Solar cell and PV module maker TSEC on August 28 announced to have obtained NT$3 billion (US$93.3 million) worth of orders for PV modules that will be established on fish farms in...

With major CSPs aggressively building AI servers and pushing up demand for AI processors and HBM memory, global advanced packaging capacity is predicted to expand by 30–40%...

Taiwan-based Alchip Technologies, dedicated to supplying ASICs, has raised its revenue forecast for 2023 from US$800 million to between US$900 million and US$950 million.

The importance of advanced packaging to the continuation of Moore's Law has already attracted TSMC and Intel to the field.

PCB manufacturer Dynamic Electronics expects to post flat or slight revenue growth in the second half of this year compared to the first, with a higher gross margin thanks to improved...

Recently, Intel and TSMC have both solidified their latest process technology advancements and future global production plans. In 2024, Intel officially initiated its internal reorganization...

IC distributor WPG has reported operating profits increased 27% sequentially to NT$2.47 billion (US$77.2 million) in the second quarter, with net profits jumping over 200% on quarter...

HDI PCB manufacturer Compeq Manufacturing anticipates a significant sequential growth in third-quarter revenue. The company saw its July revenue hit an eight-month high of NT$6.03...

To meet robust customer demand for AI servers, Quanta Computer's board of directors recently greenlighted capacity expansions at its production bases in the US and Germany, which...

Amkor Technology is ramping up its capacity for advanced packaging production, with monthly output for 2.5D packaging expected to reach 5,000 wafers in the first half of 2024, up...

SK Hynix has showcased its 321-layer 4D NAND samples, demonstrating the company's progress in creating the first NAND with more than 300 layers.

TSMC has announced that it will invest alongside Robert Bosch, Infineon Technologies, and NXP Semiconductors in European Semiconductor Manufacturing Company (ESMC) in Dresden, Germany...

Micron Technology has announced sample availability of its CZ120 memory expansion modules to customers and partners.

The 30–40% reduction in output at Winbond Electronics' wafer fab in Taichung (central Taiwan) has been reduced to less than 20%, and the memory chipmaker plans to begin installing...

AMD CEO Lisa Su's Asia tour in July to secure its supply chain became the focal point for analysts during the company's 2Q23 financial earnings call. In particular, discussions on...