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Monday 15 June 2026
CoPoS and FOPLP accelerate as Manz delivers its first 310mm electrochemical deposition equipment

Equipment maker Manz recently announced the successful delivery of the world's first 310mm x 310mm panel-level packaging (PLP) electrochemical...

Monday 15 June 2026
Walsin sees passive component crunch stretching into 2028 as memory shortages weigh

Walsin Technology expects the tight supply of passive components could last into 2028, as demand from AI infrastructure, automotive...

Monday 15 June 2026
Galatek opens Penang hub to meet surging semiconductor equipment demand

Galatek Technologies has opened a manufacturing, assembly, and delivery center in Penang, marking the AI-enabled automation and semiconductor...

Monday 15 June 2026
South Korea's chip equipment players ride the HBM4 wave

South Korea's semiconductor equipment supply chain saw a material pickup in orders in the first half of 2026 as Samsung Electronics...

Monday 15 June 2026
Taiwan's IC design sector posts sharpest gains in years; May data hints at further acceleration into 2H26
Taiwan's fabless semiconductor design sector posted its strongest year-over-year growth figures in years as of May 2026, with a cluster of memory-adjacent and storage chip makers leading...
Monday 15 June 2026
Southeast Asia shifts from test-and-pack to multi-center advanced packaging hub

As global semiconductor supply chains are rebuilt, Southeast Asia is evolving from a back-end test-and-pack region into a resilient,...

Monday 15 June 2026
Wus Printed Circuit sees turnaround on high-end PCB demand

Wus Printed Circuit is pressing ahead with an AI-driven transformation, with its chairman and president outlining plans to move toward...

Monday 15 June 2026
Google's TPU diversification challenges MediaTek and other ASIC partners
Google's push to diversify its Tensor Processing Units (TPUs) supply chain is increasingly reaching into the foundry side, adding pressure on ASIC makers such as MediaTek. Recent reports...
Monday 15 June 2026
Samsung's Exynos 2600 doubles on-device AI performance in MLPerf benchmarks
Samsung Electronics announced that its Exynos 2600 mobile application processor delivered more than double the on-device AI performance of the Exynos 2500, according to benchmark results...
Monday 15 June 2026
AI server tracker: Taiwan's AI supply chain posts triple-digit gains in May as server makers and memory chips surge
Taiwan's listed semiconductor and electronics companies posted robust revenue growth in May 2026, with the latest monthly data revealing a widening split between AI infrastructure...
Monday 15 June 2026
SK Hynix readies HBM4 packaging push as Nvidia demand grows

SK Hynix is bringing additional back-end equipment into its Cheongju P&T6 facility as it steps up mass-production preparations for...

Monday 15 June 2026
Weekly news roundup: Samsung foundry profit rebound may come in 3Q26; Nvidia unveils AI PC vision
Below are the most-read DIGITIMES Asia stories from the week of June 8-14, 2026:
Monday 15 June 2026
Taiwan's UBright broadens beyond optical films with push into semiconductors, passives and smart acoustics

Taiwan-based UBright Optronics is accelerating its transformation from an LCD optical film specialist into a diversified technology...

Monday 15 June 2026
China eases InP substrate exports, lifting compound semiconductor supply

China has allowed the release of a fresh supply of indium phosphide (InP) substrates, which are under export controls. A first 2026...

Monday 15 June 2026
The great chip bazaar: India's fragmented fight to build a tech empire
Tata Electronics' planned US$11 billion semiconductor fab in Dholera, Gujarat, has become the anchor of India's front-end chip manufacturing ambitions. The project, supported by technology...