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Thursday 29 June 2023
GIS sees capacity utilization rate improving
Touch solution provider General Interface Solution (GIS) is expected to see its capacity utilization rate improve in the second half of 2023, keeping its gross margin positive, according...
Wednesday 28 June 2023
Samsung details plans for 2nm mass production
Samsung Electronics made several announcements during the recent annual Samsung Foundry Forum (SFF).
Tuesday 27 June 2023
Eternal Materials mulls capacity expansion in Malaysia
Eternal Materials, dedicated to supplying resins, electronics materials including PCB-use dry film photoresists, and specialty materials, plans to expand its production capacity outside...
Tuesday 27 June 2023
PlayNitride to boost chip-on-carrier capacity
LED chipmaker PlayNitride will exponentially boost its chip-on-carrier production capacity for microLED displays between the end of 2023 and 2024, according to company sources.
Monday 26 June 2023
WinWay expects new capacity to ready to serve customers in 2 years; see growing orders for AI applications
Taiwan-based IC test interface specialist WinWay, who has been engaged in serving HPC customers, is expected to see its capacity from two new plants in Taiwan ready in two years to...
Monday 26 June 2023
TSMC to build new CoWoS capacity in central Taiwan
TSMC has readied plans to build new CoWoS (Chip on Wafer on Substrate) capacity at its manufacturing complex in the Central Taiwan Science Park (CTSP) to meet a rapid surge in demand...
Monday 26 June 2023
European Chips Act yet to entice Samsung
Upon implementation of the European Chips Act, TSMC and Intel are enticed to make substantial investments in Europe, whereas Samsung Electronics maintains a wait-and-see attitude...
Monday 26 June 2023
Oppo chip design failure casts shade over Chinese brand firms' chip pursuit
Oppo's IC design team, Zeku, abruptly ceased operations, shocking the semiconductor industry. There are rumors that, with the exception of Oppo's top executives, the Zeku team did...
Tuesday 20 June 2023
Packaging capacity expansions to shore up IC leadframe demand
IC leadframe demand is expected to grow sharply in the next several years, as a result of expansions of packaging capacity. Texas Instruments (TI), for example, has recently announced...
Monday 19 June 2023
Intel plans assembly and test facility in Poland
Intel has chosen a location near Wrocaw, Poland, for a new semiconductor assembly and testing facility, according to the company. This facility will help the company satisfy a crucial...
Friday 16 June 2023
Wistron steps up global manufacturing deployments
Wistron will be aggressively advancing its worldwide manufacturing deployments in response to geopolitical shifts, according to Simon Lin, chairman for the Taiwan-based ODM company...
Friday 16 June 2023
Ardentec keeps capacity utilization at 80%
IC testing house Ardentec has maintained its factory utilization rates at approximately 80%, thanks to its entry into the supply chains of major international IDM and fabless US power...
Friday 16 June 2023
Pegatron to see automotive account for 10% of 2024 revenue
Pegatron has increased its offerings and production capacity for automotive products, and expects the business to account for at least 10% of its revenue by 2024.
Tuesday 13 June 2023
Taiwan OSATs see slight recovery in capacity utilization
Taiwanese OSATs such as ASE Technology, Powertech Technology (PTI), and King Yuan Electronics (KYEC) have experienced modest increases in capacity utilization, with their second-...
Monday 12 June 2023
Team Group and Phison stay cautious with 2H23 memory demand
Despite some market observers' optimism about the recovery of the memory market in the second half of 2023, Taiwan-based memory module maker Team Group and NAND controller chip maker...