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Monday 2 February 2026
Semco's Tianjin MLCC plant capacity runs flat out on EV, AI server expansion
Rising automotive electronics demand has pushed Samsung Electro-Mechanics (Semco)'s Tianjin plant to full capacity across its multilayer ceramic capacitor (MLCC) production lines,...
Monday 2 February 2026
Kioxia targets data center NAND as rivals chase HBM
Kioxia Holdings sees an opportunity to expand its presence in high-density storage for AI data centers as rivals direct resources to other segments. The company's incoming president...
Monday 2 February 2026
ASE ramps advanced packaging in Taiwan as SPIL scales central hub
ASE Technology Holding is accelerating capacity expansion across multiple locations to meet rising demand for advanced packaging and testing services, with projects underway in northern,...
Monday 2 February 2026
Taiwan PCB makers vie for AI server market with new 2026 capacity
As demand for AI infrastructure continues to grow steadily, major networking and server PCB suppliers such as Gold Circuit Electronics (GCE), First Hi-tec (FHt), and Allied Circuit...
Monday 2 February 2026
TSMC revises five-year growth plan, turning tech lead into high profits
TSMC chairman C.C. Wei recently confirmed that AI demand is real and the trend will remain unchanged in the coming years. AI accelerators accounted for a "high double-digit" percentage...
Monday 2 February 2026
Sanctioned YMTC fast-tracks Wuhan Phase III NAND fab for early 2H26 mass production
China's YMTC is fast-tracking construction of its Wuhan Phase III NAND flash fab, bringing its mass production target forward to the second half of 2026, roughly a year ahead of the...
Monday 2 February 2026
National Aerospace Fasteners begins phase two expansion in Malaysia, targets 1H28 operation with smart manufacturing
Taiwan-based National Aerospace Fasteners Corporation (Nafco) held a groundbreaking ceremony on January 30, 2025, for its second-phase expansion at its production base in Malaysia...
Monday 2 February 2026
Weekly news roundup: Diversification, memory power, capacity politics
Below are the most-read DIGITIMES stories from the week of January 16 – February 1, 2026.
Monday 2 February 2026
Nvidia CEO projects TSMC capacity to double, warns of memory shortage, reaffirms OpenAI investment during Taiwan visit
Nvidia chief executive Jensen Huang, on February 1, 2026, underscored Taiwan's central role in the global artificial intelligence supply chain, saying the company "would not be possible...
Monday 2 February 2026
Micron ramps global memory investments as Nvidia prepares HBM4 rollout

As Nvidia prepares to adopt its sixth-generation HBM4, Micron has taken a quieter approach to supply timelines compared with Samsung Electronics...

Sunday 1 February 2026
LMOC ramps silicon photonics output with new MOCVD expansion plan
LandMark Optoelectronics Corporation (LMOC) reported strong fourth-quarter 2025 performance, driven by a sharp ramp in silicon photonics (SiPh) shipments, with all three profitability...
Saturday 31 January 2026
Nvidia CEO tells TSMC to "work harder" as 2026 demand surges; reveals 10-year capacity doubling plan

Nvidia CEO Jensen Huang hosted a high-profile banquet in Taipei on January 31, 2026, for the leaders of Taiwan's semiconductor ecosystem.

Saturday 31 January 2026
Intel signals return to memory with new DRAM bonding research
In early 2026, a research update published by Sandia National Laboratories (SNL), part of the US Department of Energy, sparked industry discussions about whether Intel is poised to...
Saturday 31 January 2026
Century Group secures over NT$100 billion in wind power orders
The draft rules for vendor selection in offshore wind power Phase 3-3 have, for the first time, removed localization requirements. However, this has not slowed investment in Taiwan...
Friday 30 January 2026
ASML gains from rising EUV demand and US chip spending
After TSMC chairman C.C. Wei said on a recent earnings call that AI demand is real and that AI is becoming embedded in daily life as a long-term trend, expectations for ASML's performance...