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Wednesday 17 June 2026
Exclusive: Galatek eyes up to 200% chip growth with Malaysia packaging push

Singapore-based Galatek Technologies is expanding into scarce advanced packaging equipment as it builds localized manufacturing capacity...

Wednesday 17 June 2026
Huawei raises end-consumer product prices from July
Huawei has notified partners and channel distributors that it will raise end-customer prices across its Intelligent Collaboration product line from July 1 this year, as the AI computing...
Tuesday 16 June 2026
Nvidia sells US$25 billion in bonds as investors seek foothold in AI boom
Nvidia launched a sale of US$25 billion worth of high-grade bonds on June 15, ultimately garnering up to US$85 billion in orders, or more than triple the bond's original size. This...
Tuesday 16 June 2026
ASML, TSMC, and imec move 2D transistors closer to manufacturing reality
ASML, TSMC, and imec have demonstrated a major advance in the effort to bring two-dimensional (2D) semiconductor materials from research laboratories into high-volume semiconductor...
Tuesday 16 June 2026
AI chip race sends semiconductor equipment sales to record US$36.55 billion
Global semiconductor manufacturing equipment sales reached a record US$36.55 billion in the first quarter of 2026, driven by AI-related investment in advanced logic, DRAM, and advanced...
Tuesday 16 June 2026
Samsung reportedly moves closer to 5nm-class MRAM as TSMC advances its roadmap

Samsung Electronics has secured key technology for a 5nm-class magnetoresistive random-access memory cell, according to Korean financial...

Tuesday 16 June 2026
China mass produces silicon-28 amid quantum computing race with US

China has achieved mass production of ultra-pure silicon, according to the state-owned China National Nuclear Corporation (CNNC) —...

Tuesday 16 June 2026
China's Nexchip breaks into foundry top eight after AI demand lifts market to record numbers
AI, high-performance computing, and early pull-ins from TV, PC, and notebook supply chains pushed the global foundry market to a record high in the first quarter of 2026. China's Nexchip...
Tuesday 16 June 2026
AMD opens EFB front beyond CoWoS, putting Taiwan substrate trio in play
The AI data center buildout is driving demand for high-performance computing (HPC) and networking chips, sending the global IC substrate industry into a new growth cycle. Order visibility...
Tuesday 16 June 2026
TSMC eyes A16 mass production in 4Q26 and Intel refines 18A roadmap with 18A-P
Researchers and chipmakers presented new logic, memory, and device architectures at the 2026 IEEE/JSAP VLSI Technology and Circuits Symposium in Honolulu, with several results pointing...
Tuesday 16 June 2026
Qualcomm weighs Tenstorrent deal that could reach US$10 billion

Qualcomm has been in talks to acquire Tenstorrent, an AI chip startup, The Information reported, citing a person with direct...

Tuesday 16 June 2026
China AI chip hopeful Enflame nears IPO with fast revenue growth, heavy losses, and Tencent risk

Shanghai Enflame Technology is nearing a STAR Market listing, bringing another Chinese AI chipmaker closer to public markets while...

Tuesday 16 June 2026
Apple's Siri AI push drives 12GB DRAM demand for Samsung and SK Hynix

Apple is stepping up the AI capabilities of its Siri voice assistant, and analysts say memory chip demand will rise along with it,...

Tuesday 16 June 2026
TSMC reportedly teams with Ibiden, Innolux to push CoPoS, glass substrates

TSMC is accelerating its advanced packaging roadmap for AI chips, expanding CoWoS capacity while publicly disclosing new progress in...

Tuesday 16 June 2026
AMD to acquire MEXT to expand AI memory optimization tools
AMD said it will acquire MEXT, a move aimed at strengthening its AI and data center portfolio amid rising global memory demand. The deal is intended to help customers improve performance,...