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NEWS TAGGED ASE GROUP
Wednesday 4 October 2023
ASE intros integrated design ecosystem for advanced packaging
Advanced Semiconductor Engineering (ASE), a member of ASE Technology Holding, has announced the launch of its integrated design ecosystem (IDE), a collaborative design toolset optimized...
Tuesday 26 September 2023
Miniaturization trend for Wi-Fi modules remains unchanged; packaging testing suppliers rely on SiP
Taiwanese OSAT providers stated that the trend of connectivity in everything will continue in 2024, and it will be combined with trends such as cloud AI, edge computing, and high-speed...
Tuesday 26 September 2023
OSATs gearing up for heterogeneous integration boom in 2024
OSATs are bracing for a surge in demand for heterogeneous integration, which will necessitate CoWoS, silicon photonics (SiPh), and other new technologies in 2024, according to industry...
Wednesday 20 September 2023
Taiwan OSATs step up SiPh deployment
Taiwan-based OSATs, such as ASE Technology and Winstek Semiconductor, have stepped up their silicon photonics (SiPh) deployments and are evaluating its potential in furthering advanced...
Tuesday 19 September 2023
AI boom sparks silicon photonics applications
Silicon photonics technology was hotly discussed during the SEMICON Taiwan 2023. At the Silicon Photonics Global Summit held September 5 alongside the exhibition, I was invited to...
Thursday 14 September 2023
ASE, USI manufacture S9 SiP for new Apple Watch
The new S9 system-in-package (SiP) that powers the just-unveiled Apple Watch is manufactured by Advanced Semiconductor Engineering (ASE) and Universal Scientific Industrial (USI),...
Wednesday 13 September 2023
IC backend houses to see demand recovery in 2024
Taiwan-based IC backend houses have witnessed an improvement in their sales performance during the third quarter. However, it is anticipated that a significant rebound in demand may...
Wednesday 13 September 2023
Apple's competitors conservative about 2024 handset market, say OSATs
Apple's competitors in the handset market are making conservative production plans for next year, as they have yet to see a clear picture of 2024, according to sources at OSATs.
Monday 11 September 2023
3D chiplets to steer the next advanced packaging trend
Advanced packaging and testing have become the hottest topics in the semiconductor industry in 2023, with TSMC's CoWoS packaging technology experiencing extremely high demand due...
Thursday 7 September 2023
ASE subsidiary USI sees Poland as first step of EMEA strategy
The 2023 EU-Taiwan Investment Partnership Forum on Semiconductor Clusters, taking place on Sep. 7 on the sidelines of SEMICON Taiwan, saw new dynamics injected following the passage...
Monday 4 September 2023
USI launches AI-based modular edge computing solution
The explosive growth of global network data driven by both cloud AI and edge AI brings significant challenges to the existing cloud infrastructure and edge computing architecture...
Wednesday 30 August 2023
ASE reportedly pursuing CoW certification
OSAT ASE Technology reportedly is seeking to secure chip-on-wafer (CoW) packaging certification from Nvidia for its Kaohsiung plant in southern Taiwan, according to industry source...
Friday 25 August 2023
ASE, KYEC brace for revenue decreases in 2023
OSATs ASE Technology and King Yuan Electronics (KYEC), both of which reportedly are in the supply chain for Nvidia's AI chips, are likely to experience revenue declines in 2023 despite...
Thursday 24 August 2023
Chinese OSATs cut prices further
Chinese OSATs with support from government subsidies have reduced their prices further in an effort to secure more orders, whereas first-tier semiconductor backend services providers...
Monday 21 August 2023
Handset chip backend houses pin hopes on new iPhones to bolster basic shipments in 2H23
Taiwan's mobile phone chips backend supply chain players have recently expressed pessimism about the handset application market outlook. Major OSATs ASE Technology and King Yuan Electronics,...