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Monday 13 July 2026
SK Hynix hybrid bonding push signals next phase of HBM packaging race
SK Hynix is moving early to prepare hybrid bonding technology for next-generation high-bandwidth memory (HBM), as competition in AI memory shifts from stacking capacity toward packaging...
Monday 13 July 2026
Arm CEO: AI agents to drive CPU demand as infrastructure shifts beyond GPUs
GPUs have dominated AI infrastructure discussions over the past two years, powering everything from large language model (LLM) training and inference clusters to high-bandwidth memory...
Monday 13 July 2026
Egis sells part of iCatch stake as ASMedia becomes largest shareholder
Egis Technology on July 9 said it sold part of its stake in iCatch Technology as part of a routine adjustment to its group equity holdings. The IC design company said the move was...
Monday 13 July 2026
MA-tek hits record June revenue on rising AI chip testing demand, CPO complexity
Semiconductor testing company Materials Analysis Technology (MA-tek) reported June 2026 revenue of NT$558 million (approx. US$17.41 million), up 2.56% from May and 11.01% year over...
Monday 13 July 2026
Musk assembles Intel, SpaceX talent for Tesla wafer fab ambitions

Tesla and SpaceX are already converging around chips, talent and manufacturing under Terafab, even before any merger speculation turns...

Sunday 12 July 2026
Column: Compute is no longer the AI bottleneck. Memory is — and suppliers know it
After the semiconductor index nearly doubled in the first half of 2026 before a sharp pullback, the central question is whether the industry's AI-driven growth cycle has already peaked...
Sunday 12 July 2026
SmartSens targets 2027 commercialization of Micro LED optical interconnects for AI infrastructure
The rapid expansion of AI servers and large language models (LLMs) is driving unprecedented demand for data center computing, making high-speed interconnect technologies one of the...
Sunday 12 July 2026
Taiwan PCB leaders launch fundraising wave for AI data centers

Taiwan's PCB industry is entering a new expansion cycle as investment in AI data centers and other emerging applications accelerates...

Sunday 12 July 2026
InP supply crunch leaves South Korea exposed
Coherent has agreed to prepay AXT US$22.3 million under a three-year agreement for committed 6-inch indium phosphide substrate capacity, showing how buyers are moving to reserve future...
Sunday 12 July 2026
Hermes Testing's June revenue more than doubles as advanced chip test demand surges
Hermes Testing Solutions said that its June 2026 revenue jumped sharply as rising demand for advanced chip testing lifted sales of its custom products, cleaning materials, and engineering...
Saturday 11 July 2026
Taiwan connector maker Bellwether turns high-current design into patent licensing moat

Bellwether Electronic has evolved from a connector and wire harness manufacturer into a technology developer shaping industry standards...

Saturday 11 July 2026
Record chip profits mask a widening divide inside Samsung
Samsung Electronics' preliminary results for the second quarter of 2026 again underscore a striking split inside the company: surging semiconductor profits driven by AI server demand...
Saturday 11 July 2026
Samsung, SK Hynix margins seen near Micron's 80% level as memory prices surge

Global memory chipmakers are heading toward record revenue and profit in the second quarter of 2026, as AI infrastructure demand keeps...

Saturday 11 July 2026
Samsung's CXL 3.1 memory delay lays bare Intel, AMD server platform lag

Samsung Electronics has postponed mass production of its CXL 3.1 memory modules after delays to next-generation server processors from...