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Tuesday 23 June 2026
Samsung Electro-Mechanics rides Qualcomm's data center push into servers

Samsung Electro-Mechanics has begun mass production of advanced package substrates for Qualcomm's first data center AI accelerator,...

Tuesday 23 June 2026
YMTC Holdings exits XMC as state-backed Optics Valley investor takes control
China's memory industry is undergoing another round of ownership restructuring. According to a recent merger review case disclosed by China's State Administration for Market Regulation...
Tuesday 23 June 2026
Thailand approves semiconductor strategy, targets investment and talent growth
Thailand's newly established National Semiconductor and Advanced Electronics Policy Committee has approved the framework for a national semiconductor strategy and a workforce development...
Tuesday 23 June 2026
SK Hynix Cheongju plant accidents raise HBM expansion safety concerns

SK Hynix's semiconductor production base in Cheongju, South Korea, has seen a string of accidents since 2026, prompting questions over...

Tuesday 23 June 2026
Corsair's reported CXMT DDR5 move puts China DRAM on the global supply-chain map
China's DRAM supply chain is becoming a new variable in the global memory market. CXMT, China's largest DRAM manufacturer, is accelerating its DDR5 expansion. Recent reports stated...
Tuesday 23 June 2026
Taiwan OSAT sector's strongest 1H in years puts 2026 full-year revenue records in sight

Taiwan's semiconductor packaging and testing (OSAT) industry delivered strong year-over-year revenue growth in May 2026, with 21 of...

Tuesday 23 June 2026
MediaTek issues official price hike notice, products facing supply constraints likely to increase first
Taiwanese IC design leader MediaTek has sent a price hike letter to customers, signaling that the current wave of chip price increases is sweeping across the semiconductor market and...
Tuesday 23 June 2026
Japan puts robotics at heart of US$2.3 trillion chip revival

Japan is preparing a sweeping public-private investment strategy totaling more than JPY370 trillion (US$2.3 trillion) by fiscal 2040,...

Tuesday 23 June 2026
Commentary: Google defines AI path to ASI, validates chip boom
Google released a 30,000-word AI roadmap on June 14 that, for the first time, clearly defines AI having the capability of 100 million humans as a key milestone on the path to artificial...
Tuesday 23 June 2026
High-end fiberglass cloth supply tightens; shortages to persist through 2027

Demand for high-end fiberglass cloth is surging on the AI boom, and orders from copper-clad laminate (CCL) customers are leaving the...

Tuesday 23 June 2026
AI power systems drive snap-in capacitor demand; Chinsan gains from order spillover

Demand in the passive component market has rebounded alongside the rapid buildout of AI data centers. While Japanese suppliers continue...

Tuesday 23 June 2026
Wafer Works unveils golden triangle expansion to boost AI, optical, and SiC wafer capacity
Wafer Works announced after its June 18, 2026, shareholders meeting that it launched a "golden triangle" expansion plan to deepen silicon wafer product lines and support fast-growing...
Monday 22 June 2026
AI demolishes traditional tech: how NPUs and AI RAN are rewriting European infrastructure

AI is no longer a localized software novelty. It is now aggressively wiping out traditional hardware infrastructure across Europe....

Monday 22 June 2026
Intel CEO doubles down on advanced packaging with former SK Hynix chief's return
Former SK Hynix CEO Lee Seok-Hee is set to return to Intel as executive vice president (EVP) of Intel's foundry business, strengthening Intel's push into advanced packaging technologies...
Monday 22 June 2026
SK Hynix overtakes Samsung as HBM boom reshapes Korea's chip industry

SK Hynix briefly overtook Samsung Electronics on June 22 to claim the top spot by common-share market capitalization on South Korea's...