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    NEWS TAGGED CHIPS + COMPONENTS
    Thursday 25 June 2026
    IC design firms race to secure packaging capacity
    IC design firms are scrambling to expand their partner networks as tight packaging and testing capacity remain the most pressing bottleneck in the supply chain. Companies in Taiwan,...
    Thursday 25 June 2026
    Nvidia's Huang puts national security first as he touts an AI factory boom at the annual meeting
    At Nvidia's June 25 annual shareholder meeting, CEO Jensen Huang declared that national security "comes first" wherever it conflicts with commercial opportunity, pledging full compliance...
    Thursday 25 June 2026
    MediaTek, Google reportedly deepen ASIC ties as SerDes race hits 448G
    MediaTek is reportedly strengthening its partnership with Google in ASICs, a move that could increase the scale of future orders and carry implications for AI infrastructure worldwide...
    Thursday 25 June 2026
    Qualcomm integrates Dragonfly data center systems into expanded Hugging Face AI partnership
    Qualcomm Technologies is expanding its partnership with Hugging Face to bring open AI tools from devices to cloud infrastructure, a move that could affect developers and enterprises...
    Thursday 25 June 2026
    SK Hynix eyes record Nasdaq ADR to fund AI memory expansion

    SK Hynix said on June 24 its board approved a plan to issue new shares backing American Depositary Receipts on the Nasdaq Global Select...

    Thursday 25 June 2026
    OpenAI debuts Broadcom-designed, TSMC-built inference chip as model makers diversify silicon
    OpenAI on June 24 unveiled "Jalapeño," its first in-house AI accelerator, co-developed with Broadcom and manufactured by TSMC — the clearest sign yet that leading model...
    Thursday 25 June 2026
    Qualcomm pushes into data center chips with Dragonfly lineup and Meta deal, taking aim at Nvidia
    Qualcomm used its June 24 investor day to unveil a data center chip portfolio and a multi-generation CPU agreement with Meta, a strategic bid to diversify beyond a shrinking smartphone...
    Thursday 25 June 2026
    Micron forecasts stronger AI-driven growth as strategic agreements reshape memory market
    On June 24, Micron Technology reported record fiscal third-quarter results and issued a fourth-quarter forecast that significantly exceeded market expectations, reinforcing investor...
    Thursday 25 June 2026
    China wafer champion turns to US$1.6B overhaul to stop losses
    National Silicon Industry Group, China's leading 12-inch silicon wafer maker, has announced a CNY11.45 billion (US$1.6 billion) capital injection into its core subsidiary Shanghai...
    Thursday 25 June 2026
    Phison says NAND shortage has no end in sight as orders are booked into 2Q27

    Phison Electronics CEO Khein-seng Pua said the NAND flash market is facing a supply crunch with "no end in sight," as AI continues to...

    Thursday 25 June 2026
    Nvidia and AWS deepen push to simplify AI infrastructure at scale
    Nvidia and Amazon Web Services (AWS) are expanding tools that could make it easier for companies worldwide to build and run large-scale AI systems. The changes aim to improve speed,...
    Thursday 25 June 2026
    SK Group to meet Tesla and SpaceX leadership to pursue AI-infrastructure and memory partnerships
    SK Group chairman Chey Tae-won is planning to meet Tesla and SpaceX leadership in the US at the end of June 2026 to advance cooperation on next-generation AI infrastructure, memory...
    Thursday 25 June 2026
    Techzone builds circular economy to tap rising semiconductor expansion demand
    Techzone Technology Materials, a provider of one of Taiwan's few integrated waste treatment, renewable energy, and recycling solutions, is actively addressing the waste treatment demand...
    Wednesday 24 June 2026
    SK Hynix to issue US$29 billion in new shares for Nasdaq ADR listing on July 10
    SK Hynix disclosed in regulatory filings to South Korea's Financial Supervisory Service and the Korea Exchange on June 24 that its board has approved the issuance of new shares worth...
    Wednesday 24 June 2026
    Global market for advanced chip packaging set for rapid expansion
    The market for fan-out panel-level packaging(FOPLP) and glass substrate packaging is set to grow sharply as chipmakers race to support AI and high-performance computing. For global...
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    BIZ FOCUS
    Jul 30, 08:00
    EDOM Accelerates Edge AI Deployment with NVIDIA Technologies
    Monday 1 June 2026
    LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
    Thursday 30 July 2026
    ACCM Introduces Celeritas SMC: A Production-Ready, Silicon-Matched Core for Advanced Packaging
    Wednesday 29 July 2026
    Arrow Drives System-Level Design, Turning Complexity into Competitive Advantage
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