigger roles in global chip supply chains
    Singapore is targeting high-value semiconductor manufacturing, advanced packaging, and silicon photonics, building on its strengths in engineering, precision manufacturing, and reliability,...
    Saturday 17 October 2026
    Taiwan Mask targets Japan's Kyushu chip expansion with US$4.75 million TCK acquisition
    Taiwan Mask Corporation (TMC) is expanding its presence in Japan through the acquisition of semiconductor equipment services provider TCK, extending its business beyond precision photomask...
    Saturday 17 October 2026
    Samsung Electro-Mechanics' US$5.1 billion expansion faces equipment supply constraints
    Samsung Electro-Mechanics (Semco) faces potential equipment procurement bottlenecks in its KRW6.78 trillion (approx. US$5.1 billion) expansion of semiconductor substrate production...
    Saturday 17 October 2026
    TECO targets AI data center growth with energy storage, transformers
    TECO Electric and Machinery participated in Energy Taiwan on October 14, showcasing its smart microgrid solutions and outlining the future development of its power and energy business...
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    BIZ FOCUS
    Oct 21, 08:00
    Starting with Data Challenges: TS Holdings Explores AI Through Hackathon
    Tuesday 20 October 2026
    CHT Leverages Hackathon to Cultivate AI Solutions for Urban Governance
    Tuesday 20 October 2026
    Cincoze's EMC Solution Boosts Equipment Stability and Production Efficiency
    Tuesday 20 October 2026
    CES 2027 Welcomes First-Ever Chilean Global Pavilion