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NEWS TAGGED ASE
Thursday 1 July 2021
Skyworks to increase outsourcing for PA orders from China
Skyworks will be stepping up its RF power amplifier (PA) production outsourcing to Taiwanese partners to fulfill orders placed by China-based smartphone vendors, while providing its...
Monday 28 June 2021
Backend demand for HPC chips strong, but ABF substrate support matters
Taiwan's OSATs, now sustaining full capacity utilization for wire-bonding process for lower-end logic chips, are embracing strong backend demand for diverse HPC chips, but their actual...
Monday 28 June 2021
Taiwan IC design houses to hike prices in 2H21
Taiwan-based IC design houses have notified their customers about price hikes in the second half of 2021 to reflect rising manufacturing costs, according to industry sources.
Thursday 24 June 2021
Taiwan OSATs see car ICs demand promising for next 3-4 years
Taiwan-based OSATs and chip probing service providers are upbeat about backend demand for automotive chips over the next three to four years, as international IDMs such as Renesas...
Thursday 24 June 2021
New Apple Watch reportedly to adopt double-sided SiP for PMICs
The upcoming Apple Watch series reportedly will massively adopt double-sided SiP packaging for power management ICs, with ASE Technology as the main backend partner, according to...
Tuesday 15 June 2021
Malaysia lockdown may affect capacity sufficiency at IDMs
The ongoing lockdown in Malaysia is posing new variables to capacity deployments at many international automotive IDMs, further fueling competitions between ICT and auto makers for...
Friday 11 June 2021
ASE Technology posts record revenues for May
ASE Technology has reported revenue grew 2.3% sequentially and about 18% on year to NT$42.27 billion (US$1.53 billion) in May 2021, a record high for the same month, and its January-May...
Wednesday 9 June 2021
OSATs to log full wire-bonding capacity utilization throughout 2021
Taiwan backend houses have seen clear order visibility for wire-bonding packaging services for notebook- and PC-use peripheral chips throughout 2021, while continuing to embrace strong...
Tuesday 8 June 2021
Taiwan backend capacity tightens further on COVID cluster infections
Taiwan's backend capacity supply is being further constrained by COVID cluster infections at some OSATs including King Yuan Electronics (KYEC) and Greatek Electronics.
Monday 7 June 2021
Taiwan backend houses caught in cluster COVID infections
Taiwan's major dedicated IC testing house King Yuan Electronics (KYEC) has been ordered by the Central Epidemic Command Center (CECC) to have all its migrant workers undergo a 14-day...
Friday 28 May 2021
Chipmakers striving to obtain stable aQFN leadframe supply
Chipmakers including MediaTek, Qualcomm and Realtek Semiconductor are striving to secure stable supply of leadframes for use in aQFN packaging, with related leadframe suppliers already...
Tuesday 25 May 2021
ASE promotes embedded die packaging for automotive electronics
Backend house ASE Technology will have its in-house developed embedded die technology, dubbed "Advanced Embedded Active System Integration (aEASI)," mainly applied to processing automotive...
Tuesday 25 May 2021
Taiwan testing houses gearing up for AiP, 3nm chips
Taiwan-based IC testing houses including King Yuan Electronics (KYEC), Sigurd Microelectronics and Ardentec have all kicked off R&D for more advanced 3nm-made chips, while also...
Monday 24 May 2021
OSATs may further hike service quotes in 3Q21
Taiwan OASTs are expected to enforce a new round of quote hikes in the third quarter of the year to reflect ever-rising prices for raw materials particularly for QFN wire-bonding...
Friday 21 May 2021
Backend houses gearing up for new orders from Qualcomm
Taiwan's leading OSAT ASE Technology and its affiliate Siliconware Precision Industries (SPIL) reportedly will offer backend services for Qualcomm's newly-released Snapdragon 778G...