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    US ban on Chinese optical modules could disrupt AI supply chain
    45min ago
    Old LCD fabs are being repurposed as AI advanced packaging hubs
    45min ago
    Exclusive: STATS ChipPAC plans broad price hikes in 2H26 as AI demand stays strong
    45min ago
    Interview: Nvidia exec on progress of CPO production and pluggable optics
    46min ago
    Eclusive: Wistron lands Oracle AI server order as it adds Lenovo and HPE
    46min ago
    China auto exports shift from price wars to value wars
    46min ago
    NEWS TAGGED EQUIPMENT
    Wednesday 29 July 2026
    Commentary: Why China's 2026 tech breakthroughs are a generational harvest

    Judging only by the news of summer 2026, China's technology sector appears to have entered an unusually concentrated period of brea...

    Tuesday 28 July 2026
    Commentary: Balancing national defense needs with industrial development — Taiwan's electronics giants are not the only answer
    The Russia-Ukraine war has fundamentally reshaped the nature of modern asymmetric warfare. Unmanned systems have evolved from auxiliary equipment into core combat assets capable of...
    Tuesday 28 July 2026
    China reportedly starts making homegrown DUV chipmaking tools; threatens ASML's stranglehold on semiconductor equipment
    China has begun manufacturing domestically developed immersion deep ultraviolet lithography machines, a potential turning point in its effort to build a self-sufficient semiconductor...
    Tuesday 28 July 2026
    Samsung, SK Hynix race to secure chipmaking tools before equipment lead times hit one year
    Samsung Electronics and SK Hynix are considering placing semiconductor equipment orders earlier as a global wave of fab investment stretches delivery times for key chipmaking tools...
    Tuesday 28 July 2026
    Zeiss races to break ASML's EUV optics bottleneck for the AI chip boom
    Zeiss Semiconductor Manufacturing Technology is expanding production capacity in Germany to relieve a critical constraint on ASML's lithography output, with AI data center investment...
    Monday 27 July 2026
    CXMT's US$8.6 billion IPO sets off new spending cycle across China's DRAM supply chain
    China's leading DRAM producer CXMT listed on Shanghai's STAR Market on July 27 after raising about CNY57.9 billion (approx. US$8.6 billion), the board's largest initial public offering...
    Monday 27 July 2026
    Disco lifts first-half profit forecast on steady AI equipment demand
    Japanese semiconductor equipment maker Disco expects net profit for the six months ending September 30, 2026, to rise 32% year over year to JPY73.8 billion (approx. US$461 million),...
    Sunday 26 July 2026
    Lynas says Malaysia heavy rare earth project has gone over budget
    Lynas Rare Earths said its heavy rare earth expansion in Malaysia has gone over budget as the Australia-based miner works to build out a non-China supply chain. The disclosure came...
    Saturday 25 July 2026
    SuperAlloy expands recycled aluminum push as semiconductor business nears revenue contribution
    SuperAlloy Industrial is broadening its business beyond forged aluminum wheels, with recycled aluminum and semiconductor parts emerging as new growth drivers. The shift could matter...
    Saturday 25 July 2026
    China folds data centers into 15th Five-Year renewable energy plan
    China's National Development and Reform Commission (NDRC) and the National Energy Administration (NEA) on the 23rd released the 15th Five-Year Plan for Renewable Energy Development,...
    Friday 24 July 2026
    German chip suppliers deepen ties with Samsung, SK Hynix

    Germany's Merck KGaA, TRUMPF and ZEISS are deepening their ties with South Korea's semiconductor industry amid large-scale investment...

    Friday 24 July 2026
    TSMC's Arizona expansion moves past initial hurdles as fabs and packaging ramp up
    Since TSMC announced in 2020 that it would build factories in the US, the market has closely watched how overseas fab costs would affect operations. TSMC's long-running Arizona buildout...
    Friday 24 July 2026
    Rapidus expands Hokkaido chip hub with packaging and analysis

    Rapidus is expanding the semiconductor development and production network around its Chitose, Hokkaido foundry, adding chip analysis...

    Thursday 23 July 2026
    Tesla confirms equipment orders for TeraFab, targets in-house chip production to break supply bottleneck
    Tesla has placed equipment orders for an in-house semiconductor development facility in Austin it calls TeraFab, CEO Elon Musk confirmed during the company's Q2 2026 earnings call...
    Thursday 23 July 2026
    Samsung weighs Besi's Korean rivals for 50-bonder hybrid bonding line as pricing talks drag on

    Samsung Electronics is preparing a die-to-wafer hybrid bonding production line with about 50 bonders at its Pyeongtaek campus for next-generation...

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    BIZ FOCUS
    Jul 30, 08:00
    EDOM Accelerates Edge AI Deployment with NVIDIA Technologies
    Monday 1 June 2026
    LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
    Thursday 30 July 2026
    ACCM Introduces Celeritas SMC: A Production-Ready, Silicon-Matched Core for Advanced Packaging
    Wednesday 29 July 2026
    Arrow Drives System-Level Design, Turning Complexity into Competitive Advantage
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