China has recently eased controls on some indium phosphide (InP) substrates, relieving a bottleneck in optical communications capacity...

A South Korean media report claiming TSMC is preparing to launch panel-level packaging at mass-production scale as early as 2027 has...

Nvidia's dominance in AI is extending beyond model training and deeper into inference—the fast-growing segment of the AI market responsible...

The semiconductor supply chain is facing another raw material shock — this time from tungsten hexafluoride, or WF6, a specialty...

Japan's Rapidus has signed a memorandum of understanding with the UK Semiconductor Centre, a government-backed body established in 2025...

Samsung Electronics' foundry division chief told employees on June 12 that a return to profitability in the contract chipmaking business...

INPAQ Technology, a unit of PSA Walsin Technology, reported that revenue and profit in the first quarter of 2026 fell year on year,...