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    China silicon wafer makers expand 12-inch capacity and consolidate mature-node operations
    Aug 10, 17:26
    Cambricon and Moore Threads post strong 1H26 growth as China AI chips move to deployment
    Aug 10, 17:26
    Google readies Pixel 11 lineup, market breakthrough still under question
    Aug 10, 17:26
    Interview: Nvidia says networking is the core of AI computing as AI factories scale
    Aug 10, 17:25
    China auto brand slump pushes parts makers toward North America, Japan
    Aug 10, 17:25
    Taiwan producer prices surge as non-China supply chains face rising pressure
    Aug 10, 17:25
    NEWS TAGGED EQUIPMENT
    Friday 31 July 2026
    Samsung boosts Hwaseong DRAM capacity as it converts older NAND lines
    Samsung Electronics completed the shutdown and equipment transfer of an older NAND flash wafer fab at its Hwaseong campus in South Korea and is expanding DRAM production at the site...
    Friday 31 July 2026
    CSCC develops SiC crucibles to strengthen Taiwan’s AI data center supply chain
    China Steel Corporation affiliate CSCC has developed 6N high-purity isotropic graphite blocks for 8-inch and 12-inch silicon carbide (SiC) crystal growth crucibles, aiming to reduce...
    Thursday 30 July 2026
    China's DUV shock: the secretive Aishengna rattles ASML with US$1B state backing

    China's immersion DUV lithography programme has brought a little-known state-backed company into focus. Shanghai Aishengna Electronic...

    Thursday 30 July 2026
    South Korean suppliers win HBM4 tester orders from SK Hynix
    South Korean test-equipment suppliers Digital Frontier and UniTest have secured four orders for HBM4 wafer testers from SK Hynix worth a combined KRW247.84 billion (approx. US$172...
    Thursday 30 July 2026
    Lam Research raises WFE outlook as AI drives NAND, DRAM, advanced packaging demand
    Lam Research delivered record quarterly results and raised its outlook for global wafer fab equipment (WFE) spending, citing accelerating AI-driven demand across memory, advanced logic...
    Thursday 30 July 2026
    China's 28nm DUV lithography enters fab validation, reportedly guided by State Council-level experts
    China's 28nm DUV lithography programme has entered a new phase after Shanghai Aishengna Electronic Technology delivered its first five immersion deep ultraviolet lithography system...
    Thursday 30 July 2026
    Advantest lifts fiscal 2026 forecast as AI chip test demand surges

    Advantest raised its outlook for the fiscal year ending March 2027 after demand for chip-test equipment tied to AI data centers strengthened,...

    Thursday 30 July 2026
    Lam Research raises outlook as AI-driven semiconductor demand fuels record revenue and margin expansion
    On July 29, Lam Research reported record fiscal fourth-quarter results and issued stronger-than-expected guidance, signaling that rising demand for artificial intelligence is accelerating...
    Thursday 30 July 2026
    US FCC curbs Chinese inverters and robots, accelerating global shift in connected device security
    As power grids, renewable energy systems, and artificial intelligence data centers expand, a new US restriction on Chinese-made inverters and robots could affect suppliers, utilities,...
    Wednesday 29 July 2026
    TSMC: JASM utilities back to normal, equipment calibration underway; construction resumes

    TSMC on Wednesday issued its third statement since a magnitude 7 earthquake struck Kumamoto, Japan on July 28, saying that utility...

    Wednesday 29 July 2026
    China's glass substrate supply chain takes shape for AI chip packaging
    Intel's recent memorandum of understanding with Lens Technology to collaborate on through-glass via (TGV) advanced packaging has been widely viewed as an important step towards the...
    Wednesday 29 July 2026
    US blocks new foreign-made robots and power inverters in AI security crackdown

    The US has barred new foreign-produced advanced robots and power inverters from receiving regulatory approval, extending its technology...

    Wednesday 29 July 2026
    China's first home-grown immersion DUV production reveals real test beyond prototypes
    China has begun producing domestically developed immersion deep-ultraviolet (DUV) lithography machines, moving a critical semiconductor-equipment programme beyond prototypes and towards...
    Wednesday 29 July 2026
    ASM raises 2027 revenue outlook as AI-driven chip demand lifts forecast

    On July 28, ASM International raised its revenue outlook for 2027 and issued third-quarter guidance above market expectations after...

    Wednesday 29 July 2026
    Macronix sees 80% gross margin within reach but warns LTAs could deepen memory downturn
    Macronix International posted a sharp earnings increase in the second quarter of 2026, with gross margin reaching a record 64.4%. Its board also approved an additional NT$15.8 billion...
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    BIZ FOCUS
    Jul 30, 08:00
    EDOM Accelerates Edge AI Deployment with NVIDIA Technologies
    Monday 1 June 2026
    LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
    Thursday 30 July 2026
    ACCM Introduces Celeritas SMC: A Production-Ready, Silicon-Matched Core for Advanced Packaging
    Wednesday 29 July 2026
    Arrow Drives System-Level Design, Turning Complexity into Competitive Advantage
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