News tagged Chips + components at DIGITIMES

NEWS TAGGED CHIPS + COMPONENTS

Friday 31 July 2026

Semco reportedly expands SoulBrain partnership to advance glass substrate materials for AI chip packaging

Samsung Electro-Mechanics (Semco) is broadening its collaboration with South Korean materials supplier SoulBrain beyond glass substrate...

Friday 31 July 2026

Intel's rare Atom IP deal gives RosaicLabs a shortcut to custom x86 chips

Intel has granted stealth chip startup RosaicLabs access to parts of its Atom processor technology, potentially including register-transfer...

Friday 31 July 2026

AI strains mature-node and packaging capacity, leaving chip designers with orders but no supply

AI demand is tightening semiconductor capacity beyond TSMC's advanced nodes, with mature-process foundries and backend packaging providers...

Friday 31 July 2026

Analysis: Samsung's HBM4 base die is the foundry weapon TSMC and Intel can't copy

The most revealing thing about Samsung Electronics' foundry commentary on its second quarter of 2026 earnings call was not any single...

Friday 31 July 2026

Unimicron says Intel's EMIB-T will not reach mass production until 2027, sharpening advanced packaging rivalry

TSMC's CoWoS capacity remains tight, and demand for a second supply route is strengthening, according to Unimicron, which said Intel's EMIB-T advanced packaging platform will not reach...

Friday 31 July 2026

SPIL AI packaging investment boosts CTSP Erlin Park as first standard factory opens in 2H26

The Central Taiwan Science Park's (CTSP) Erlin Park is set to reach a long-awaited milestone when its first standard factory building begins operations in the second half of 2026,...

Friday 31 July 2026

UMC raises capex to US$2B, eyes AI SiPh

UMC said on July 29 that it will raise 2026 capex from US$1.5 billion to US$2 billion, while unveiling expansion plans in Singapore and a new fab in STSP. The foundry also disclosed...

Friday 31 July 2026

Qualcomm, MediaTek set Sept flagship SoC showdown

Qualcomm and MediaTek are preparing to unveil their latest 2nm flagship smartphone system-on-chip (SoC) platforms in September 2026, with both brands expected to launch standard and...

Friday 31 July 2026

Chang Wah sees broadening demand recovery and higher margins in 2Q26

Chang Wah Technology said stronger demand and tighter inventories are lifting its business across multiple markets, a sign that the recovery in electronics supply chains is widening...

Friday 31 July 2026

Samsung boosts Hwaseong DRAM capacity as it converts older NAND lines

Samsung Electronics completed the shutdown and equipment transfer of an older NAND flash wafer fab at its Hwaseong campus in South Korea and is expanding DRAM production at the site...

Thursday 30 July 2026

ASE sees full-year LEAP revenue topping US$3.5 billion amid tight packaging capacity

ASE Technology Holding said growing demand for advanced packaging and testing, combined with stronger momentum in its electronics manufacturing services (EMS) business, has tightened...

Thursday 30 July 2026

Samsung signs five-year memory deals as chip shortage stretches to 2028

Samsung Electronics has signed five-year memory supply agreements with five leading global data center customers and is in the final stages of talks with five more, tying a growing...

Thursday 30 July 2026

South Korean chip exports increasingly flow to Taiwan for TSMC packaging amid rising AI demand

Growing demand for AI chips is sending a larger share of South Korea's semiconductor exports to Taiwan, where Korean-made high-bandwidth...

Thursday 30 July 2026

Microsoft's AI buildout: 88 new data centers, broader model catalog, silicon gains

Microsoft CEO Satya Nadella laid out how the company is scaling its AI infrastructure and platform to keep pace with demand. He outlined...

Thursday 30 July 2026

China's DUV shock: the secretive Aishengna rattles ASML with US$1B state backing

China's immersion DUV lithography programme has brought a little-known state-backed company into focus. Shanghai Aishengna Electronic...

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