China has recently eased controls on some indium phosphide (InP) substrates, relieving a bottleneck in optical communications capacity...

A South Korean media report claiming TSMC is preparing to launch panel-level packaging at mass-production scale as early as 2027 has...

Nvidia's dominance in AI is extending beyond model training and deeper into inference—the fast-growing segment of the AI market responsible...

The semiconductor supply chain is facing another raw material shock — this time from tungsten hexafluoride, or WF6, a specialty...

Japan's Rapidus has signed a memorandum of understanding with the UK Semiconductor Centre, a government-backed body established in 2025...

Samsung Electronics' foundry division chief told employees on June 12 that a return to profitability in the contract chipmaking business...

INPAQ Technology, a unit of PSA Walsin Technology, reported that revenue and profit in the first quarter of 2026 fell year on year,...

Equipment maker Manz recently announced the successful delivery of the world's first 310mm x 310mm panel-level packaging (PLP) electrochemical...

Walsin Technology expects the tight supply of passive components could last into 2028, as demand from AI infrastructure, automotive...