As Moore's Law approaches physical and commercial limits, advanced packaging has surged as a new battleground in the semiconductor industry. TSMC not only leads globally with its CoWoS...

Hanwha Semitech is stepping up its push into Taiwan's semiconductor supply chain, holding closed-door talks with Foxconn and ASE Holdings at SEMICON Taiwan 2025, according to South...

Fan-out panel-level packaging (FOPLP) is poised to become the next-generation advanced packaging technology, driving industry competition and research investment. Leading outsourced...

To break through the technical, mass production, and yield challenges in advanced packaging processes such as 3D IC and CoWoS, SEMI, together with TSMC and ASE Holdings, has established...

As SEMICON Taiwan 2025 nears, ASE Technology's COO Tien Wu highlighted the semiconductor industry's decade-long outlook, stressing challenges in reshaping the value chain in the post-AI...

ASE Technology Holdings, a leading global semiconductor assembly and testing company, will invest approximately NT$6.5 billion (US$217 million) to purchase a factory and related facilities...