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Wednesday 24 June 2026
Global market for advanced chip packaging set for rapid expansion
The market for fan-out panel-level packaging(FOPLP) and glass substrate packaging is set to grow sharply as chipmakers race to support AI and high-performance computing. For global...
Wednesday 24 June 2026
China's LineShine supercomputer tops TOP500, but AI lead remains unclear

China's LineShine supercomputer debuted at No. 1 on the June 2026 TOP500 list, announced at the ISC 2026 conference in Hamburg, becoming...

Wednesday 24 June 2026
Qualcomm, ByteDance talks signal new phase in China AI chip diversification
Qualcomm's reported talks to provide custom chip-design services to TikTok owner ByteDance show how China's AI chip supply chain is moving beyond a simple Nvidia replacement story.
Wednesday 24 June 2026
IBM targets Anderon venture to anchor quantum wafer supply
IBM is building a foundry to produce silicon wafers used in quantum-computing processors, seeking to become an indispensable part of the quantum economy under development. Called Anderon,...
Wednesday 24 June 2026
MediaTek-Global Unichip tie-up talk puts TSMC's AI ASIC ecosystem on watch
Cloud service providers are accelerating in-house AI chip development, lifting demand for application-specific integrated circuits, or ASICs, and reshaping collaboration across the...
Wednesday 24 June 2026
AI supply chain boom fuels Taiwan's investment, exports as GDP growth tops 10% outlook
Taiwan's economy is expected to maintain strong momentum through the second half of 2026, supported by accelerating AI-related investment, resilient exports, and robust demand across...
Wednesday 24 June 2026
Samsung, SK Hynix weigh new Korean chip belt as concerns mount for Yongin cluster

South Korea's government is in talks with Samsung Electronics and SK Hynix over a potential new phase of large-scale semiconductor investments,...

Wednesday 24 June 2026
Samsung eyes Galaxy Ultra for 2nm Exynos 2700

Samsung Electronics' System LSI division is pressing its mobile business to expand adoption of the in-house Exynos 2700 processor beyond...

Wednesday 24 June 2026
Former SMIC CEO targets China photomask IPO after 12-inch wafer bet
Former SMIC CEO Tzu-yin Chiu is extending his semiconductor materials strategy into photomasks, one of the most critical upstream links in chip manufacturing. Guangzhou Xinrui Photomask...
Wednesday 24 June 2026
Cerebras leans on OpenAI and AWS as anchor customers, raising questions about concentration
Cerebras Systems' first public quarter highlighted its dependence on a small set of large partners — OpenAI and AWS anchor the business — even as management declined on...
Wednesday 24 June 2026
AI server demand drives Taiwan PCB output toward NT$256.1B in 2Q26
Strong demand for AI servers is driving higher shipments of advanced printed circuit board (PCB) products in Taiwan, but it is also tightening supply of key materials and resources,...
Wednesday 24 June 2026
MediaTek price hike signals broader cost pressure for Taiwan IC design houses
Reports of MediaTek price adjustments appear to confirm a broader pricing trend across Taiwan's IC design sector. Industry sources said many small and mid-sized chip suppliers have...
Wednesday 24 June 2026
SK Hynix reportedly eases HBM4 push as commodity DRAM margins surge

SK Hynix is reportedly easing the pace of some HBM4 production conversions and redirecting more attention toward commodity DRAM, as a...

Wednesday 24 June 2026
Cerebras bets on speed as a product, racing to add data center capacity through 2027
Cerebras Systems used its first earnings call on June 26 to argue that speed is its core advantage and that the entire AI inference market is addressable. It also detailed an aggressive...
Wednesday 24 June 2026
Cerebras posts 92% revenue growth in first public quarter, but warns compute rentals will squeeze margins
Cerebras Systems delivered 92% revenue growth in its first quarter as a public company, but management cautioned that its decision to rent back computing capacity from an existing...