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    Intel Foundry targets optical communications with 12-inch InP technology
    9h 32min ago
    China’s RISC-V targets servers as XuanTie chip shipments exceed 6 billion
    9h 32min ago
    DAMO Academy expands into autonomous driving and robotics with XuanTie processors
    9h 32min ago
    Samsung Electro-Mechanics expands long-term contracts to package substrates
    9h 33min ago
    SDC advances MPO and inkjet-printed OLED in parallel
    9h 33min ago
    NEWS TAGGED CHIPS + COMPONENTS
    Monday 31 August 2026
    Gudeng chairman says trust underpins Taiwan supply chains amid Unimicron row
    Gudeng Precision Industrial chairman Bill Chiu said on August 31, 2026, that trust is the core foundation of Taiwan's place in the global supply chain, as he commented on sensitive...
    Monday 31 August 2026
    Unimicron stock prices fall 10% daily limit, says origin probe covers PCBs, not substrates

    Unimicron Technology shares plunged to Taiwan's 10% daily downside limit on August 31, the first trading session after prosecutors disclosed...

    Monday 31 August 2026
    Kingboard Laminates raises prices again as CCL shortages deepen
    Kingboard Laminates, a leading Chinese copper-clad laminate (CCL) maker, has issued another price increase notice as shortages of core materials such as fiberglass cloth and copper...
    Monday 31 August 2026
    MetaX posts first-half profit while China's AI GPU rivals split
    MetaX posted its first half-year profit since listing, with rising GPU shipments and the mass production of its C600 accelerator strengthening its commercial position while China's...
    Monday 31 August 2026
    CXMT's global DRAM push runs into US curbs

    ChangXin Memory Technologies (CXMT) is suing the Pentagon to overturn its designation as a Chinese military company as the Chinese DRAM...

    Monday 31 August 2026
    Shanghai's 15th Five-Year Plan bets on chips, AI, advanced packaging
    On August 26, the Shanghai municipal government released its 15th Five-Year Plan for the Development of Strategic Emerging Industries, setting a target for added value in strategic...
    Monday 31 August 2026
    South Korea risks 'HBM 2.0' trap in emerging CPO market
    Co-packaged optics (CPO) is emerging as a critical next-generation technology for AI infrastructure, but unless South Korea strengthens its integration and validation capabilities,...
    Monday 31 August 2026
    CXMT starts LPDDR6 mass production for Xiaomi 18 Fold, claiming global first
    China's CXMT has begun mass production of its LPDDR6 memory and will supply the first batch to Xiaomi's upcoming 18 Fold flagship, marking what the company says is the first commercial...
    Monday 31 August 2026
    China silicon wafers enter AI-led upcycle: prices rise, 12-inch capacity expands

    Hangzhou Lion Microelectronics plans to invest about CNY3 billion (approx. US$446 million) in a new 12-inch silicon wafer project in Jiaxing,...

    Monday 31 August 2026
    China's silicon wafer makers report profit gains of varying quality
    Seven Chinese silicon wafer producers reported first-half 2026 results in the second half of August, indicating an uneven sector recovery. Several semiconductor-grade wafer makers...
    Monday 31 August 2026
    Taisic Materials produces Taiwan's first 12-inch SiC boule with homegrown crystal growth furnace
    Taisic Materials, a subsidiary of Kenmec Mechanical Engineering, has successfully produced Taiwan's first 12-inch silicon carbide (SiC) boule using a crystal growth furnace independently...
    Monday 31 August 2026
    Weekly news roundup: US pressures Korea chip investment, MediaTek wins Google TPU, Apple debuts 2nm M6
    Semiconductor investment, AI chips, advanced packaging and data center infrastructure dominated the week, with South Korea facing US pressure, India scaling chip manufacturing, and...
    Monday 31 August 2026
    France draws Taiwanese investment projects worth EUR7.5 billion
    Taiwanese investment projects announced or under implementation in France are worth about EUR7.5 billion (approx. US$8.7 billion), according to the French Office in Taipei, led by...
    Monday 31 August 2026
    India roundup: India broadens semiconductor and AI ambitions across manufacturing, design, materials and data centers
    India's semiconductor ambitions are expanding from packaging and testing to chip design, materials, mobile devices and data centers. New investments by CG Power, Infineon, Foxconn,...
    Monday 31 August 2026
    Podcast highlights: Xiaomi's 3nm chip cap, HBM in Malaysia, and Nvidia's margin tradeoff
    Can Xiaomi's in-house chip reach 2nm? Is HBM rerouting to Malaysia TSMC giving Intel a pass? Can Nvidia hold a 75% gross margin or protect market share? Ahead of Apple's September...
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    Tuesday 20 October 2026
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    CES 2027 Welcomes First-Ever Chilean Global Pavilion
    Monday 19 October 2026
    GMIF2026: AI Inference Drives Token Factory and System Memory Rethinking