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Tuesday 5 August 2025
Sercomm Chair confident in robust 2H25 as production hits full capacity
Sercomm Corporation, a major Taiwanese networking equipment manufacturer, expressed optimism for the second half of 2025 during its earnings briefing on July 31, 2025, citing rising...
Monday 4 August 2025
ASE raises 2025 capex to US$5.5B as AI strains advanced packaging lines
ASE Holdings, the world's second-largest IC packaging and testing company after Amkor Technology, struck a cautious note in its second-quarter earnings call despite booming AI-driven...
Monday 4 August 2025
TSMC worries less about tariffs, more about who's still buying
Taiwan had aimed to match Japan and South Korea with a 15% reciprocal tariff rate. However, as of August 1, 2025, the US imposed a 20% tariff instead, with the initial impact falling...
Monday 4 August 2025
Sercomm to raise prices following new 20% US tariff on Taiwan
Taiwanese networking equipment manufacturer Sercomm plans to pass the full impact of newly announced US tariffs onto its customers, following Washington's release of an updated reciprocal...
Monday 4 August 2025
Hanmi confident in securing all HBM4 equipment orders as half of 1H25 sales go to Taiwan
Benefiting from the development of the high-bandwidth memory (HBM) market, Hanmi Semiconductor's second quarter 2025 performance continues to hit new highs, with overseas markets...
Monday 4 August 2025
ASMPT emerges as advanced packaging's next kingmaker amid AI chip boom
Singapore-based ASMPT, founded in Hong Kong in 1975, has grown from a regional distributor into one of the world's most influential semiconductor equipment makers. With AI and hyperscale...
Saturday 2 August 2025
Tokyo Electron cuts profit forecast amid weaker semiconductor equipment demand and China slowdown
On July 31, 2025, Tokyo Electron (TEL) revised its operating profit forecast for the fiscal year ending March 2026 to JPY570 billion (US$3.83 billion), an 18% decline from the previous...
Friday 1 August 2025
Horng Terng fully booked with orders amid AI chip cooling demand surge
Horng Terng Automation, a leading manufacturer of advanced semiconductor packaging equipment, has leveraged its joint development efforts with packaging clients and mastery of critical...
Friday 1 August 2025
US sanctions stall CXMT's DRAM expansion, giving Samsung and SK Hynix breathing room
ChangXin Memory Technologies (CXMT), China's leading DRAM manufacturer, is under renewed pressure as the US escalates export controls on advanced chipmaking equipment. The tightened...
Friday 1 August 2025
Ericsson in talks to invest in Intel's standalone network business
The Swedish telecom equipment maker Ericsson AB is in talks to invest hundreds of millions of dollars in Intel's networking infrastructure business, according to people familiar with...
Friday 1 August 2025
EU semiconductor gear tariff exemption fuels US fab expansion
The recent tariff exemption on semiconductor manufacturing equipment imported from the European Union into the US is poised to significantly influence the US semiconductor industry's...
Thursday 31 July 2025
Lam Research sees strong start to FY26 on AI chip boom
Lam Research reported fourth-quarter earnings for its fiscal year ending June 29, 2025, that exceeded analyst expectations, driven by increased demand for equipment used in the production...
Thursday 31 July 2025
Taiwan's manufacturing exodus: why lower tariffs won't bring factories home
As the US deadline for reciprocal tariffs, set under the Trump administration, approaches on August 1, 2025, Taiwan's final tax rate remains unresolved. While Vietnam and the Philippines—now...
Thursday 31 July 2025
Screen Holdings sees 12% profit drop as China demand slows, investment weighs
Japanese chip equipment maker Screen Holdings reported a 12.2% year-over-year decline in operating profit for the second quarter of 2025, reaching JPY24.3 billion (US$163 million),...
Thursday 31 July 2025
Hanmi reportedly planning US$71 million hybrid bonding investment amid HBM surge
South Korea's Hanmi Semiconductor is reportedly planning to invest KRW100 billion (US$71.4 million) in hybrid bonding technology, with commercial equipment targeted for release by...