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    The 'Copper Wall': inside the physical bottlenecks threatening to melt AI supercomputing boom
    14min ago
    How agentic AI and 'AI physics' are reshaping chip design
    30min ago
    NEWS TAGGED CHIPS + COMPONENTS
    Sunday 12 July 2026
    SmartSens targets 2027 commercialization of Micro LED optical interconnects for AI infrastructure
    The rapid expansion of AI servers and large language models (LLMs) is driving unprecedented demand for data center computing, making high-speed interconnect technologies one of the...
    Sunday 12 July 2026
    Taiwan PCB leaders launch fundraising wave for AI data centers

    Taiwan's PCB industry is entering a new expansion cycle as investment in AI data centers and other emerging applications accelerates...

    Sunday 12 July 2026
    InP supply crunch leaves South Korea exposed
    Coherent has agreed to prepay AXT US$22.3 million under a three-year agreement for committed 6-inch indium phosphide substrate capacity, showing how buyers are moving to reserve future...
    Sunday 12 July 2026
    Hermes Testing's June revenue more than doubles as advanced chip test demand surges
    Hermes Testing Solutions said that its June 2026 revenue jumped sharply as rising demand for advanced chip testing lifted sales of its custom products, cleaning materials, and engineering...
    Saturday 11 July 2026
    Taiwan connector maker Bellwether turns high-current design into patent licensing moat

    Bellwether Electronic has evolved from a connector and wire harness manufacturer into a technology developer shaping industry standards...

    Saturday 11 July 2026
    Record chip profits mask a widening divide inside Samsung
    Samsung Electronics' preliminary results for the second quarter of 2026 again underscore a striking split inside the company: surging semiconductor profits driven by AI server demand...
    Saturday 11 July 2026
    Samsung, SK Hynix margins seen near Micron's 80% level as memory prices surge

    Global memory chipmakers are heading toward record revenue and profit in the second quarter of 2026, as AI infrastructure demand keeps...

    Saturday 11 July 2026
    Samsung's CXL 3.1 memory delay lays bare Intel, AMD server platform lag

    Samsung Electronics has postponed mass production of its CXL 3.1 memory modules after delays to next-generation server processors from...

    Saturday 11 July 2026
    QuantumDiamonds sets up Asia HQ in Taiwan, installs first regional system at iST
    Backed by support from the European Chips Act, German quantum startup QuantumDiamonds has completed a financing round totaling EUR91 million (approx. US$104.1 million), a move expected...
    Saturday 11 July 2026
    Mobilint touts NPU for physical AI, with CEO urging South Korea to accelerate development
    South Korean AI semiconductor startup Mobilint is gaining traction in physical AI with its neural processing units (NPU) for edge devices, as the AI boom spreads from cloud computing...
    Friday 10 July 2026
    China's temporary helium export ban signals fears of a prolonged Middle East supply squeeze
    China moved on July 10 to wall off its domestic supply of helium, a gas with no substitute in chipmaking and medical imaging, in a step that suggests Beijing does not expect Middle...
    Friday 10 July 2026
    Nvidia’s Jensen Huang heads to Japan with RTX Spark as AI PC competition heats up

    Nvidia CEO Jensen Huang will travel to Japan for an event celebrating the US chipmaker's three-decade relationship with Sega, revisiting...

    Friday 10 July 2026
    Largan samples CPO product in July 2026, eyes GC edge
    Largan said on July 9, 2026, that it will formally begin sampling fiber array (FA) products for a mass-production customer in July, while chairman En-Ping Lin outlined the company's...
    Friday 10 July 2026
    SK Hynix breaks Alibaba's US listing record — but HBM customers will wait until 2028 for the capacity it funds
    SK Hynix has priced a US$26.5 billion Nasdaq offering, giving the world's leading supplier of high-bandwidth memory fresh capital to expand DRAM wafer production, advanced packaging...
    Friday 10 July 2026
    ASE Holdings posts record 2Q26 revenue, bets US$40M on South Korea as AI packaging demand surges

    ASE Holdings posted record second-quarter and first-half 2026 revenue, driven by strong demand for advanced semiconductor packaging and...

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    Wednesday 2 September 2026
    8 September Hsinchu seminar: Silicon photonics driving AI chains
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