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Friday 10 July 2026
Nanya Technology posts record profit as gross margin nears 80%
Nanya Technology posted record quarterly profit after a more than 60% rise in average DRAM selling prices lifted its gross margin to 79.5%, with the Taiwanese memory chipmaker expecting...
Friday 10 July 2026
Sigurd posts record second quarter revenue as Hsinchu plant starts ramping up
Sigurd said its revenue hit a record in the second quarter of 2026 and for the first half of the year, driven by stronger demand from overseas customers. June sales stayed at a high...
Friday 10 July 2026
Wolfspeed challenges Navitas over GaN and SiC patent boundaries

Wolfspeed's patent lawsuit against Navitas Semiconductor has opened a new front in the wide-bandgap power chip race, extending the legal...

Friday 10 July 2026
Samsung plans new PC chip in push beyond smartphones
Samsung Electronics is developing a new chip for personal computers (PCs) as its System LSI business seeks growth beyond smartphone processors, according to ET News and the...
Friday 10 July 2026
Apple iPhone 18 Pro Max BOM could jump US$300 as memory costs soar

New figures from Counterpoint Research estimate that the bill of materials (BOM) for the upcoming iPhone 18 Pro Max could rise nearly...

Friday 10 July 2026
Podcast highlights: TSMC's 2nm lead widens, Intel 14A slips beyond 2030, Samsung 4nm fills on HBM4 demand

Samsung Electronics' preliminary earnings have shaken financial markets. Drawing on a report from a US brokerage, DIGITIMES Intelligence...

Friday 10 July 2026
SK AI Summit postponed as SK eyes closer alignment with Nvidia GTC
SK Group, which hosts the annual SK AI Summit as its flagship technology event to showcase its latest AI and semiconductor developments, is reportedly postponing the 2026 edition....
Friday 10 July 2026
Apple's US$30 billion Broadcom deal puts its server-chip plans back in focus

Apple and Broadcom have extended their custom-chip partnership through 2031 under agreements expected to exceed US$30 billion, reinforcing...

Friday 10 July 2026
TSMC CoWoS output reportedly to reach at least 200K wafers in 2027

TSMC is accelerating advanced packaging capacity expansion as supply remains tight, with market chatter indicating its CoWoS monthly...

Friday 10 July 2026
JCET sets US$1.4bn capex for AI packaging expansion as China orders stay strong
JCET plans to invest about CNY10 billion (approx. US$1.4 billion) in fixed assets in 2026, sharply increasing spending on AI-driven advanced packaging, automotive electronics and selected...
Friday 10 July 2026
Topco Scientific's June revenue hits record high on strong photoresist, quartz cloth demand
Topco Scientific (TSC) posted June 2026 revenue of NT$7.51 billion (approx. US$233.49 million), an increase of NT$970 million from May and 32.9% from a year earlier, setting a new...
Friday 10 July 2026
Analysis: Samsung, SK Hynix, and Micron's diverging approach to HBM4 base dies

Samsung Electronics, SK Hynix and Micron Technology are taking different manufacturing paths for the logic base die in HBM4, opening...

Friday 10 July 2026
Micron's US$250 billion memory push sharpens three-way race with Korean and Chinese rivals
Micron Technology's decision to lift its planned US investment to more than US$ 250 billion through 2035, unveiled July 9 alongside the first concrete pour at its Clay, New York, site,...
Friday 10 July 2026
GigaDevice's 1H26 profit surges 1,099% on memory chip shortage, higher prices

GigaDevice Semiconductor expects first-half 2026 net profit to reach about CNY6.9 billion (US$960 million), a 1,099% increase from...

Friday 10 July 2026
GlobalWafers-Micron deal pushes US semiconductor localization beyond chip fabs
GlobalWafers and Micron have signed a 10-year supply agreement, alongside US$500 million in strategic financial support, in a move that underscores how artificial intelligence (AI),...