AI-driven demand has propelled TSMC's revenue growth in the latter half of 2024. As advanced packaging margins approach those of chip manufacturing, traditional OSAT providers face...
Advanced Semiconductor Engineering (ASE) is intensifying its development in the advanced packaging sector by establishing the new K28 plant in Kaohsiung, southern Taiwan. A groundbreaking...
Leading IC packaging and testing company, ASE, has been consistently highlighting silicon photonics (SiPh) as a future trend since the latter half of 2023. CEO Dr. Tien Wu stated...
The semiconductor industry has entered its golden era, necessitating collaboration across the supply chain to overcome bottlenecks, according to Tien Wu, COO for OSAT ASE Technology...
Taiwan-based OSAT, ASE, signed a tentative contract with the government of Kitakyushu in Kyushu, Japan, to buy land in Kitakyushu's Wakamatsu-ku where they would attempt to expand...
The global expansion of semiconductor advanced packaging capacity is just beginning, which is promising enormous business opportunities for equipment suppliers, such as the G2C+ alliance...
Infineon Technologies has completed the sale of its two backend manufacturing sites, one in Cavite, Philippines, and one in Cheonan, South Korea, to two fully owned subsidiaries of...
ASE Technology Holding (ASEH) plans to follow in TSMC's footsteps by establishing an advanced packaging fab in Kyushu, Japan, according to industry sources.
Semiconductor backend services providers generally believe sales will improve in the second half of 2024, but the strength of the growth momentum remains to be seen.
OSAT ASE Technology Holding (ASEH) has stated its enthusiasm for "Foundry 2.0," a novel concept that is designed to transform the foundry industry, which was recently announced by...
The shortage of talent in the semiconductor industry is no longer news. Still, the continuous growth in demand for advanced packaging has triggered a mid-to-long-term scarcity of...
Glass substrates have become a critical strategic element in fan-out panel level packaging (FOPLP), a technology that TSMC and various backend houses are developing. Because of that,...
OSATs have in recent years stepped up their capital expenditures and are actively implementing high-end packaging technology and chip heterogeneous integration, according to industry...
