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    Analysis: BYD bets on vertical integration rather than raw chip power with new smart driving SoC
    Jun 1, 18:46
    China’s underwhelming holiday season shows memory hikes still weigh on consumer demand
    Jun 1, 18:46
    Taiwan PCB output could top NT$1 trillion in 2026 but risk remain
    Jun 1, 18:46
    Interview: Taiwan's INFINITIX expands in South Korea to tap sovereign AI demand
    Jun 1, 18:45
    Agentic AI drives a global compute shortage across the full supply chain
    Jun 1, 18:45
    NEWS TAGGED EQUIPMENT
    Thursday 28 May 2026
    QRT eyes aerospace, defense growth with portable chip radiation tester

    South Korean semiconductor testing company QRT is expanding its equipment business with a portable chip radiation reliability testing...

    Wednesday 27 May 2026
    Taiwan's Wah Lee expands into specialty gases as materials costs are passed on quarterly
    Wah Lee Industrial said it has formally moved into investments in standard gases and other supplies needed by wafer fabs, with its Tainan logistics center set to open in the second...
    Wednesday 27 May 2026
    Sino-American Silicon taps AI to tackle Taiwan's green power crunch
    Sino-American Silicon Products (SAS) is turning to AI-based power management as Taiwan's green-power shortage persists, and electricity demand from advanced chipmaking and AI data...
    Wednesday 27 May 2026
    ICP DAS expands semiconductor controller orders and accelerates TPU medical pivot, plans factory expansion
    Industrial computer maker ICP DAS held an investor briefing on May 26 to outline a 2026 strategy focused on two main priorities: expanding semiconductor equipment controller operations...
    Wednesday 27 May 2026
    Hiwin opens Italy HQ, bridging Europe to global markets
    Taiwanese machinery component maker Hiwin has officially opened its new headquarters in Agrate Brianza for its Italian subsidiary, saying the site will serve as a key hub connecting...
    Wednesday 27 May 2026
    Sercomm to showcase enterprise edge AI servers, security and power solutions at COMPUTEX 2026
    Sercomm announced it will exhibit at COMPUTEX 2026 to present enterprise edge AI technologies designed to accelerate AI deployment across edge environments and enhance power management...
    Wednesday 27 May 2026
    AI infrastructure spending lifts Taiwan electronics sector outlook
    Cloud providers' large-scale investments in AI infrastructure have strengthened demand for Taiwan's electronics supply chain, boosting optimism among local manufacturers, according...
    Wednesday 27 May 2026
    Huawei Tau Law series 2: Advanced packaging, AI interconnects, EDA lead the way
    Huawei's Tau Law proposal is rapidly redirecting attention across China's semiconductor industry away from pure lithography competition and toward advanced packaging, 3D stacking,...
    Tuesday 26 May 2026
    ASML expands Taiwan hiring and operations to meet advanced chip demand
    Grace Wang, vice president and general manager of ASML in Taiwan, said that ASML plans to deploy extreme ultraviolet (EUV) and next-generation high numerical aperture (high-NA) EUV...
    Tuesday 26 May 2026
    GlobalWafers to increase prices, targets 4Q26 shipments for square wafers, Asia capacity fully booked
    GlobalWafers held its shareholders' meeting on May 25, where CEO Doris Hsu stated that the semiconductor market in 2026 has gradually moved beyond 2025's two extremes, when only AI...
    Tuesday 26 May 2026
    Holy Stone Enterprise says AI power surge will deepen global MLCC shortages
    Holy Stone Enterprise warns that AI-driven power upgrades are creating global shortages and record demand for multilayer ceramic capacitors (MLCCs), with lead times beyond 20 weeks...
    Tuesday 26 May 2026
    FSP Group partners at COMPUTEX 2026 for AI power opportunities

    As Artificial Intelligence (AI) applications rapidly expand from cloud computing to edge computing, smart manufacturing, networking equipment, and AI PCs, stable and...

    Monday 25 May 2026
    Lam Research CEO: New fabs alone will not solve chip bottlenecks
    Lam Research CEO Tim Archer said artificial intelligence and robotics can help chipmakers improve fab productivity as the semiconductor industry faces memory capacity constraints,...
    Monday 25 May 2026
    Topco and Bloom Energy install Taiwan's first on-site SOFC low-carbon data center power system
    Topco Energy Service, a Topco Group unit, and Bloom Energy installed a 2.6MW solid oxide fuel cell on-site power system at a Taiwan IC design firm's Miaoli data center, creating what...
    Monday 25 May 2026
    India roundup: India accelerates chip ambitions, but ecosystem gaps remain a key challenge

    India is advancing its technology and semiconductor ambitions through new fab projects, packaging...

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    BIZ FOCUS
    Jun 1, 08:00
    LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
    Friday 29 May 2026
    Datotek Introduces AI PSSD Sustainable Storage Solutions at COMPUTEX 2026
    Thursday 28 May 2026
    AGI Debuts DDR5 R-DIMM and Smart Industrial Solutions at COMPUTEX 2026
    Thursday 28 May 2026
    VIA Labs Announces Hub Controllers for Multi-Display USB-C Docking
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    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook