CONNECT WITH US
NEWS TAGGED CHIPS + COMPONENTS
Friday 31 October 2025
China's CXMT cracks LPDDR5X speed barrier, posing a new test for Samsung and SK Hynix

Chinese memory maker ChangXin Memory Technologies (CXMT) has started mass production of LPDDR5X DRAM, marking a milestone in China's...

Friday 31 October 2025
AMD ties pay off: Tongfu Microelectronics reaps AI-driven profit surge
Tongfu Microelectronics, a leading Chinese semiconductor packaging and testing firm, posted record revenue and profit in the third quarter of 2025. Revenue for the first three quarters...
Friday 31 October 2025
Elan Microelectronics advances AI strategy with new smart campus, expanding product lines
Elan Microelectronics has marked the progress of its new AI smart campus headquarters in Zhubei with a topping-off ceremony. The facility, slated for completion in 2026 and official...
Friday 31 October 2025
ASE's advanced packaging and testing revenue to rise by US$1 billion in 2026
Leading semiconductor packaging and testing company ASE expects that fourth quarter revenue in NTD will grow 1-2% quarter-over-quarter, while semiconductor assembly and test materials...
Friday 31 October 2025
Shennan Circuits and China’s PCB sector gear up for the space economy

As China accelerates its ambitions in low-Earth-orbit (LEO) communications, the country's push for homegrown satellite technology is...

Friday 31 October 2025
Onsemi introduces vertical GaN semiconductors for AI and electrification applications
Onsemi has unveiled vertical gallium nitride (vGaN) power semiconductors built on GaN-on-GaN technology, targeting applications in AI data centers, electric vehicles (EVs), renewable...
Friday 31 October 2025
STM cuts 2025 capex on sluggish demand recovery for automotive and industrial chips
STMicroelectronics (STM) has projected fourth-quarter 2025 revenue below market expectations and trimmed its capital expenditure plan for the year, signaling a weaker-than-anticipated...
Friday 31 October 2025
Skyworks–Qorvo merger creates RF chip powerhouse, pressuring Asian rivals
US RF chipmaker Skyworks Solutions plans to acquire its domestic rival Qorvo in a cash-and-stock deal worth US$22 billion, forming one of the largest mergers in the RF semiconductor...
Friday 31 October 2025
ASE posts 11-quarter profit high on advanced packaging, stable FX in 3Q25
ASE, a leader in semiconductor assembly and testing, reported stronger-than-expected overall operations in the third quarter of 2025, driven by growth in advanced packaging fueled...
Friday 31 October 2025
TSMC's profit engines: Nvidia and Apple orders exceed 40% of revenue
TSMC has secured a record-breaking performance for 2025, with profits reaching NT$1.21 trillion (approx. US$39.4 billion) in the first three quarters, already surpassing full-year...
Friday 31 October 2025
MCU maker Holtek rebounds strongly, riding security and health momentum into 2026
Taiwan's microcontroller unit (MCU) designer Holtek Semiconductor posted consolidated revenue of NT$754 million (US$24.53 million) for the third quarter of 2025, up 10% from a year...
Friday 31 October 2025
SK Hynix dominates DRAM market in 3Q25 for third consecutive quarter
SK Hynix has taken the top spot of the global DRAM market for the third quarter of 2025 with a 35% market share, with Samsung just behind at 34%. This marks SK Hynix's third consecutive...
Friday 31 October 2025
CWTC sees stable 4Q25 operations as IC and LED leadframe price hikes take effect
Chang Wah Technology Co., Ltd. (CWTC), a leading Taiwanese IC leadframe manufacturer, held its fourth-quarter 2025 earnings call on October 30, 2025, during which the company projected...
Friday 31 October 2025
CHPT eyes 2026 US orders amid slight 4Q25 revenue dip
Chunghwa Precision Test Tech (CHPT) expects a mild seasonal decline in overall operations for the fourth quarter of 2025, with revenues dipping slightly from the third quarter of...
Friday 31 October 2025
UMC and Samsung present advanced packaging trends at APDC 2025
STATS ChipPAC held the Advanced Packaging Developer Conference 2025 (APDC 2025) at Resorts World Sentosa Convention Center in Singapore to explore the future of semiconductor packaging...