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Wednesday 29 July 2026
TSMC: JASM utilities back to normal, equipment calibration underway; construction resumes

TSMC on Wednesday issued its third statement since a magnitude 7 earthquake struck Kumamoto, Japan on July 28, saying that utility...

Wednesday 29 July 2026
Coretronic reports first-half loss as margins weaken and demand stays uneven
Coretronic said its first-half 2026 performance turned negative as margin pressure and weaker profitability offset a second-quarter revenue recovery. The Taiwanese electronics maker...
Wednesday 29 July 2026
China's glass substrate supply chain takes shape for AI chip packaging
Intel's recent memorandum of understanding with Lens Technology to collaborate on through-glass via (TGV) advanced packaging has been widely viewed as an important step towards the...
Wednesday 29 July 2026
Nvidia's Jensen Huang warns US officials about banning Chinese open-weight models

Nvidia CEO Jensen Huang once again voiced his support for open-weight and open-source AI, a form of model that has caught official...

Wednesday 29 July 2026
Intel Foundry completes US microelectronics prototype program

Intel Foundry has completed a US defense-backed semiconductor prototype program that could have implications for supply chain resilience,...

Wednesday 29 July 2026
Analysis: What Seagate's blowout quarter signals about the next two years of AI infrastructure demand

Seagate's fiscal fourth quarter was by almost every measure its strongest in over a decade — US$3.6 billion in revenue, US$1.1...

Wednesday 29 July 2026
NXP finds new AI data center role beyond GPUs

NXP Semiconductors' physical AI strategy extends beyond vehicles, factories and robots. The same control, connectivity and real-time...

Wednesday 29 July 2026
SK Hynix keeps US and Japan expansion options open despite KRW40T capex plan
SK Hynix is advancing a high-KRW40s trillion capital expenditure plan for 2026 to expand AI memory capacity, but has stopped short of committing to new production investments in the...
Wednesday 29 July 2026
China's first home-grown immersion DUV production reveals real test beyond prototypes
China has begun producing domestically developed immersion deep-ultraviolet (DUV) lithography machines, moving a critical semiconductor-equipment programme beyond prototypes and towards...
Wednesday 29 July 2026
Corning bets on SiPh and CPO to drive AI data center growth

Corning expects AI infrastructure to become an increasingly powerful growth engine, outlining how its glass technologies will move beyond...

Wednesday 29 July 2026
China chip substitution accelerates as chill effect looms
China's semiconductor self-reliance push has notched new gains, with Chinese AI giants expanding purchases of domestic AI chips and facing direct pressure from Beijing to use more...
Wednesday 29 July 2026
Samsung reportedly weighs Chinese DRAM for budget smartphones as memory inflation squeezes mobile market
Samsung Electronics is considering using low-cost Chinese mobile DRAM in smartphones sold in China as it looks to cut manufacturing costs and expand its presence in the country's budget...
Wednesday 29 July 2026
ASM raises 2027 revenue outlook as AI-driven chip demand lifts forecast

On July 28, ASM International raised its revenue outlook for 2027 and issued third-quarter guidance above market expectations after...

Wednesday 29 July 2026
Macronix sees 80% gross margin within reach but warns LTAs could deepen memory downturn
Macronix International posted a sharp earnings increase in the second quarter of 2026, with gross margin reaching a record 64.4%. Its board also approved an additional NT$15.8 billion...
Wednesday 29 July 2026
SK Hynix prepares for prolonged memory tightness as AI infrastructure expands

SK Hynix reported record second-quarter revenue, underscoring the firm's strong demand for AI-related memory despite supply constraints...