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Wednesday 2 April 2025
Rapidus faces yield and customer challenges for 2nm chip ambition despite launching first fab
Rapidus officially launched its IIM-1 semiconductor fab in Chitose City, Hokkaido, on April 1, marking a major milestone in Japan's ambition to produce cutting-edge 2nm chips. However,...
Wednesday 2 April 2025
Trump's copper tariff threats send prices soaring and supply chains scrambling
Since assuming the US presidency, Donald Trump has rattled the precious metals market with threats of a 25% tariff on imported copper. This policy stance has spurred a frenzy, with...
Wednesday 2 April 2025
Talent shortage and operational challenges loom in Southeast Asia expansion for PCB industry

Looking ahead to 2025, the global PCB market is expected to maintain steady growth, driven by demand from AI servers and electric vehicles...

Wednesday 2 April 2025
Lee Jae-yong reportedly brought Samsung's chip and display chiefs along on China trip; signals strategic reset
Samsung Electronics Chairman Lee Jae-yong was recently joined by senior executives from the company's semiconductor and display departments on a rare visit to China. Industry analysts...
Wednesday 2 April 2025
Rapidus targets swift 2nm chip delivery with initial 50% yield goal
Rapidus, a Japanese company focused on semiconductor innovation, officially opened its first facility, IIM-1, in Chitose City, Hokkaido, on April 1, 2025. Aiming to advance in the...
Wednesday 2 April 2025
UMC-GlobalFoundries merger unlikely: talks stall and chip market sours
Amid growing concerns over semiconductor supply chain resilience and geopolitical tensions, industry speculation has emerged about potential consolidation in the global foundry sector...
Wednesday 2 April 2025
Wi-Fi 7 set to replace Wi-Fi 6 by 2025, but industry opinions on growth remain divided

The supply chain expects Wi-Fi 7 to replace Wi-Fi 6 as the market mainstream by 2025, gradually. Despite optimism among certain sectors...

Wednesday 2 April 2025
Hanmi Semiconductor hikes key HBM equipment price, likely impacts SK Hynix
Hanmi Semiconductor has increased the price of its thermal compression bonder (TC Bonder; TCB), a critical piece of equipment for high-bandwidth memory (HBM) production, by 25% starting...
Wednesday 2 April 2025
China's electronic product trade-in policy boosts high-end smartphone sales
China's electronic product trade-in initiative is driving stronger electronics sales in the first half of 2025, with the smartphone sector showing particular strength. Industry sources...
Wednesday 2 April 2025
US chip grants in limbo as Lutnick pushes bigger investments
Commerce Secretary Howard Lutnick has signaled he could withhold promised Chips Act grants as he pushes companies in line for federal semiconductor subsidies to substantially expand...
Tuesday 1 April 2025
China's expanding chip capacity throttles Taiwan's mature node market
Taiwan's semiconductor manufacturers continue to confront challenging market conditions for mature process technologies, with reports that TSMC may slow expansion plans at its Kumamoto...
Tuesday 1 April 2025
Samsung looks to salvage chip fortunes as chairman Lee Jae-yong courts China's AI and EV powerhouses
Samsung Electronics Chairman Lee Jae-yong recently made a high-profile visit to China, meeting with leading Chinese automaker executives and President Xi Jinping. South Korean analysts...
Tuesday 1 April 2025
UMC completes expansion of 22nm fab, set to begin production in 2026
On April 1, UMC announced the opening ceremony for its expanded facility in Singapore. The first phase of this new plant is scheduled to commence production in 2026, which is expected...
Tuesday 1 April 2025
Japan's Rapidus launches 2nm trial as MA-Tek's Hokkaido outpost signals surging demand
On April 1, Rapidus inaugurated its first semiconductor fabrication facility, IIM-1, in Chitose City, Hokkaido, marking a pivotal step in Japan's leap from 40nm technology to the...
Tuesday 1 April 2025
Tokyo Electron forecasts stable semiconductor demand and expansion in AI chip equipment
Hiroshi Kawamoto, Division Officer, Finance Division of Tokyo Electron Limited (TEL), one of Japan's leading semiconductor equipment manufacturers, projects that demand for high-bandwidth...