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    China launches state-owned data group as market-facing arm of its AI infrastructure push
    3min ago
    PCB material shortages persist as capacity expansion extends beyond 2029
    13min ago
    Taiwan PCB output set to top NT$1 trillion as VP touts AI opportunity
    31min ago
    NEWS TAGGED CHIPS + COMPONENTS
    Tuesday 29 September 2026
    SoftBank subsidiary Saimemory taps Shinko to bring ZAM closer to commercialization
    Saimemory, a SoftBank subsidiary, has brought Shinko Electric Industries into its effort to commercialize Z-Angle Memory (ZAM), adding packaging-substrate, high-density integration...
    Tuesday 29 September 2026
    In global semiconductor race, Singapore bets on critical, mature technologies
    Amid the ongoing restructuring of the global semiconductor supply chain, Singapore is focusing on advanced packaging, heterogeneous integration, silicon photonics, and optical interconnects,...
    Tuesday 29 September 2026
    Samsung reshuffles DRAM roadmap, prioritizing B1b hybrid bonding for D0a, HBM5
    Samsung Electronics is reshaping its next-generation dynamic random-access memory (DRAM) roadmap, elevating its B1b wafer-to-wafer (W2W) hybrid bonding technology from a project-specific...
    Tuesday 29 September 2026
    Column: Why Micron's US$250M venture fund is about more than HBM margins—Taiwan has a stake in it
    Micron unveiled the Micron Ventures Paradigm Fund, a US$250 million venture vehicle, in mid-August 2026, as the memory maker pairs more than US$25 billion in fiscal 2026 capex with...
    Tuesday 29 September 2026
    South Korea AI compute squeeze hits researchers and startups
    South Korea's AI sector is facing a growing GPU shortage as research institutes and small companies struggle to secure enough compute for model training and deployment. As government...
    Tuesday 29 September 2026
    AI boom sends China and Taiwan's PCB makers racing to HK for capital
    Global investment in AI infrastructure is expanding rapidly, driving specification upgrades across the supply chain, from AI servers to high-speed optical modules, and pushing printed...
    Tuesday 29 September 2026
    Samsung Foundry nears 60% 2nm yield, shifts focus to power efficiency to win customers
    Samsung Electronics' foundry business has reportedly raised yield on its 2-nanometer (2nm) SF2 process to nearly 60% and is now shifting engineering work toward power efficiency and...
    Tuesday 29 September 2026
    Solidigm weighs US IPO as AI storage demand lifts valuation
    SK Hynix's US-based NAND flash and solid-state drive (SSD) subsidiary, Solidigm, is considering a US initial public offering as early as 2027, with reports indicating a potential valuation...
    Tuesday 29 September 2026
    Samsung Electro-Mechanics to invest US$5 billion in ABF substrate expansion
    Samsung Electro-Mechanics said it will invest KRW6.78 trillion (about US$5 billion) in South Korea and Vietnam to expand ABF substrate production for AI servers and high-performance...
    Tuesday 29 September 2026
    US, China eye US$60 billion in tariff relief, but chips stay off the table
    The US and China are moving toward tariff reductions on about US$60 billion of bilateral trade following last week's Trump-Xi summit, but semiconductors and other strategically sensitive...
    Tuesday 29 September 2026
    Advanced packaging shifts toward system integration as AI renews semiconductor talent appeal

    At Singapore's Innovate Together 2026 conference on September 25, executives and researchers from A*STAR's Institute of Microelectronics...

    Tuesday 29 September 2026
    Beyond 16 layers: HBM stacks test advanced packaging equipment makers
    At Singapore's Innovate Together 2026 conference on September 25, equipment makers including ASM, ASMPT, and KLA said the challenges facing next-generation advanced packaging are expanding...
    Tuesday 29 September 2026
    Samsung bonus plan to lift South Korea talent race

    Samsung Electronics' Device Solutions division is set to announce the calculation and payout rules for its special management performance...

    Tuesday 29 September 2026
    GlobalFoundries eyes GaN expansion to challenge TSMC in AI

    GlobalFoundries (GF) is preparing a major global capacity expansion as TSMC is set to gradually exit gallium nitride (GaN) foundry services...

    Tuesday 29 September 2026
    SK Hynix tests HBM5 with TSMC as HBM4 enters Nvidia's next platform

    SK Hynix has validated its HBM5 memory with TSMC's CoWoS packaging, the company said in a September 28 post on its corporate newsroom...

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    BIZ FOCUS
    Oct 21, 08:00
    Starting with Data Challenges: TS Holdings Explores AI Through Hackathon
    Tuesday 20 October 2026
    CHT Leverages Hackathon to Cultivate AI Solutions for Urban Governance
    Tuesday 20 October 2026
    Cincoze's EMC Solution Boosts Equipment Stability and Production Efficiency
    Tuesday 20 October 2026
    CES 2027 Welcomes First-Ever Chilean Global Pavilion