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Monday 22 June 2026
Soaring contract prices put memory's big three on course for blockbuster 2026 profits

The memory industry is entering a super cycle as prices keep soaring, with industry sources saying third-quarter 2026 contract price...

Monday 22 June 2026
TSMC glass substrate rollout unlikely before 2030

The race to commercialize glass core substrates in advanced semiconductor packaging is heating up — but the technology is moving...

Monday 22 June 2026
Groq CEO sees GPU and LPU as complementary as AI compute demand grows
Nvidia's planned US$20 billion strategic deal with Groq is built on a simple logic: as compute gets cheaper, demand keeps expanding. In a recent interview, Groq co-founder and CEO...
Monday 22 June 2026
Panjit upgrades hot swap tech to drive 2H26 growth
AI data centers are driving growth in demand for power management and power semiconductor components. Hot swap products, in particular, require a wide safe operating area (SOA) to...
Monday 22 June 2026
Global suppliers race accelerates: TSMC's first CoPoS demo tools enter validation
TSMC is accelerating its CoPoS rollout, replacing traditional round wafers with larger rectangular glass panels to support packaging demand for AI GPUs and HPC chips over the next...
Monday 22 June 2026
Memory costs push Samsung Galaxy A37 pricier as S26 holds steady

AI-driven memory price spikes are presenting a challenge for Samsung's smartphone business, with rising component prices eroding the...

Monday 22 June 2026
Toto reportedly bets bigger on semiconductor materials as AI pushes industry toward 1nm era

Japanese bathroom fixture maker Toto is deepening its commitment to the semiconductor industry, unveiling plans to invest JPY80 billion...

Monday 22 June 2026
YMTC NAND share rises to 13%, alarming South Korean rivals
China's memory makers are moving from technology catch-up to capital-market expansion, with ChangXin Memory Technologies' (CXMT) parent and Yangtze Memory Technology (YMTC) both preparing...
Monday 22 June 2026
Intel-Nvidia co-developed PC processor to reportedly debut at CES 2028

According to an exclusive report by VideoCardz, Intel's first x86 system-on-chip (SoC) integrating an Nvidia RTX GPU has been...

Monday 22 June 2026
Samsung sees ongoing SoC losses drag down System LSI's 2026 performance
In a rare public admission during an internal briefing, Park Yong-In, president of the System LSI Business of the Device Solutions (DS) Division at Samsung Electronics, expressed concern...
Monday 22 June 2026
Weekly news roundup: Micron CEO turns visa rejection into US$1 trillion milestone; Taiwan LED makers look beyond lighting
Below are the most-read DIGITIMES Asia stories from the week of June 15-21, 2026:
Monday 22 June 2026
MSScorps expands Taiwan investment again for silicon photonics

Taiwan's investment office, InvesTaiwan, under the Ministry of Economic Affairs, has approved expanded Taiwan investment plans from...

Monday 22 June 2026
Ma-tek ramps silicon photonics testing investment with first system due in August

Semiconductor testing and analysis service provider Ma-tek held its annual shareholders' meeting on June 18. Chairperson Yong-Fen Hsieh...

Monday 22 June 2026
Tongtai expands aerospace, AI and semiconductor push under new board

Taiwan-based Tongtai Machine & Tool is accelerating its transformation toward high-value manufacturing, leveraging growing opportunities...

Monday 22 June 2026
FineMat pivots beyond metal masks with AI cooling, semiconductor, and drone push
Amid growing localization efforts across China's supply chain, FineMat Applied Materials has seen its metal mask business continue to shrink and is accelerating its transition into...