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Thursday 30 July 2026
Greatek sees sustained AI demand, plans Philippines packaging plant acquisition
Greatek's latest investment and capacity plans signal how AI-driven semiconductor demand is rippling beyond Taiwan, with implications for global device makers, automakers, and industrial...
Thursday 30 July 2026
Amkor reallocates SiP production to Vietnam, freeing Korean cleanrooms for AI packaging
Amkor Technology reported record second-quarter results for 2026, characterized by broad-based revenue growth and significant strategic shifts in its global manufacturing footprint...
Thursday 30 July 2026
Taiwan semiconductor power demand is set to reach 52 billion kWh in 2026

Taiwan's semiconductor sector is set to become an even larger driver of electricity demand as AI-related expansion lifts output in...

Wednesday 29 July 2026
TSMC: JASM utilities back to normal, equipment calibration underway; construction resumes

TSMC on Wednesday issued its third statement since a magnitude 7 earthquake struck Kumamoto, Japan on July 28, saying that utility...

Wednesday 29 July 2026
Coretronic reports first-half loss as margins weaken and demand stays uneven
Coretronic said its first-half 2026 performance turned negative as margin pressure and weaker profitability offset a second-quarter revenue recovery. The Taiwanese electronics maker...
Wednesday 29 July 2026
China's glass substrate supply chain takes shape for AI chip packaging
Intel's recent memorandum of understanding with Lens Technology to collaborate on through-glass via (TGV) advanced packaging has been widely viewed as an important step towards the...
Wednesday 29 July 2026
Nvidia's Jensen Huang warns US officials about banning Chinese open-weight models

Nvidia CEO Jensen Huang once again voiced his support for open-weight and open-source AI, a form of model that has caught official...

Wednesday 29 July 2026
Intel Foundry completes US microelectronics prototype program

Intel Foundry has completed a US defense-backed semiconductor prototype program that could have implications for supply chain resilience,...

Wednesday 29 July 2026
Analysis: What Seagate's blowout quarter signals about the next two years of AI infrastructure demand

Seagate's fiscal fourth quarter was by almost every measure its strongest in over a decade — US$3.6 billion in revenue, US$1.1...

Wednesday 29 July 2026
NXP finds new AI data center role beyond GPUs

NXP Semiconductors' physical AI strategy extends beyond vehicles, factories and robots. The same control, connectivity and real-time...

Wednesday 29 July 2026
SK Hynix keeps US and Japan expansion options open despite KRW40T capex plan
SK Hynix is advancing a high-KRW40s trillion capital expenditure plan for 2026 to expand AI memory capacity, but has stopped short of committing to new production investments in the...
Wednesday 29 July 2026
China's first home-grown immersion DUV production reveals real test beyond prototypes
China has begun producing domestically developed immersion deep-ultraviolet (DUV) lithography machines, moving a critical semiconductor-equipment programme beyond prototypes and towards...
Wednesday 29 July 2026
Corning bets on SiPh and CPO to drive AI data center growth

Corning expects AI infrastructure to become an increasingly powerful growth engine, outlining how its glass technologies will move beyond...

Wednesday 29 July 2026
China chip substitution accelerates as chill effect looms
China's semiconductor self-reliance push has notched new gains, with Chinese AI giants expanding purchases of domestic AI chips and facing direct pressure from Beijing to use more...
Wednesday 29 July 2026
Samsung reportedly weighs Chinese DRAM for budget smartphones as memory inflation squeezes mobile market
Samsung Electronics is considering using low-cost Chinese mobile DRAM in smartphones sold in China as it looks to cut manufacturing costs and expand its presence in the country's budget...