ISE Labs, a subsidiary of ASE that provides one-stop semiconductor engineering services, has announced the expansion of its world-class capabilities with the launch of a second US...
Senior executives from key manufacturers, including ASE Technology Holding and Taiwan Semiconductor Manufacturing Company (TSMC), gathered at a summit forum on July 9 to discuss their...
Taiwan's major outsourced semiconductor assembly and test (OSAT) service providers, including ASE Group, Powertech Technology, King Yuan Electronics (KYEC), and Sigurd Microelectronics,...
Advanced packaging for Silicon Photonics (SiPh) and Co-Packaged Optics (CPO) has emerged as an additional forward-thinking trend, following CoWoS, InFO, and SoIC.
ASE Holdings (ASEH) has stepped up production expansion for advanced packaging and does not rule out establishing additional facilities in Japan, the US, or Mexico, according to company...
ASE CEO Tien Wu said at the company's 2024 shareholder meeting on June 26 that the semiconductor industry will have better performance in the second half of 2024, thanks to the demand...
ASE Technology Holding (ASEH) recently announced that its subsidiary Advanced Semiconductor Engineering (ASE) will collaborate with Hung Ching Development & Construction to build...
In recent years, Fan-Out Panel-Level Packaging (FOPLP) technology has become a rare opportunity for OSATs and other industry participants to compete with TSMC, Samsung Electronics,...
The rapid growth of Artificial Intelligence (AI) and High-Performance Computing (HPC) is driving an urgent need for performance while grappling with high energy consumption.
