News tagged Chips + components at DIGITIMES

NEWS TAGGED CHIPS + COMPONENTS

Monday 13 July 2026

Infineon urges TSMC to consider a second Dresden fab as demand outlook evolves

A push by Infineon for TSMC to expand further in Dresden could reshape Europe's role in advanced chipmaking and ripple through the...

Monday 13 July 2026

Apple reportedly accelerates AI chip roadmap as next-gen Macs prioritize neural processing

Apple is reshaping its Mac chip roadmap to prioritize AI, accelerating development of future processors as the company seeks to strengthen...

Monday 13 July 2026

Weekly news roundup: TSMC widens AI chip lead as HBM and CoWoS bottlenecks reshape supply chains

AI demand is still outrunning advanced semiconductor capacity, putting foundry output, HBM supply, packaging and server infrastructure at...

Monday 13 July 2026

India opens first CMP pad technology hub in Hyderabad

India's first Chemical Mechanical Polishing pad technology hub could help reshape semiconductor supply chains far beyond the country. The new Hyderabad facility aims to build local...

Monday 13 July 2026

MediaTek revenue beat lifts second-quarter outlook as seasonal demand builds

MediaTek reported June 2026 revenue of NT$58.012 billion (US$1.81 billion), up 22.30% month over month and 2.80% year over year, and said second-quarter revenue reached NT$152.183...

Monday 13 July 2026

KYEC approves US$1.4 billion US plant to expand chip testing capacity

King Yuan Electronics (KYEC) approved a US plant investment of up to US$1.4 billion, or about NT$44.9 billion, on July 10 as the US continued pushing to expand domestic chip manufacturing...

Monday 13 July 2026

India roundup: India's chip strategy tests its ability to build a competitive ecosystem

India is moving from semiconductor planning to execution, using funding, tariff changes, foreign...

Monday 13 July 2026

Sitronix sees zero-capacitance TDDI and automotive DDI drive growth

Sitronix Technology said this week that zero-capacitance touch with display driver integration (TDDI) and automotive display drive IC (DDI) will drive its growth in 2026, as the chipmaker...

Monday 13 July 2026

SK Hynix hybrid bonding push signals next phase of HBM packaging race

SK Hynix is moving early to prepare hybrid bonding technology for next-generation high-bandwidth memory (HBM), as competition in AI memory shifts from stacking capacity toward packaging...

Monday 13 July 2026

Arm CEO: AI agents to drive CPU demand as infrastructure shifts beyond GPUs

GPUs have dominated AI infrastructure discussions over the past two years, powering everything from large language model (LLM) training and inference clusters to high-bandwidth memory...

Monday 13 July 2026

AI infrastructure demand lifts WPG, WT Microelectronics to record Q2 revenue

Monday 13 July 2026

Egis sells part of iCatch stake as ASMedia becomes largest shareholder

Egis Technology on July 9 said it sold part of its stake in iCatch Technology as part of a routine adjustment to its group equity holdings. The IC design company said the move was...

Monday 13 July 2026

MA-tek hits record June revenue on rising AI chip testing demand, CPO complexity

Semiconductor testing company Materials Analysis Technology (MA-tek) reported June 2026 revenue of NT$558 million (approx. US$17.41 million), up 2.56% from May and 11.01% year over...

Monday 13 July 2026

Musk assembles Intel, SpaceX talent for Tesla wafer fab ambitions

Tesla and SpaceX are already converging around chips, talent and manufacturing under Terafab, even before any merger speculation turns...

Sunday 12 July 2026

Column: Compute is no longer the AI bottleneck. Memory is — and suppliers know it

After the semiconductor index nearly doubled in the first half of 2026 before a sharp pullback, the central question is whether the industry's AI-driven growth cycle has already peaked...

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Sep 2, 08:22

World Diamond Technology accelerates mass production of 300 mm diamond wafers

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