Taiwan-based LED backlight module supplier Radiant Opto-Electronics and light guide plate maker Global Lighting Technologies (GLT) are building new production capacities in Vietnam...
As GPUs become essential components for artificial intelligence (AI) computing, orders for Nvidia GPUs are also garnering attention. Recently, there have been reports that Nvidia...
DDR5 memory has recently shown a modest increase, indicating that the market price is about to enter the stage of recovering from its lowest point, according to industry sources.
BYD is set to expand its silicon carbide (SiC) epitaxy capacity by 50% in 2023 and has already begun installing equipment with the production lines to be fully completed by September...
As the number of large datacenters operated by hyperscale providers approaches 900, new data from Synergy Research Group shows that they now account for 37% of the worldwide capacity...
After peaking near US$21 billion of revenue in 2017, the market for capital equipment used to manufacture OLEDs and LCD panels has suffered from continuous annual declines as the...
TSMC has stepped up its pace of orders with backend equipment suppliers, as the foundry commences its chip-on-wafer-on-substrate (CoWoS) packaging capacity expansion plan, according...
Rohm recently announced plans to acquire a plant owned by Solar Frontier in Japan for expanding production capacity for silicon carbide (SiC) power devices.
Tai-Tech Advanced Electronics, a power inductor specialist, recently announced plans to establish a new plant in Johor Bahru, Malaysia for the production of automotive electronics...
System vendors are seeking capacity support from IC analysis laboratories for 2024 through their contracted IP service providers, as they foresee high demand for advanced packaging,...
Samsung Electronics will invest KRW1 trillion (approx. US$766 million) to expand its high bandwidth memory (HBM) production capacity. Sources believe that Samsung's investments are...
One of AMD CEO Lisa Su's priorities for her planned mid-July visit to Taiwan will be securing TSMC's available CoWoS packaging capacity, according to sources with knowledge of the...
European IDMs differ slightly from their US counterparts in terms of manufacturing capacity deployments, focusing more on expanding wafer fab capacity than backend packaging and testing...
IC verification lab Materials Analysis Technology (MA-tek) plans to allocate NT$1.2 billion (US$38.6 million) in capital expenditures for 2023, of which nearly 80% will be used to...
Due to the bandwidth limitations of DDR SDRAM in high-speed computation, high bandwidth memory (HBM) is rapidly gaining popularity as a means to circumvent memory transmission speed...
