TSMC is accelerating advanced packaging capacity expansion as supply remains tight, with market chatter indicating its CoWoS monthly...

Samsung Electronics, SK Hynix and Micron Technology are taking different manufacturing paths for the logic base die in HBM4, opening...

GigaDevice Semiconductor expects first-half 2026 net profit to reach about CNY6.9 billion (US$960 million), a 1,099% increase from...

Chunghwa Precision Test Tech president Scott Huang said on July 7 that the company's biggest challenge over the next five years will...

High-bandwidth memory (HBM) prices could more than double in 2027 as Nvidia's Rubin platform drives demand, HBM4 raises production...

Mitsubishi Chemical and Japan Steel Works are preparing a fresh capacity expansion in gallium nitride (GaN) substrates, aiming to capture...