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NEWS TAGGED CHIPS + COMPONENTS
Tuesday 14 July 2026
iST June revenue rose as AI chip validation demand strengthened
Integrated Service Technology Inc. (iST) reported June 2026 consolidated revenue of about NT$426 million (US$13.24 million), up 10.47% from May and down 1.56% year on year. The Taiwan-based...
Tuesday 14 July 2026
Ion Electronic Materials posts 30% June revenue growth on advanced gas demand
Ion Electronic Materials reported June 2026 consolidated revenue of NT$51.852 million (US$1.61 million), up 30% from a year earlier, as demand for advanced gases continued to expand...
Tuesday 14 July 2026
Trusval sets record first-half revenue as AI factory demand pushes orders to 2027
Trusval Technology posted record revenue in the second quarter and first half of 2026, supported by demand tied to global AI infrastructure buildouts and continued expansion of advanced...
Tuesday 14 July 2026
Quartz component makers raise prices as material costs bite

Quartz component suppliers are raising prices as higher raw material costs from gold wire and ceramic bases squeeze margins. Industry...

Tuesday 14 July 2026
Tripod posts record second-quarter revenue as 2026 capex plan tops NT$10 billion
Tripod Technology said its business stayed strong in the first half of 2026, helping second-quarter revenue hit a new quarterly high. June sales still topped NT$8 billion (approx....
Tuesday 14 July 2026
TASC reshuffles management as PASC targets 2027 Taiwan Innovation Board listing
Taiwan-Asia Semiconductor (TASC) has announced senior management changes at its group companies as ProAsia Semiconductor (PASC) prepares for a Taiwan Innovation Board listing, now...
Tuesday 14 July 2026
Analysis: Why Meta's AI strategy sparked a market misread

Reports that Meta is considering leasing out idle AI computing capacity have rattled investors. But treating Meta's predicament as...

Tuesday 14 July 2026
China launches first 8-inch 2D chip line to bypass EUV limits

Shanghai AtomIC Technology has launched what it describes as the world's first 8-inch pilot line for two-dimensional semiconductors, marking...

Tuesday 14 July 2026
Samsung brings HBM, logic, and optics together in packaging push
Samsung Electronics is developing advanced packaging technology that combines high-bandwidth memory (HBM), logic chips and silicon photonics (SiPh) as it seeks to address the rising...
Tuesday 14 July 2026
Commentary: Forget AI chips — China's top science awards reveal what Beijing is actually building
China has nine years left to meet its goal of becoming a global science and technology powerhouse by 2035.
Tuesday 14 July 2026
Interview: UK's AI sovereignty pitch — research at home, scale with Taiwan

As the world enters an AI-centric era, the global race for technological leadership is no longer defined only by who can build the...

Monday 13 July 2026
SK Hynix shares plunge after blockbuster Nasdaq ADR debut

SK hynix shares suffered their steepest-ever decline on Monday, just one trading day after the memory chipmaker made a strong debut...

Monday 13 July 2026
Samsung develops glass interposer as TSMC expands packaging capacity

Samsung Electronics and Samsung Display are jointly developing a next-generation glass interposer that could lower the cost of packaging...

Monday 13 July 2026
Taiwan's auto parts makers pivot to high-tech as AI cooling, chip equipment demand surges

Taiwan's automotive parts makers are accelerating their transformation into high-tech suppliers as the global expansion of advanced...

Monday 13 July 2026
China Life commits US$700M to semiconductor fund under Beijing's patient capital strategy

China Life Insurance Company Limited plans to invest CNY4.999 billion (US$697 million) in a new CNY5 billion semiconductor private...